XC3S50-4TQ144I vs XC3S50-4TQG144I Vergleich

Detaillierter Direktvergleich von XC3S50-4TQ144I von AMD und XC3S50-4TQG144I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC3S50-4TQ144I XC3S50-4TQG144I
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Unknown Unknown
Device Type Spartan-3 field-programmable gate array (FPGA) Field-Programmable Gate Array (FPGA)
System Gates 50,000 gates 50,000 gates
Logic Cells 1,728 cells 1,728 cells
Block RAM 73,728 bits —
I/O Resources 97 I/O —
Versorgungsspannung 1.2 V —
Technology 90 nm CMOS —
Gehäuse 144-LQFP, 20 x 20 mm —
Montageart Surface mount Surface Mount
Package Lead Type Gull-wing —
Betriebstemperatur -40 °C to +100 °C junction temperature -40°C to +100°C
Speed Grade -4 —
Temperature Grade Industrial —
Configuration FPGA configuration required —
FPGA Family Spartan-3 Spartan-3
Terminal Count 144 terminals —
Product Status Active distributor listings observed; lifecycle status not explicitly provided —
Configurable Logic Blocks — 192 CLBs
User I/Os — 97 I/Os
Total Block RAM — 73,728 bits
Process Technology — 90 nm
Core Supply Voltage — 1.2 V
Core Voltage Range — 1.14 V to 1.26 V
Performance Grade — -4 speed grade
Package Type — 144-TQFP
Package Dimensions — 20 mm x 20 mm
Temperature Classification — Industrial-grade
Lead-Free Status — Lead Free
RoHS-Status — unknown
REACH Status — unknown

Datenblätter & Ressourcen

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