S912XEP100W1MAG vs MC9S12XEP768CAG Vergleich

Detaillierter Direktvergleich von S912XEP100W1MAG von NXP Semiconductors und MC9S12XEP768CAG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S912XEP100W1MAG S912XEP100W1MAG - S12X 16-bit MCU, 1MB Flash, 144-LQFP | NXP

S912XEP100W1MAG - S12X 16-bit MCU, 1MB Flash, 144-LQFP | NXP

S912XEP100W1MAG ✓ Aktiv
NXP Semiconductors
MC9S12XEP768CAG MC9S12XEP768CAG - 16-Bit HCS12X MCU 768KB Flash 144-LQFP | NXP

MC9S12XEP768CAG - 16-Bit HCS12X MCU 768KB Flash 144-LQFP | NXP

MC9S12XEP768CAG ✓ Aktiv

Spezifikationsvergleich

Parameter S912XEP100W1MAG MC9S12XEP768CAG
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $25,10 $19,85
Core Processor HCS12X —
Core Size 16-bit —
Core Architecture S12X CISC with XGATE co-processor —
Speed (CPU Clock) 50 MHz —
Program Memory Size 1 MB (1M x 8) —
Program Memory Type FLASH —
Number of I/O 119 —
Connectivity CANbus, EBI/EMI, I2C, IrDA, SCI, SPI —
Peripherals LVD, POR, PWM, WDT —
ADC 12-bit (per datasheet family) 2 x 10-bit ADC, up to 24 channels
Supply Voltage Range 1.8 V / 2.8 V / 5 V (multi-rail) [DATA_NEEDED: full VIN min/max range]
Betriebstemperatur -40 C to +125 C (Automotive) -40C to +85C (automotive grade)
AEC-Q100 Qualified Yes (automotive grade) —
Gehäuse / Bauform 144-LQFP (20 x 20 mm) —
Montageart Surface Mount Surface Mount
RoHS-Status Compliant Compliant
Core — HCS12X (16-bit) with XGATE co-processor
Maximum CPU Frequency — 50 MHz
Program Flash — 768 KB (768K x 8) with ECC
SRAM — 32 KB
Data Flash — [DATA_NEEDED: Data Flash size]
Operating Voltage — 1.8V / 2.8V / 5V
CAN Modules — 4 x msCAN (CAN 2.0A/B)
PWM Channels — Up to 8 channels
SCI / LIN — 2 x SCI (LIN-capable)
SPI — 3 x SPI
Timers — 8-channel 16-bit timer with capture/compare
Debug Interface — JTAG and BDM
Gehäuse — 144-LQFP (20x20 mm)
MSL-Level — [DATA_NEEDED: MSL level]

Datenblätter & Ressourcen

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