XC6SLX16-3FT256C vs XC6SLX16-3FTG256C Vergleich
Detaillierter Direktvergleich von XC6SLX16-3FT256C von AMD und XC6SLX16-3FTG256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX16-3FT256C | XC6SLX16-3FTG256C |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Product Type | Spartan-6 LX Field-Programmable Gate Array | — |
| Logic Elements | 14,579 LE | — |
| Configurable Logic Blocks | 1,139 CLBs | — |
| Total Block RAM | 589,824 bits | — |
| Maximale Taktfrequenz | 667 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Input/Output Count | 186 I/O | — |
| Gehäuse | 256-LBGA | 256-LBGA / FTBGA-256, 17 x 17 mm, 1.0 mm pitch |
| Package Dimensions | 17 mm x 17 mm | — |
| Package Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Performance Grade | -3 speed grade | — |
| Temperature Grade Suffix | C suffix | — |
| Lead-Free Status | Lead-free | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| REACH Status | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Differential I/O | [DATA_NEEDED: differential I/O capability] | — |
| Family | — | Spartan-6 LX |
| Series | — | XC6SLX16 |
| Logic Cells | — | 14,579 |
| Configurable Logic Blocks (CLBs) | — | 1139 |
| Distributed RAM | — | 256 kbit |
| Block RAM | — | [DATA_NEEDED: total Kbits] |
| DSP48A1 Slices | — | 32 |
| Maximum User I/Os | — | 186 |
| User I/O Banks | — | [DATA_NEEDED: count] |
| Number of CMTs | — | 2 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Auxiliary Voltage (VCCAUX) | — | 2.5 V to 3.3 V |
| Speed Grade | — | -3 |
| Betriebstemperatur | — | 0 C to +85 C (Commercial) |