S9S08SG8E2MSC vs S9S08SG8E2MTG Vergleich
Detaillierter Direktvergleich von S9S08SG8E2MSC von NXP Semiconductors und S9S08SG8E2MTG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S08SG8E2MSC | S9S08SG8E2MTG |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,65 | $1,35 |
| Product Type | 8-bit microcontroller | — |
| Core | S08 / HCS08 | S08 (HCS08) |
| Maximale Taktfrequenz | 40 MHz | — |
| Flash Memory | 8 KB | — |
| Flash Organization | 8K x 8 | — |
| Versorgungsspannung | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Ports | 4 | — |
| Gehäuse | 8-SOIC | 16-pin TSSOP (MTG suffix) |
| Package Width | 3.90 mm | — |
| Betriebstemperatur | -40°C to +125°C | -40C to +125C |
| Instruction Set | HCS08 with BGND instruction | HC08 with added BGND |
| Interrupt and Reset Sources | Up to 32 | — |
| Automotive Qualification | Automotive Qualified | — |
| RoHS-Status | RoHS Compliant | Compliant |
| Process Technology | 0.25 µm | — |
| Operating System Region | General-market and space-constrained applications | — |
| Manufacturer | NXP Semiconductors | — |
| Core Size | — | 8-bit |
| Maximum CPU Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 8 KB (8K x 8) |
| RAM | — | 512 B |
| Montageart | — | Surface Mount |
| GPIO Count | — | 12 |
| AEC-Q100 Qualification | — | Qualified (automotive) |
| Communication Interfaces | — | LIN, SCI (UART), I2C |
| ADC | — | Yes (multi-channel, count [DATA_NEEDED: ADC channel count]) |
| Timer Channels | — | Multiple (count [DATA_NEEDED: timer count]) |
| Interrupt Sources | — | Up to 32 |
| Process Node | — | 0.25 um SGF |
| MSL-Level | — | 1 |
| Lead-Free | — | Yes |