S9S08DZ60F2MLH vs MC9S08DN60AMLH Vergleich
Detaillierter Direktvergleich von S9S08DZ60F2MLH von NXP Semiconductors und MC9S08DN60AMLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S08DZ60F2MLH | MC9S08DN60AMLH |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,45 | $8,58 |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Architecture | CISC | — |
| Maximale Taktfrequenz | 40 MHz | — |
| Flash Memory | 60 KB (60K x 8) | 60 KB |
| RAM | [DATA_NEEDED: RAM size] | 2 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Versorgungsspannung | 3.3 V / 5 V | — |
| Betriebstemperatur | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 64-LQFP (10x10 mm) | 64-LQFP, 10 x 10 mm |
| Montageart | Surface Mount | Surface mount |
| CAN Module | msCAN (CAN 2.0 A/B) | — |
| LCD Driver | Integrated (per NXP product page) | — |
| ADC Resolution | 12-bit | — |
| Qualification | Automotive Qualified | — |
| Packaging | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Peripherals | SCI, SPI, IIC, RTC, PWM | — |
| Product Type | — | 8-bit microcontroller |
| CPU Core | — | Enhanced HCS08 core |
| Maximum CPU Frequency | — | 40 MHz |
| System Bus Frequency | — | 20 MHz |
| Flash Organization | — | 60K x 8 bits |
| ADC | — | 10-bit |
| Serial Interface | — | Multiple serial interfaces |
| LIN Capability | — | LIN master |
| LCD Support | — | LCD driver |
| Embedded Emulation and Debug | — | Supported by HCS08 family documentation |
| Instruction Set | — | HCS08 instruction set |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |