W971GG6NB-6 vs W971GG6NB-25 TR Vergleich
Detaillierter Direktvergleich von W971GG6NB-6 von Winbond und W971GG6NB-25 TR von Winbond. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | W971GG6NB-6 | W971GG6NB-25 TR |
|---|---|---|
| Marke | Winbond | Winbond |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,42 | $5,62 |
| Speichertyp | DDR2 SDRAM | SDRAM - DDR2 |
| Speichergröße | 1 Gbit | 1 Gbit |
| Speicherorganisation | 8M x 8 banks x 16 bits | 64M x 16 (8,388,608 words x 8 banks x 16 bits) |
| Speed Grade | -6 (DDR2-667, 667 Mbps) | — |
| Interface Standard | SSTL_18 (1.8 V) | — |
| Clock Frequency | 333 MHz (667 Mbps data rate) | 400 MHz |
| Access Time | [DATA_NEEDED: precise CL-trcd-trp in ns] | 57.5 ns |
| Number of Banks | 8 | 8 |
| Burst Length | 4 / 8 (programmable) | — |
| On-Die Termination | Dynamic ODT (supported) | — |
| Data Mask (DM) | Supported | — |
| Auto Precharge | Supported | — |
| Self-Refresh | Supported | — |
| Operating Temperature Range (commercial) | 0C to +85C (TCASE) | — |
| Supply Voltage VDD/VDDQ | 1.8 V (typ) | — |
| Gehäuse | 84-ball TFBGA (8 x 12.5 mm) | 84-TFBGA (8 x 12.5 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS / Halogen-Free | Compliant / Halogen-Free (per Winbond) | — |
| JEDEC Standard | JEDEC DDR2 (DDR2-667 grade) | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Write Cycle Time | — | 15 ns |
| Schnittstelle | — | SSTL_18 |
| Versorgungsspannung | — | 1.8 V |
| Datenrate | — | DDR2-800 |
| Packaging | — | Tape & Reel (TR) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Refresh Interval | — | [DATA_NEEDED: refresh interval] |
| RoHS-Status | — | Compliant (all Winbond packaging RoHS compliant per manufacturer) |