5M40ZE64A5N - MAX V 40 LE EQFP-64 5ns 40 Logic Elements | Intel
Teilenummer: 5M40ZE64A5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.41 | $1.205,00 |
| 1.000 | $2.18 | $2.180,00 |
5M40ZE64A5N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays on a single chip with a global interconnect fabric, sitting architecturally between small FPGAs and discrete logic gates. MAX V CPLDs use a 1.8 V core voltage with multi-voltage I/O support, making them ideal for bus-bridging and level-translation tasks between legacy 5 V, 3.3 V, 2.5 V, and 1.8 V subsystems without external level shifters.
Key features of the 5M40ZE64A5N include 40 Logic Elements organized as 2 Logic Array Blocks (LABs) of 20 LEs each, 30 maximum user I/O pins, 4 Kbits of user flash for customer-defined parameters and IDs, an integrated JTAG IEEE 1149.1 boundary-scan interface, and 1.8 V core with multi-voltage I/O supporting LVCMOS/LVTTL at 1.2 V to 3.3 V. The device is rated for the commercial temperature range of 0 C to +85 C.
Architecturally, the 5M40ZE64A5N uses a non-volatile flash-based configuration cell (instant-on at <1 ms typical), low-power design with sub-100 uA standby current on core, and four user I/O banks that can be independently powered for mixed-voltage interfacing. The interconnect is a continuous fast-path routing matrix with consistent 5 ns tPD across the device, eliminating the placement-dependent timing variation seen in many older CPLDs.
Typical applications include I/O expansion and bus bridging for microcontrollers, address decoding and chip-select logic in DSP and processor subsystems, power-up sequencing glue logic for FPGA-based designs, JTAG chain construction for board test, and level translation between mixed-voltage peripherals. Designers often pair the 5M40ZE64A5N with a host FPGA such as a Cyclone IV/V or a microcontroller like the NXP Kinetis to off-load deterministic glue logic.
A key design consideration is that the EQFP-64 footprint is the standard MAX V package at the 40-LE density point - engineers designing with the 40-LE MAX V family can substitute higher-density members such as 5M80Z, 5M160Z, or 5M240Z on the same board to add more logic without re-laying out the PCB. Always confirm I/O count and pinout against the MAX V device handbook before scaling density.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 5M40ZE64A5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5M40ZE64A5N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Programming Interface, Configuration Memory, Logic Elements (LE).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5M40ZE64C5N
✅ Drop-In✓ Auf Lager
$4.85 / Stück
Datenblatt ansehen →5M80ZE64A5N
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →5M160ZE64A5N
✅ Drop-In✓ Auf Lager
$6.2 / Stück
Datenblatt ansehen →5M160ZE64I5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.13 / Stück
Datenblatt ansehen →5M160ZE64C5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.95 / Stück
Datenblatt ansehen →5M40ZE64A5N Grenzwerte & elektrische Eigenschaften
| Series | MAX V |
| Device Family | MAX V (5M40Z) |
| Logic Elements (LE) | 40 |
| Logic Array Blocks (LAB) | 2 (20 LEs each) |
| Maximum User I/O | 30 |
| User Flash Memory | 4 Kbit |
| Pin-to-Pin Delay (tPD) | 5 ns (commercial speed grade) |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (4 banks) |
| Betriebstemperaturbereich | 0 C to +85 C (commercial) |
| Gehäuse | EQFP-64 (E64, 10x10 mm, 0.5 mm pitch) |
| Montageart | Surface Mount |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Configuration Method | On-chip non-volatile flash (instant-on) |
| RoHS-Status | Compliant (Pb-free) |
| MSL-Level | 3 (168 hours) |
5M40ZE64A5N eqfp-64 (e64, 10x10 mm, 0.5 mm pitch) Pinbelegungsleitfaden
Pinbelegung für 5M40ZE64A5N (eqfp-64 (e64, 10x10 mm, 0.5 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5M40ZE64A5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5M40ZE64A5N ist geeignet für 6 Anwendungs: I/O Expansion and Bus Bridging for Microcontrollers, Address Decoding and Chip-Select Generation, Power-Up Sequencing and Reset Distribution, JTAG Chain Construction and Board Test, Level Translation Between Mixed-Voltage Peripherals, Glue Logic for Industrial Control Systems.
I/O Expansion and Bus Bridging for Microcontrollers
The 5M40ZE64A5N's 40 Logic Elements and 30 user I/Os in EQFP-64 make it a low-cost glue-logic partner for microcontrollers that lack enough pins or dedicated peripheral channels. The four independently powered I/O banks let the CPLD bridge between a 3.3 V ARM Cortex-M4 host and 1.8 V or 2.5 V peripherals (sensors, FPGAs, displays) without external level shifters, while the on-chip flash enables instant-on configuration at <1 ms typical. The 5 ns pin-to-pin delay is fast enough for address decoding, register mapping, and interrupt steering in real-time embedded systems. Designers typically pair the 5M40Z with a host MCU such as NXP Kinetis or STM32, and reuse the same PCB footprint when scaling to 5M80Z or 5M160Z for higher logic demands.
Empfohlen
Address Decoding and Chip-Select Generation
The 5M40ZE64A5N excels at generating deterministic chip-select and address-decode logic for DSPs, memory banks, and peripheral devices in processor subsystems. Its 5 ns tPD across the device guarantees consistent timing that does not depend on placement, removing the variation engineers must budget for in larger FPGAs. With four I/O banks, the CPLD can interface with a 3.3 V processor bus while driving 5 V-tolerant inputs on legacy peripherals or 1.8 V SDRAM. The non-volatile configuration eliminates the need for an external boot PROM, reducing BOM cost and board area. Typical use cases include generating NAND/CE for external flash, decoding GPIO expansion addresses, and producing clock-enable signals.
Empfohlen
Power-Up Sequencing and Reset Distribution
The 5M40ZE64A5N is widely used as a power-up sequencer for FPGA-based designs, where multiple voltage rails (3.3 V, 2.5 V, 1.8 V, 1.2 V) must come up in a strict order to prevent latch-up or in-rush damage. Its instant-on flash-based configuration is ready within 1 ms of VCCINT ramp, allowing the CPLD to drive enable signals to downstream DC-DC converters well before the host FPGA begins configuration. The four I/O banks can each source or sink signals at different voltages, so one CPLD can manage sequencing for an entire board. Engineers pair it with sequencing supervisor ICs and dedicated voltage regulators to build a robust power-rail control subsystem with minimal firmware overhead.
Empfohlen
JTAG Chain Construction and Board Test
The 5M40ZE64A5N's built-in IEEE 1149.1 boundary-scan interface lets it sit in a JTAG chain as a buffer, multiplexer, or chain-steering element, enabling board-level interconnect testing on densely populated PCBs. With four JTAG-capable I/O banks, the CPLD can route TDI/TDO between a host boundary-scan controller and devices operating at different voltages, isolating chains by voltage domain. Its 40 LEs are sufficient to implement simple TDO steering or chain-fail isolation logic. Designers leverage the CPLD in production test fixtures to reduce ATE programming time and in field-programmable JTAG topology where chain membership changes with board configuration.
Empfohlen
Level Translation Between Mixed-Voltage Peripherals
The 5M40ZE64A5N provides flexible bidirectional level translation between subsystems operating at 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V, with each of its four I/O banks configurable to a different VCCIO. This eliminates the need for discrete voltage-level translator ICs and the associated BOM cost. The 5 ns tPD easily meets timing requirements for I2C, SPI, UART, and parallel bus bridging at moderate clock rates. Its 30 user I/Os can be partitioned across voltage domains, allowing a single device to act as a multi-channel translator. This makes the 5M40Z ideal for prototype boards that aggregate sensors, displays, and legacy peripherals operating at multiple voltages.
Empfohlen
Glue Logic for Industrial Control Systems
In industrial automation and motor-control subsystems, the 5M40ZE64A5N serves as deterministic glue logic between microcontrollers, gate drivers, sensor interfaces, and communication transceivers. Its commercial 0 C to +85 C temperature range covers most factory-floor enclosures, and the rugged EQFP-64 surface-mount package withstands industrial shock and vibration. The CPLD can debounce switch inputs, generate PWM enable signals, multiplex SPI buses to multiple sensors, and produce precise fault-interrupt pulses to the host MCU. The non-volatile instant-on configuration eliminates the boot-time vulnerability of SRAM-based alternatives, which is critical in safety-sensitive industrial systems.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5M40ZE64A5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5M40ZE64C5N | 5M80ZE64A5N | 5M160ZE64A5N | 5M160ZE64I5N | 5M160ZE64C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-64 (E64, 10x10 mm) | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same |
| Logic Elements (LE) | 40 | 40 (same) | 80 (+100%) | 160 (+300%) | 160 (+300%) | 160 (+300%) |
| Maximum User I/O | 30 | 30 (same) | 34 (+13%) | 52 (+73%) | 52 (+73%) | 52 (+73%) |
| Pin-to-Pin Delay (tPD) | 5 ns (A speed grade) | ~3.5 ns (C speed grade, faster) | 5 ns (A speed grade) | 5 ns (A speed grade) | 5 ns (I speed grade, industrial) | ~3.5 ns (C speed grade) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash Memory | 4 Kbit | 4 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Typical Unit Price (qty-100, USD) | 2.74 | 3.10 (faster grade, ~+13%) | 3.85 (+40%) | 5.20 (+90%) | 6.40 (+134%, industrial) | 5.85 (+114%) |
Wichtigste Unterscheidungsmerkmale
- Lowest-density MAX V option with full EQFP-64 footprint compatibility (vs. 5M80ZE64A5N)
- Same-package upgrade path to higher densities without PCB rework (vs. 5M160ZE64A5N)
- Instant-on non-volatile flash configuration (vs. SRAM-based small FPGAs)
Designhinweise
Estimated: power-supply design for the 5M40ZE64A5N requires a stable 1.8 V source for VCCINT and a separate VCCIO rail for each of the four I/O banks (1.2 V to 3.3 V). The MAX V datasheet specifies that core current at 40 MHz is roughly 10-15 mA active and <100 uA standby, so a small LDO such as a 200 mA LM1117-1.8 is sufficient. Place 100 nF X7R decoupling within 5 mm of every VCCINT/VCCIO pin pair. Power-up ramp should be monotonic; allow at least 1 ms after VCCINT stabilizes for internal flash initialization before any I/O toggles (per Altera MAX V handbook).
The EQFP-64 package is 10x10 mm with a 0.5 mm pitch and a 6.4x6.4 mm exposed pad (EPAD) that MUST be soldered to a continuous copper pour on the top layer. The EPAD is the primary heat-dissipation path for the CPLD; without it, junction temperature can rise 30-40 C under typical switching loads. The exposed pad should connect to a clean GND plane and use a 4x4 array of thermal vias (0.3 mm drill, 0.5 mm pitch) to a bottom-layer GND pour. Keep high-speed traces away from the EPAD area to maintain signal integrity on adjacent I/O banks.
Two common pitfalls with the 5M40ZE64A5N: (1) floating unused I/O pins - per Altera's recommendation, configure unused I/Os as outputs driving low or as inputs with internal weak pull-up enabled to prevent shoot-through current; do not leave them floating in the pin planner. (2) Mixing JTAG with multi-voltage I/O - the JTAG pins (TDI, TDO, TMS, TCK) reside in Bank 1 and follow Bank 1's VCCIO. If you operate JTAG at 1.8 V for a 1.8 V host, ensure Bank 1 VCCIO matches the JTAG voltage, otherwise boundary-scan operation will fail. Reference the MAX V Device Handbook pinout tables before finalizing the bank assignments.
Compliance-Informationen
RoHS compliant and Pb-free per Altera/Intel product page. Not AEC-Q100 qualified - select I-temp or A-temp MAX V variants (e.g., 5M40ZE64I5N) for automotive applications.
