RTAX4000DL-1CQ352B vs RTAX4000SL-CQ352V Vergleich
Detaillierter Direktvergleich von RTAX4000DL-1CQ352B von Microchip Technology und RTAX4000SL-CQ352V von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
RTAX4000DL-1CQ352B - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000DL-1CQ352B ✓ AktivMicrochip Technology
RTAX4000SL-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352V ✓ AktivSpezifikationsvergleich
| Parameter | RTAX4000DL-1CQ352B | RTAX4000SL-CQ352V |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $2.800,00 |
| Equivalent Gates | 4,000,000 gates | — |
| Logic Cells | 55,440 | 60,480 |
| CLB Organization | 36,960 CLBs | — |
| Inputs | 166 | — |
| Outputs | 166 | — |
| Versorgungsspannung | 1.5 V nominal | [DATA_NEEDED: Supply Voltage] |
| Betriebstemperatur | -55C to +125C | [DATA_NEEDED: Operating Temperature] |
| Technology | CMOS, antifuse, one-time programmable | — |
| Gehäuse | 352-terminal CQFP (S-CQFP ceramic, metal-sealed cofired flatpack) | CQ352 (352-pin ceramic column grid array) |
| Package Dimensions | 48 mm x 48 mm (square, with guard ring) | — |
| Family | RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs | RTAX-S/SL |
| Configuration | Live at power up (single-chip, no external configuration device) | — |
| Radiation Tolerance | Radiation-tolerant (space-flight qualified per Microchip RTAX family) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Max Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Device Type | — | Radiation-Tolerant FPGA |
| Equivalent System Gates | — | 4,000,000 |
| Configurable Logic Blocks (CLBs) | — | 40,320 |
| Process Technology | — | CMOS |
| Configuration Type | — | Live at power-up (single-chip) |
| Embedded Memory | — | Embedded SRAM with FIFO control logic |
| Clock Resources | — | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | — | Dedicated carry logic |
| Radiation Environment | — | Space flight |
| Maximum User I/O | — | [DATA_NEEDED: Maximum User I/O count for CQ352 package] |