S912XEP100BMAL vs S912XEG384J2CALR Vergleich
Detaillierter Direktvergleich von S912XEP100BMAL von NXP Semiconductors und S912XEG384J2CALR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S912XEP100BMAL | S912XEG384J2CALR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,80 | $9,10 |
| Core Architecture | HCS12X (S12X CPU, 16-bit CISC) | HCS12X (S12X CPU + XGATE co-processor) |
| Bus Speed | 50 MHz | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| XGATE Co-processor | Yes | Yes (RISC peripheral co-processor) |
| EEPROM Emulation | Hardware-emulated using Flash | — |
| ADC | 12-bit, 3 us conversion time | 12-bit SAR ADC, up to 24 channels |
| Memory Protection Unit | Yes (supervisor/user modes) | — |
| Timers | ECT, PIT, RTI | ECT (16-bit), PIT, RTI |
| Betriebstemperatur | -40C to +125C (automotive) | — |
| Gehäuse | 112-LQFP (20x20 mm) | LQFP-112 (20x20 mm, CAL) |
| Montageart | Surface Mount | Surface Mount (LQFP, gull-wing leads) |
| MSL-Level | [DATA_NEEDED: MSL Level] | — |
| RoHS-Status | Compliant | Compliant (per LCSC listing) |
| Versorgungsspannung | [DATA_NEEDED: VDD range] | 5V typical (3.3V-5.5V range) |
| Automotive Qualification | AEC-Q100 qualified | — |
| Core Bit Width | — | 16-bit |
| Maximum CPU Frequency | — | 50 MHz |
| Program Flash Memory | — | 384 KB |
| SRAM | — | 24 KB |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Betriebstemperaturbereich | — | -40C to +85C (industrial grade, 'J2' mask) |
| GPIO Count | — | Up to 91 |
| CAN Interface | — | MSCAN (1 module) |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| On-chip Voltage Regulator | — | Yes (internal 3.3V/5V) |