S9S12DG12F1MFUE vs MC9S12D64MFUER Vergleich
Detaillierter Direktvergleich von S9S12DG12F1MFUE von NXP Semiconductors und MC9S12D64MFUER von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S12DG12F1MFUE - S12 16-bit MCU 128KB Flash, 25MHz Auto QFP-80
S9S12DG12F1MFUE NrndNXP Semiconductors
MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
MC9S12D64MFUER NrndSpezifikationsvergleich
| Parameter | S9S12DG12F1MFUE | MC9S12D64MFUER |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,90 | $1,05 |
| Core | HCS12 (CPU12) | — |
| Datenbusbreite | 16-bit | — |
| Program Memory Size | 128 KB | 64 KB (64K x 8) |
| Program Memory Type | Flash | Flash |
| Maximum CPU Frequency | 25 MHz | — |
| RAM Size | 8 KB | — |
| Number of I/O Pins | [DATA_NEEDED: GPIO count per QFP-80] | — |
| ADC | 2x 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| Timer | 8-channel IC/OC enhanced capture timer | — |
| SCI | 2x asynchronous serial communications interface | — |
| CAN Module | [DATA_NEEDED: CAN presence per datasheet] | — |
| Betriebstemperaturbereich | -40 degC to +125 degC | -40 C to +125 C |
| Gehäuse | QFP-80 (14x14 mm) | 80-QFP (14 x 14 mm), also called PQFP-80 |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| Automotive Qualified | AEC-Q100 (per product page) | — |
| Lead Free / RoHS | Lead Free, RoHS compliant | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| Versorgungsspannung | — | 2.5 V / 5 V |
| Number of I/O | — | 59 |
| PWM Channels | — | 8 channels |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| Automotive Qualification | — | AEC-Q100 |
| RoHS-Status | — | Compliant |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |