RTAX4000DL-1CQ352B vs RTAX4000SL-CQ352E Vergleich
Detaillierter Direktvergleich von RTAX4000DL-1CQ352B von Microchip Technology und RTAX4000SL-CQ352E von Microsemi. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
RTAX4000DL-1CQ352B - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000DL-1CQ352B ✓ AktivMicrosemi
RTAX4000SL-CQ352E - 4M-Gate Rad-Tolerant FPGA, 352-CQFP | Microchip
RTAX4000SL-CQ352E ✓ AktivSpezifikationsvergleich
| Parameter | RTAX4000DL-1CQ352B | RTAX4000SL-CQ352E |
|---|---|---|
| Marke | Microchip Technology | Microsemi |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $2.620,00 |
| Equivalent Gates | 4,000,000 gates | — |
| Logic Cells | 55,440 | — |
| CLB Organization | 36,960 CLBs | — |
| Inputs | 166 | — |
| Outputs | 166 | — |
| Versorgungsspannung | 1.5 V nominal | — |
| Betriebstemperatur | -55C to +125C | -55C to +125C |
| Technology | CMOS, antifuse, one-time programmable | — |
| Gehäuse | 352-terminal CQFP (S-CQFP ceramic, metal-sealed cofired flatpack) | 352-terminal CQFP (ceramic quad flat pack) |
| Package Dimensions | 48 mm x 48 mm (square, with guard ring) | — |
| Family | RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs | RTAX-SL (RTAX-S/SL and RTAX-DSP) |
| Configuration | Live at power up (single-chip, no external configuration device) | Anti-fuse, live at power-up, single-chip |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified per Microchip RTAX family) | Radiation-tolerant (space-flight grade) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Max Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Equivalent System Gates | — | 4,000,000 |
| Logic Cells / Cells | — | 40,320 |
| Total Logic Modules | — | 60,480 |
| Process Technology | — | 0.15 um CMOS |
| Core Supply Voltage | — | 1.5 V |
| Terminal Pitch | — | 0.500 mm |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clocking | — | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | — | Dedicated carry logic |
| Typical Applications | — | Space-flight systems, satellites |