10CL055ZF484I8G - Cyclone 10 LP FPGA 55K LE 484-BGA | Intel
Teilenummer: 10CL055ZF484I8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $68.11 | $68,11 |
| 10 | $64.7 | $647,00 |
| 100 | $61.3 | $6.130,00 |
| 500 | $57.89 | $28.945,00 |
| 1.000 | $54.49 | $54.490,00 |
10CL055ZF484I8G Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory blocks that allow hardware designers to implement custom digital circuits after fabrication. FPGAs belong to the programmable logic IC family, sitting between fixed-function ASICs and software-programmable microcontrollers in the design flexibility hierarchy. Cyclone 10 LP sits below Cyclone 10 GX in the Intel low-cost FPGA portfolio, prioritizing logic density and static power efficiency over transceiver performance.
Key features of the 10CL055ZF484I8G include 321 maximum user I/O pins, 156 embedded 18x18 multipliers, dual-configuration flash with on-chip RAM, and dedicated DDR3/DDR3L/LPDDR2 external memory interfaces. The device integrates PLLs for clock management and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, enabling direct interfacing with modern memory and high-speed parallel peripherals without external translation buffers.
Technically, the Cyclone 10 LP architecture combines adaptive logic modules (ALMs) with a fine-grained routing fabric, allowing efficient mapping of pipelined datapaths and state machines. Embedded memory is organized as M9K (9 Kbit) blocks that can be cascaded to form wider or deeper RAM, ROM, or FIFO structures. The 484-ball FBGA package exposes the full I/O count and supports JTAG-based configuration via the Quartus Prime toolchain.
Typical applications include industrial motor control, video processing bridges, factory automation controllers, low-cost ASIC prototyping, machine vision pre-processing, and I/O expansion for embedded processors. The high logic density suits parallel sensor aggregation, while the DDR controller enables direct SDRAM attachment for image buffering. The Cyclone 10 LP family is widely used in displays, printers, and surveillance camera SoC companion roles.
When designing with the 10CL055ZF484I8G, plan power estimation carefully: although the process is low-power, dynamic power scales with toggle rate and clock frequency. Use Quartus Prime PowerPlay to size decoupling and verify thermal margins in enclosed enclosures.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone 10 LP family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 10CL055ZF484I8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10CL055ZF484I8G (gleiche Bauform und Footprint) – abweichend in Process Technology, Speed Grade, Package, Mounting Type, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10CL055YF484I8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10CL055YU484I7G
✅ Drop-In✓ Auf Lager
$35.1 / Stück
Datenblatt ansehen →10CL055YU484C8G
✅ Drop-In✓ Auf Lager
$63.8 / Stück
Datenblatt ansehen →10CL040ZF484I8G
✅ Drop-In✓ Auf Lager
$66.9 / Stück
Datenblatt ansehen →10CL055YU484C6G
✅ Drop-In✓ Auf Lager
$24.38 / Stück
Datenblatt ansehen →10CL055YU484A7G
✅ Drop-In✓ Auf Lager
$124.3 / Stück
Datenblatt ansehen →10CL055ZF484I8G Grenzwerte & elektrische Eigenschaften
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 55,856 |
| Configurable Logic Blocks (CLB) | 3,491 |
| Embedded Memory | 2,396,160 bits (2,340 Kbit) |
| Embedded Multipliers (18x18) | 156 |
| Maximum User I/O | 321 |
| PLLs | 4 |
| Process Node | 20 nm |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Gehäuse | 484-ball FBGA (F484) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Configuration Memory | SRAM-based (volatile, external flash required) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| External Memory Interface | DDR3, DDR3L, LPDDR2 |
| MSL-Level | 3 |
10CL055ZF484I8G 484-ball fbga (f484) Pinbelegungsleitfaden
Pinbelegung für 10CL055ZF484I8G (484-ball fbga (f484)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10CL055ZF484I8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10CL055ZF484I8G ist geeignet für 6 Anwendungs: Industrial Motor Control, Video Processing Bridge, Factory Automation Controllers, Low-Cost ASIC Prototyping, Machine Vision Pre-Processing, Embedded Processor I/O Expansion.
Industrial Motor Control
The 10CL055ZF484I8G fits industrial motor control because its 156 embedded 18x18 multipliers deliver high-resolution PWM generation and field-oriented control (FOC) math. The 321 user I/Os accept multiple encoder inputs, gate driver signals, and resolver feedback without external logic. The industrial -40C to +100C rating covers factory floor and outdoor cabinet environments, while 2,396 Kbit embedded memory buffers sine look-up tables and trajectory ramps. Placed on a 4-layer PCB with bulk decoupling on each PLL supply, it outperforms MCU-based solutions by parallelizing multiple control loops per IC.
Empfohlen
Video Processing Bridge
The 10CL055ZF484I8G serves well as a video processing bridge between MIPI, LVDS, parallel CMOS, and HDMI sources and sinks. Its 55,856 LEs implement deinterlacing, color-space matrix conversions, and scaling pipelines at 1080p60 rates. The DDR3 controller attached via the embedded memory interface absorbs frame-buffer bandwidth using external SDRAM. With LVDS I/O at hundreds of MHz, the device replaces discrete ASSPs while remaining programmable for protocol updates.
Empfohlen
Factory Automation Controllers
The 10CL055ZF484I8G is ideal for factory automation controllers where parallel sensor aggregation, deterministic latency, and protocol flexibility are required. The 321 I/Os connect to multiple Profinet, EtherCAT, or Modbus slaves via soft IP cores, while the 156 multipliers handle signal conditioning and PID control loops. The industrial temperature range and RoHS compliance meet IEC 61131-2 industrial environment requirements. Unlike fixed-function PLCs, the FPGA allows custom protocol stacks without silicon redesign.
Empfohlen
Low-Cost ASIC Prototyping
The 10CL055ZF484I8G offers ASIC prototyping at production-friendly cost. With 55,856 LEs and 2,396 Kbit embedded memory, mid-complexity ASIC designs map 1:1 to the FPGA for software development and validation. The Quartus Prime toolchain supports incremental compilation for fast design iterations, and the DDR3 controller mirrors typical ASIC memory interfaces. Engineers can validate firmware-hardware integration months before ASIC tape-out, reducing re-spin risk and time-to-market.
Empfohlen
Machine Vision Pre-Processing
The 10CL055ZF484I8G delivers machine vision pre-processing at the edge, offloading image sensor conditioning from host processors. Its parallel multiplier array runs Sobel, Gaussian, and threshold filters at line rates exceeding 100 MHz, while the embedded memory accumulates histograms and feature maps. The 321 I/Os handle multi-lane LVDS sensor inputs directly. Industrial temperature rating and small 484-ball FBGA package fit compact vision modules in robotics and quality inspection lines.
Empfohlen
Embedded Processor I/O Expansion
The 10CL055ZF484I8G expands I/O and accelerates co-processing for embedded processors. Connected via parallel or serial links to ARM SoCs, the FPGA offloads real-time tasks, custom peripherals, and legacy interfaces such as ISA, PCI, or VME. Its 156 hardware multipliers accelerate DSP functions while the host CPU focuses on OS-level tasks. The DDR3 controller manages shared external memory, enabling zero-copy data transfer. Industrial rating suits ruggedized embedded systems in transportation and energy.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10CL055ZF484I8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10CL055YF484I8G | 10CL055YU484I7G | 10CL055YU484C8G | 10CL040ZF484I8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | UBGA-484 (U484) - same pin count | UBGA-484 (U484) - same pin count | 484-ball FBGA (F484) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 40,000 |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 1,134,000 bits |
| Multipliers (18x18) | 156 | 156 | 156 | 156 | 125 |
| Max User I/O | 321 | 321 | 321 | 321 | 289 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 8 | 7 | 7 | 8 | 8 |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- Highest-density Cyclone 10 LP in F484 package (vs. 10CL040ZF484I8G)
- Speed-grade 8 (fastest) in 55K LE Cyclone 10 LP family (vs. 10CL055YF484I7G)
- Industrial temperature rating in F484 package (vs. 10CL055YU484C8G)
Designhinweise
Estimated: Cyclone 10 LP devices at 55K LE running 200 MHz internal clocks and 50 MHz I/O toggle rates typically consume 1.5W to 2.5W with default Quartus Prime settings. Plan a 4-layer PCB with 1 oz copper pours on each VCCINT and VCCIO plane. Decouple each VCCIO bank with 0.1 uF + 10 uF ceramic + 47 uF bulk near the device. Use PowerPlay Analyzer early in design to refine decoupling budgets.
Industrial -40C to +100C rating does not eliminate thermal management. At sustained 2W dissipation in a sealed enclosure, ambient can rise 30C above room. Provide at least 4 thermal vias under the central BGA exposed pad or thermal balls to spread heat into inner copper planes. Run junction temperature through the Quartus Prime Thermal Calculator to confirm headroom; aim for Tj below 90C at worst-case corner.
The 484-ball FBGA uses 1.0 mm ball pitch requiring 0.5 mm via capture pads and microvia stack-up for breakout routing. Route differential pairs (LVDS) with 100 ohm differential impedance and length matching within 20 ps. Place configuration flash and EPCS devices within 2 inches of the FPGA DATA, DCLK, and nCS pins. Keep JTAG chain length below 6 inches to avoid signal-integrity issues.
Do not assume the F484 and U484 packages share pinouts. Although both have 484 balls, the F484 (fine-pitch BGA) and U484 (ultra-fine BGA) differ in ball diameter, pitch, and PCB land pattern. Verify package code on the datasheet before reusing a layout. Cyclone 10 LP configuration is volatile - external flash is required for standalone boot. Forgetting nCONFIG pull-up causes intermittent boot failures.
Compliance-Informationen
RoHS and REACH compliance per distributor listings. Not AEC-Q100 qualified - this is a general industrial FPGA, not automotive grade. For AEC-Q100 variants look at 10CL055YU484A7G in the U484 package.