XC3S400-4TQ144I vs XC3S400-4TQ144C Vergleich
Detaillierter Direktvergleich von XC3S400-4TQ144I von AMD und XC3S400-4TQ144C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC3S400-4TQ144I | XC3S400-4TQ144C |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-3 field-programmable gate array (FPGA) |
| FPGA Family | Spartan-3 | — |
| System Gates | 400,000 | 400,000 |
| Logic Cells | 8,064 | 8,064 |
| Embedded RAM | 294,912 bits | — |
| User I/O Count | 97 | — |
| Maximum Operating Frequency | 630 MHz | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | — |
| Gehäuse | 144-pin TQFP | 144-pin TQFP |
| Pin-Anzahl | 144 pins | — |
| Montageart | Surface Mount | Surface mount |
| Performance Grade | -4 speed grade | -4 |
| Temperature Grade | Industrial | Commercial (C) |
| Logic Array Blocks | 896 LABs | — |
| Betriebstemperaturbereich | [DATA_NEEDED: verified operating temperature range] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Method | [DATA_NEEDED: configuration methods] | — |
| RoHS-Status | [DATA_NEEDED: verified RoHS status] | Compliant |
| Block RAM | — | 294,912 bit |
| User I/Os | — | 97 |
| Betriebstemperatur | — | 0 °C to 85 °C |
| Package Body Size | — | 20 mm × 20 mm |
| Technology | — | 90 nm |
| Adaptive Logic Modules | — | 3,584 |
| Lead-Free Status | — | Lead-free |
| Maximale Taktfrequenz | — | [DATA_NEEDED: maximum clock frequency for the -4 speed grade] |
| Configuration Memory Type | — | [DATA_NEEDED: configuration memory type] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |