RTAX4000S-1LG1272V vs RTAX4000S-1LG1272PROTO Vergleich

Detaillierter Direktvergleich von RTAX4000S-1LG1272V von Microchip Technology und RTAX4000S-1LG1272PROTO von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
RTAX4000S-1LG1272V RTAX4000S-1LG1272V - Rad-Tolerant FPGA 4M Gates | Microchip

RTAX4000S-1LG1272V - Rad-Tolerant FPGA 4M Gates | Microchip

RTAX4000S-1LG1272V ✓ Aktiv
Microchip Technology
RTAX4000S-1LG1272PROTO RTAX4000S-1LG1272PROTO - 4M-Gate Rad-Tolerant FPGA | Microchip

RTAX4000S-1LG1272PROTO - 4M-Gate Rad-Tolerant FPGA | Microchip

RTAX4000S-1LG1272PROTO ✓ Aktiv

Spezifikationsvergleich

Parameter RTAX4000S-1LG1272V RTAX4000S-1LG1272PROTO
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9.300,00 $0,00
Equivalent System Gates 4,000,000 gates 4,000,000
Logic Cells 60480 60,480
CLBs (Logic Modules) 40320 —
ASIC Gate Equivalent Option 500,000 gates —
Family RTAX-S Radiation-Tolerant FPGA RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs
Supply Voltage (Core) 1.5 V (nominal) —
Speed Grade -1 —
Gehäuse LG1272 (1272-ball ceramic column grid array) 1272-ball Ceramic Column Grid Array (CCGA, LG1272)
Betriebstemperatur -55C to +125C [DATA_NEEDED: operating temperature range]
Technology CMOS, anti-fuse, one-time programmable CMOS, antifuse (non-volatile)
Configuration Live at power-up, single chip, no external boot device Live at power-up, single chip (no external config memory)
Embedded SRAM Yes, with built-in FIFO control logic —
Clocking Segmentable clocks, chip-wide highway routing —
Screening Level V (space flight qualification per datasheet flow) —
Montageart Surface Mount —
RoHS-Status [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Max I/O Count [DATA_NEEDED: user I/O count for LG1272] —
Embedded RAM Total [DATA_NEEDED: total embedded SRAM bits] —
Manufacturer — Microchip Technology (Actel/Microsemi)
Configurable Logic Blocks (CLBs) — 40,320
Core Supply Voltage — 1.5 V (range 1.425 V to 1.575 V)
Package Dimensions — 37.5 mm x 37.5 mm
Terminal Pitch — 1.00 mm
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clock Features — Segmentable clocks, chip-wide highway routing
Variant Grade — PROTO (same silicon and packaging as flight units, without some flight-model tests)
Target Market — Spaceflight systems (radiation-tolerant)
Radiation Tolerance (TID/SEE) — [DATA_NEEDED: total ionizing dose and single-event effects rating]
I/O Count — [DATA_NEEDED: user I/O count for LG1272]
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

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