S9S12B96F0CFUER vs MC9S12H256VFVE Vergleich
Detaillierter Direktvergleich von S9S12B96F0CFUER von NXP Semiconductors und MC9S12H256VFVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S12B96F0CFUER - 16-bit 96MHz S12 MCU, 96KB, Automotive LQFP-80 | NXP
S9S12B96F0CFUER ✓ AktivNXP Semiconductors
MC9S12H256VFVE - 16-Bit 256KB Flash HCS12 MCU | NXP | 144-LQFP (Tape & Reel)
MC9S12H256VFVE ObsoleteSpezifikationsvergleich
| Parameter | S9S12B96F0CFUER | MC9S12H256VFVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,50 | $10,95 |
| Core | S12 (16-bit CISC) | — |
| CPU Maximum Frequency | 25 MHz | — |
| Flash Memory | [DATA_NEEDED: Flash size in KB] | — |
| RAM | [DATA_NEEDED: RAM size in KB] | — |
| Gehäuse | LQFP-80 (FUE) | 144-LQFP (20 x 20 mm) |
| Pin-Anzahl | 80 | — |
| Betriebstemperaturbereich | -40C to +85C | — |
| Automotive Qualified | Yes | — |
| MSL-Level | 3 | 3 (168 hours) |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time At Peak Reflow Temperature | 40 s | — |
| Terminal Finish | TIN | — |
| JESD-609 Code | e3 | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | — |
| Core Processor | — | HCS12 CPU12 |
| Core Size | — | 16-Bit |
| Core Architecture | — | CISC |
| Maximale Taktfrequenz | — | 16 MHz |
| Program Memory Size | — | 256 KB (256K x 8) FLASH |
| Data RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| Number of I/O Pins | — | 99 |
| Versorgungsspannung | — | 2.5 V core / 5 V I/O |
| Betriebstemperatur | — | -40 C to +105 C (automotive) |
| Connectivity | — | CANbus (2x), I2C, SCI, SPI |
| Peripherals | — | LCD driver, POR, PWM, WDT |
| Automotive Qualification | — | AEC-Q100 |