XC6SLX16-2FTG256C vs XC6SLX16-2FT256C Vergleich

Detaillierter Direktvergleich von XC6SLX16-2FTG256C von AMD und XC6SLX16-2FT256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX16-2FTG256C XC6SLX16-2FT256C
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock —
Stückpreis (USD) $16,41 —
Family Spartan-6 LX —
Logic Cells 14,579 —
Configurable Logic Blocks (CLBs) 1,139 —
Slices 2,278 —
Block RAM Bits 589,824 bits —
Block RAM Blocks (18 Kb) 32 —
DSP Slices (18×18 multipliers) 32 —
Maximum User I/Os 186 —
Maximum Single-Ended I/O Banks 4 —
Process Node 45 nm CMOS, 9-metal layer —
Speed Grade -2 -2
Supply Voltage (Core) 1.2 V nominal —
Gehäuse 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch 256-LBGA
Montageart Surface Mount Surface Mount
Betriebstemperatur 0 °C to +85 °C (Commercial) 0°C to 85°C
Lead-Free / RoHS Yes (compliant) —
Configuration Modes JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel —
Clock Management Tiles (CMTs) 2 (each with PLL + MMCM) —
PCIe Support Soft IP only (no integrated PCIe hard cores) —
Device Type — FPGA
FPGA Family — Spartan-6 LX
Configurable Logic Cells — 14,579 cells
Configurable Logic Blocks — 1,139 CLBs
Internal Frequency — 667 MHz
I/O Count — 186 I/O
Process Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Temperature Grade — C, commercial
Terminal Count — 256 terminals
Package Shape — Square
Terminal Form — Ball
Lead-Free Status — Lead free
RoHS-Status — [DATA_NEEDED: RoHS compliance status]
REACH Status — [DATA_NEEDED: REACH compliance status]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]

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