S9S12HZ64J3CAAR vs S9S12HZ128J3VAL Vergleich
Detaillierter Direktvergleich von S9S12HZ64J3CAAR von NXP Semiconductors und S9S12HZ128J3VAL von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S12HZ64J3CAAR - 64KB Flash S12 MCU, 50MHz | NXP Semiconductors
S9S12HZ64J3CAAR ✓ AktivNXP Semiconductors
S9S12HZ128J3VAL - 16-Bit HCS12 MCU, 128KB Flash, 50MHz | NXP
S9S12HZ128J3VAL ObsoleteSpezifikationsvergleich
| Parameter | S9S12HZ64J3CAAR | S9S12HZ128J3VAL |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7,10 | $13,10 |
| Core Architecture | S12 (16-bit CISC) | HCS12 (CPU12) |
| Family | MCS12H (S12H / Swordfish) | — |
| Program Memory (Flash) | 64 KB | — |
| Maximum CPU Clock | 50 MHz | — |
| Betriebstemperaturbereich | -40C to +85C (Industrial) | -40°C to +105°C |
| Package Type | QFP 80 (80-pin QFP, gull-wing terminals) | 112-LQFP (20 x 20 mm) |
| Package Code | QFP | — |
| Package Shape | Square | — |
| Number of Terminals | 80 | — |
| Montageart | Surface Mount (gull-wing leads) | Surface Mount |
| Qualification | Automotive Qualified (per NXP product page) | — |
| On-chip Debug | BDM (Background Debug Mode) | — |
| Datenbusbreite | 16-bit | 16-bit |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status from NXP product page] | [DATA_NEEDED: RoHS compliance] |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 128KB (128K x 8) |
| Maximale Taktfrequenz | — | 50 MHz |
| Betriebsversorgungsspannung | — | 2.5V / 5V |
| Series | — | HCS12 / S12HZ |
| Number of I/Os | — | [DATA_NEEDED: number of I/Os] |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| ADC | — | [DATA_NEEDED: ADC channels and resolution] |
| Communication Interfaces | — | SCI, SPI (per datasheet) |
| Debug Interface | — | BDM / JTAG |
| Application | — | Automotive instrumentation, body electronics |
| Lead Free | — | [DATA_NEEDED: lead-free status] |