XC7Z030-1FB484I vs XC7Z030-2FBG484I Vergleich
Detaillierter Direktvergleich von XC7Z030-1FB484I von AMD und XC7Z030-2FBG484I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC7Z030-1FB484I | XC7Z030-2FBG484I |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,01 | $58,00 |
| Product Type | Zynq-7000 Kintex-7 system-on-chip FPGA | — |
| Programmable Logic | FPGA | — |
| Logic Cells | 125K logic cells | 125000 |
| Processor Core | Dual ARM Cortex-A9 MPCore | — |
| Processor Frequency | 667 MHz | — |
| Debug Support | CoreSight | — |
| Gehäuse | 484-FCBGA (23 x 23 mm) | 484-FCBGA (23x23) |
| Package Pin Count | 484 balls | — |
| Speed Grade | 1 | — |
| Temperature Grade | Industrial | — |
| Device Architecture | Zynq-7000 SoC with Kintex-7 FPGA fabric | — |
| Surface Mount | Yes | — |
| Manufacturer | AMD / Xilinx | — |
| Lebenszyklusstatus | Not stated in supplied verified data | Active |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | Compliant |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Maximum I/O | [DATA_NEEDED: maximum I/O] | — |
| Block RAM | [DATA_NEEDED: block RAM] | — |
| DSP Slices | [DATA_NEEDED: DSP slices] | — |
| External Memory Interface | [DATA_NEEDED: external memory interfaces] | — |
| Pinout | [DATA_NEEDED: complete 484-ball pinout] | — |
| Family | — | Zynq-7000 |
| Core Processor | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of Cores | — | 2 |
| Primary Clock Speed | — | 800 MHz |
| Betriebstemperatur | — | -40°C to +100°C |
| I/O Voltage | — | 1.2V to 3.3V |
| Process Technology | — | 28nm |
| On-Chip Memory | — | 256 KB |
| Montageart | — | Surface Mount |
| Number of I/O | — | [DATA_NEEDED: Number of I/O] |