S9S08DZ60F1CLH vs MC9S08DZ32AMLF Vergleich

Detaillierter Direktvergleich von S9S08DZ60F1CLH von NXP Semiconductors und MC9S08DZ32AMLF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S9S08DZ60F1CLH S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH - 8-bit 40MHz 60KB Flash MCU, 64-LQFP | NXP

S9S08DZ60F1CLH Obsolete
NXP Semiconductors
MC9S08DZ32AMLF MC9S08DZ32AMLF - 8-bit MCU 32KB Flash 40MHz CAN LQFP-48 | NXP

MC9S08DZ32AMLF - 8-bit MCU 32KB Flash 40MHz CAN LQFP-48 | NXP

MC9S08DZ32AMLF Nrnd

Spezifikationsvergleich

Parameter S9S08DZ60F1CLH MC9S08DZ32AMLF
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $5,95 $2,75
Core Processor S08 HCS08 (S08 CISC)
Core Size 8-bit 8-Bit
Maximale Taktfrequenz 40 MHz —
Program Memory Size 60 KB (60K x 8) Flash 32 KB (32K x 8) Flash
EEPROM Size 2 KB (2K x 8) —
RAM Size [DATA_NEEDED: RAM size] 2 KB
Supply Voltage (Vdd) 2.7 V to 5.5 V —
Number of I/O Pins 53 —
Gehäuse 64-LQFP (10x10 mm) 48-LQFP (7x7 mm)
Montageart Surface Mount Surface Mount
Connectivity CAN, I2C, LIN, SCI, SPI —
Peripherals LVD, POR, PWM, WDT —
ADC 8-channel 10-bit [DATA_NEEDED: confirmed channel count from datasheet] 24-channel, 12-bit, 2.5 us conversion
Betriebstemperatur -40 C to +85 C (industrial) / -40 C to +125 C (automotive) —
Mask Set M74K —
Lebenszyklusstatus Obsolete (mask-only factory stock) NRND (Not Recommended for New Designs)
Lead-Free / RoHS [DATA_NEEDED: explicit RoHS claim - LH suffix typically indicates lead-free] —
Maximum CPU Frequency — 40 MHz (20 MHz internal bus)
EEPROM — Embedded EEPROM
Versorgungsspannung — 3.3 V / 5 V
CAN — Yes (embedded MSCAN)
Serial Interfaces — SCI, SPI, I2C
Analog Comparator — Yes
Interrupt/Reset Sources — Up to 32
Instruction Set — HC08 with added BGND instruction
On-Chip Debug — Yes (on-chip emulation/debug)
Packaging — Tray
Product Category — Microcontrollers (MCU)
Qualification — Automotive-grade family (AEC-Q100 per series documentation)

Datenblätter & Ressourcen

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