SPC5602BF1MLL6 vs SPC5602BF2MLL6 Vergleich
Detaillierter Direktvergleich von SPC5602BF1MLL6 von NXP Semiconductors und SPC5602BF2MLL6 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
SPC5602BF1MLL6 - 32-bit Auto MCU, 256KB Flash, 64MHz | NXP
SPC5602BF1MLL6 ✓ AktivSpezifikationsvergleich
| Parameter | SPC5602BF1MLL6 | SPC5602BF2MLL6 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,36 | $5,59 |
| Core | PowerPC e200z0 | — |
| CPU Architecture | 32-bit | — |
| Maximum CPU Frequency | 64 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| Versorgungsspannung | 3.3 V / 5 V | 3.3 V / 5 V |
| Betriebstemperaturbereich | -40C to +125C (Automotive) | — |
| Gehäuse | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) |
| Terminal Form | GULL WING | Gull Wing |
| Number of Terminals | 100 | — |
| Package Code | QFP | LFQFP |
| Package Shape | SQUARE | — |
| ADC | 10-bit (integrated) | — |
| Communication Interfaces | CAN, LIN, SPI, SCI | — |
| Temperature Grade | AUTOMOTIVE | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | ROHS3 Compliant | — |
| Core Processor | — | e200z0h (Power Architecture) |
| Core Size | — | 32-Bit |
| Maximum Clock Speed | — | 64 MHz |
| Program Memory Size | — | 256KB (256K x 8) |
| Program Memory Type | — | FLASH |
| Connectivity | — | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | — | DMA, POR, PWM, WDT |
| Number of I/O | — | 79 |
| Betriebstemperatur | — | -40C to +125C |
| Series | — | MPC56xx Qorivva |
| Part Status | — | Active |
| Qualification Grade | — | Automotive Grade |