SPC5742PK1MLQ5 vs SPC5746BSK1MKU2 Vergleich
Detaillierter Direktvergleich von SPC5742PK1MLQ5 von NXP Semiconductors und SPC5746BSK1MKU2 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | SPC5742PK1MLQ5 | SPC5746BSK1MKU2 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $17,25 |
| Core | e200z4 (Power Architecture) | — |
| Core Count | 2 | — |
| Architecture | 32-bit Harvard RISC | — |
| Maximale Taktfrequenz | 150 MHz | 120 MHz |
| Program Memory Size | 1.5 MB (1536 KB) Flash | — |
| Data RAM Size | 192 KB SRAM | 384 kB |
| Datenbusbreite | 32 bit | 32 bit |
| Versorgungsspannung | 1.25 V / 3.3 V | — |
| ADC Count | 4 x ADC | — |
| PWM Modules | 2 x PWM | — |
| SENT Interfaces | 2 x SENT | — |
| Gehäuse | 144-LQFP (20x20 mm) | — |
| Montagestil | SMD/SMT | SMD/SMT |
| Terminal Form | Gull Wing | — |
| Number of Terminals | 144 | — |
| Temperature Grade | Automotive | — |
| Qualification | AEC-Q100 (per distributor listing) | Automotive Qualified |
| Packaging | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Core Processor | — | e200z4 (Power Architecture) |
| Core Size | — | 32-bit |
| Number of Cores | — | 1 (single core) |
| Flash Memory | — | 3 MB (3M x 8) |
| ADC Resolution | — | 10 bit, 12 bit |
| Number of I/Os | — | 129 I/O |
| Supply Voltage (Core) | — | 1.2 V to 1.32 V |
| Connectivity | — | FlexRay |
| Betriebstemperatur | — | -40C to +125C |
| Gehäuse / Bauform | — | LQFP-176 (24x24 mm) |
| Product Family | — | MPC574xB/C/G (SPC57xx) |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |