XC6SLX16-3FT256I vs XC6SLX16-3FT256C Vergleich

Detaillierter Direktvergleich von XC6SLX16-3FT256I von AMD und XC6SLX16-3FT256C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter XC6SLX16-3FT256I XC6SLX16-3FT256C
Marke AMD AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX (logic-optimized) —
Logic Cells 14,579 cells —
Configurable Logic Blocks (CLBs) 1,139 CLBs —
User I/O Count 186 I/O —
Max Internal Frequency 667 MHz —
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V 1.2 V
Speed Grade -3 (highest Spartan-6 LX performance grade) —
Gehäuse 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid 256-LBGA
Package Body Size 17 x 17 mm, 1.0 mm ball pitch —
Terminal Count 256 terminals —
Betriebstemperatur 0 C to +85 C (32 F to 185 F) —
Temperature Grade Marking Industrial —
Lead-Free Status Lead-free package construction Lead-free
Montageart Surface Mount Surface Mount
Package Code LBGA / FT256 —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Configuration Interface Details [DATA_NEEDED: configuration interface details] —
Product Type — Spartan-6 LX Field-Programmable Gate Array
Logic Elements — 14,579 LE
Configurable Logic Blocks — 1,139 CLBs
Total Block RAM — 589,824 bits
Maximale Taktfrequenz — 667 MHz
Input/Output Count — 186 I/O
Package Dimensions — 17 mm x 17 mm
Package Pitch — 1.0 mm
Performance Grade — -3 speed grade
Temperature Grade Suffix — C suffix
RoHS-Status — [DATA_NEEDED: RoHS compliance]
REACH Status — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]
Differential I/O — [DATA_NEEDED: differential I/O capability]

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