XC6SLX25-3FT256C vs XC6SLX25-2FT256I Vergleich

Detaillierter Direktvergleich von XC6SLX25-3FT256C von Xilinx und XC6SLX25-2FT256I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Xilinx
XC6SLX25-3FT256C XC6SLX25-3FT256C - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FT256C - 24,051-Cell Spartan-6 LX FPGA | AMD

XC6SLX25-3FT256C ✓ Aktiv

Spezifikationsvergleich

Parameter XC6SLX25-3FT256C XC6SLX25-2FT256I
Marke Xilinx AMD
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Spartan-6 LX field-programmable gate array —
Logic Elements 24,051 cells —
Adaptive Logic Modules 3,758 ALMs —
Configurable Logic Blocks 1,879 CLBs —
Embedded Memory 936 kbit —
Input/Output Count 186 I/O —
Core Voltage 1.2 V —
Process Technology 45 nm CMOS 45 nm CMOS
Performance Figure 667 MHz —
Gehäuse 256-pin FTBGA, 17 x 17 mm, 1 mm pitch FTBGA-256 (FT256), 17 x 17 mm, 1.0 mm pitch
Terminal Count 256 balls —
Montageart Surface mount Surface Mount (BGA)
Package Shape Square —
Temperature Grading Other —
Lead-Free Status Lead free —
Unit Price $24.3384 as of 2026-10-28 —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant (Pb-free)
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Family — Spartan-6 LX
Logic Cells — 24,051
Configurable Logic Blocks (CLBs) — 1,879
Block RAM (Kbits) — 958
Distributed RAM (Kbits) — 4,824
DSP48A1 Slices — 38
User I/O — 186
Clock Management Tiles (CMTs) — 2
Maximum Internal Frequency — 500 MHz
Speed Grade — -2 (standard)
Temperature Grade — -I (Industrial, -40C to +100C)
Supply Voltage (Core) — 1.2 V
Memory Controller — Hardened MCB (DDR/DDR2/DDR3/LPDDR up to 800 Mb/s)

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