STM32H753XIH6TR vs STM32H757XIH6 Vergleich
Detaillierter Direktvergleich von STM32H753XIH6TR von STMicroelectronics und STM32H757XIH6 von STMicroelectronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
STMicroelectronics
STM32H753XIH6TR - 480MHz Cortex-M7 MCU 2MB Flash | STMicroelectronics
STM32H753XIH6TR ✓ AktivSTMicroelectronics
STM32H757XIH6 - Dual-Core M7/M4 MCU, 2MB Flash, TFBGA-240 | STMicroelectronics
STM32H757XIH6 ✓ AktivSpezifikationsvergleich
| Parameter | STM32H753XIH6TR | STM32H757XIH6 |
|---|---|---|
| Marke | STMicroelectronics | STMicroelectronics |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16,10 | $12,18 |
| Core Architecture | 32-bit ARM Cortex-M7 with double-precision FPU | — |
| Maximale Taktfrequenz | 480 MHz | — |
| DMIPS Performance | 1027 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) | — |
| L1 Cache | 16 KB instruction + 16 KB data | — |
| Program Flash | 2 MB dual-bank, read-while-write | — |
| Total SRAM | 1 MB (DTCM + AXI-SRAM + SRAM1-4) | — |
| Supply Voltage Range | 1.62 V to 3.6 V | — |
| Gehäuse | 240+25-ball TFBGA 14x14 mm | TFBGA-240 (14x14 mm, 0.8 mm pitch) plus 25 additional balls (240+25) |
| Betriebstemperaturbereich | -40 C to +85 C (industrial grade) | — |
| Communication Interfaces | USB OTG FS+HS, 2x CAN 2.0B, Ethernet MAC 10/100, UART/USART, SPI, I2C, SAI, SDMMC | 46 com. and analog interfaces incl. Ethernet, USB, CAN-FD, USART/UART, SPI, I2C, SAI |
| Analog Peripherals | ADC up to 3.6 MSPS, DAC, comparators, op-amps | — |
| Crypto Accelerators | AES-256, SHA-1/SHA-2/SHA-3, TRNG, Unique 96-bit ID | — |
| Timers | 16-/32-bit timers, PWM, HRTIM, RTC, SysTick, IWDG, WWDG | — |
| Storage Interfaces | SDMMC 2x (SD 4.1/eMMC), Octo-SPI, FMC/FSMC parallel | — |
| Display Support | TFT-LCD controller, Chrom-ART 2D accelerator, JPEG codec | — |
| Montageart | Surface Mount (BGA) | Surface Mount (TFBGA) |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Tape & Reel Option | Yes (suffix TR = 7-inch reel, 1000 pcs typical) | — |
| Architecture | — | Arm Cortex-M7 + Cortex-M4 (dual-core, asymmetric multiprocessing) |
| Cortex-M7 Max Clock | — | 480 MHz |
| Cortex-M4 Max Clock | — | 240 MHz |
| Flash Memory | — | 2 MB (dual-bank, read-while-write) |
| SRAM | — | 1 MB (multiple banks incl. DTCM, AXI SRAM, SRAM1-4, Backup SRAM) |
| Supply Voltage (VDD) | — | 1.62 V to 3.6 V |
| Betriebstemperatur | — | -40 °C to +85 °C (grade 6) |
| Display Interface | — | MIPI-DSI host controller + TFT-LCD controller |
| Crypto Accelerator | — | AES, hash (SHA-1/SHA-2), TRNG |
| Graphics Accelerator | — | Chrom-ART (2D DMA2D) |
| Camera Interface | — | DCMI (parallel, 8- to 14-bit) |
| External Memory Controller | — | FMC for SDRAM, NOR, NAND, PSRAM |
| Internal SMPS | — | Yes (voltage scaling for core) |
| ADCs / DACs | — | Multiple 12-/16-bit ADCs; DAC channels [DATA_NEEDED: exact count] |