S9S12H256J1VFVER vs S9S12H256J1VFV Vergleich
Detaillierter Direktvergleich von S9S12H256J1VFVER von NXP Semiconductors und S9S12H256J1VFV von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S12H256J1VFVER | S9S12H256J1VFV |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Product Type | 16-bit HCS12 CISC microcontroller | 16-bit HCS12 microcontroller |
| Maximum CPU Frequency | 50 MHz | — |
| Flash Memory | 256 KB | 256 KB |
| CPU Data Path | Full 16-bit data path | — |
| Gehäuse | 144-pin QFP | 144-LQFP (20 x 20 mm) |
| Betriebstemperaturbereich | -40°C to +105°C | — |
| Automotive Qualification | Automotive qualified | — |
| General-Purpose I/O Pins | 12 pins | — |
| Interrupt Capability on General-Purpose I/O | Supported | — |
| Wake-Up Capability | Wake-up from STOP mode | — |
| Clock and Power Control | PLL included | — |
| Low-Power Mode | STOP mode | — |
| Montageart | [DATA_NEEDED: mounting type] | Surface mount |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | 2.35 V to 5.25 V |
| RAM Size | [DATA_NEEDED: RAM size] | 6K x 8 bits |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Operating Voltage | [DATA_NEEDED: operating voltage] | — |
| Maximum GPIO Count | [DATA_NEEDED: maximum GPIO count] | — |
| Serial Interfaces | [DATA_NEEDED: serial interfaces] | — |
| Timer Modules | [DATA_NEEDED: timer modules] | — |
| ADC | [DATA_NEEDED: ADC specification] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| RoHS-Status | RoHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Maximale Taktfrequenz | — | 50 MHz |
| Program Memory Organization | — | 256K x 8 bits |
| Number of I/O | — | 85 I/O |
| A/D Converter | — | 8 x 8/10-bit channels |
| Betriebstemperatur | — | -40°C to +105°C |
| Supplier Device Package | — | 144-LQFP (20 x 20 mm) |
| Core Architecture | — | HCS12, 16-bit |
| Product Status | — | Active |
| Manufacturer | — | Freescale Semiconductor, now NXP Semiconductors |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Pinout | — | [DATA_NEEDED: complete 144-pin pinout] |