88W8887-A2-NNWA/B - 1x1 802.11ac Wi-Fi 5 + BT 5.2 SoC | NXP
Teilenummer: 88W8887-A2-NNWA/B ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.95 | $7,95 |
| 10 | $7.15 | $71,50 |
| 100 | $6.45 | $645,00 |
| 500 | $5.85 | $2.925,00 |
| 1.000 | $5.3 | $5.300,00 |
88W8887-A2-NNWA/B Übersicht
A Wi-Fi + Bluetooth combo SoC is a wireless system-on-chip that integrates an RF transceiver, baseband modem, MAC, memory, and host interface in one device, sitting within the broader hierarchy of RF & wireless ICs -> wireless transceivers -> connectivity SoCs. Such devices eliminate the need for separate WLAN and BT chipsets, reducing board area, BOM cost, and RF design complexity.
Key features of the 88W8887 include dual-band 1x1 802.11ac operation up to 433 Mbps PHY rate, Bluetooth 5.2 with dual-mode support, and integrated front-ends that significantly reduce external RBOM count. According to NXP product information, the device was specifically designed to meet the speed, reliability, and quality needs of next-generation applications while minimizing space and power requirements. The automotive-qualified 88W8887 family variant supports demanding in-vehicle environments (AEC-Q100-qualified variants such as /AZ and /BZ are listed by distributors).
The integrated front-end architecture (PA, LNA, and T/R switching on-chip) simplifies RF layout and improves transmit/receive chain matching consistency across production units. The single-chip approach also shortens design cycles by removing the need for external front-end module integration. Power-optimized operation supports always-on wireless connectivity scenarios in vehicles, including telematics, infotainment backhaul, and soft access point operation.
Typical applications include automotive telematics and infotainment connectivity, industrial IoT gateways, smart access points, and embedded Wi-Fi/BT modules for next-generation connected devices requiring simultaneous high-throughput WLAN and BLE links.
A key design consideration is the RF section: the 72-VFQFN exposed-pad package requires careful ground return via placement under the exposed pad, and the antenna interface impedance matching should follow the NXP reference design to achieve rated 802.11ac performance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer product brief.
Drop-in-Alternativen für 88W8887-A2-NNWA/B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
88W8887-A2-NNWA/AZ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W8887-A2-NNWA/BZ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W8887-A2-NNWA/CZ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W8887-A2-NNWA/AK
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W8887-A2-NNW2A005
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W8887-A2-NNWA/MP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W8887-A2-NNWA/B Technische Daten
| Product Type | Wi-Fi 5 + Bluetooth 5.2 connectivity SoC |
| WLAN Standard | IEEE 802.11ac (Wi-Fi 5), 1x1 |
| Bluetooth Version | Bluetooth 5.2 (dual-mode) |
| Frequency Bands | 2.4 GHz and 5 GHz |
| Antenna Configuration | 1x1 SISO |
| Integrated Front-End | Yes (reduces external RBOM) |
| Additional Radio | FM receive + NFC (family variants) |
| Gehäuse | 72-VFQFN Exposed Pad |
| Montageart | Surface Mount |
| Applications Segment | Automotive / industrial connectivity |
| Qualification | AEC-Q100 qualified variants (/AZ, /BZ) |
88W8887-A2-NNWA/B 72-vfqfn exposed pad Pinbelegungsleitfaden
Pinbelegung für 88W8887-A2-NNWA/B (72-vfqfn exposed pad-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für 88W8887-A2-NNWA/B.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
88W8887-A2-NNWA/B ist geeignet für 6 Anwendungs: Automotive Telematics & Connectivity, In-Vehicle Infotainment (IVI) Systems, Industrial IoT Gateways, Smart Access Points & Soft AP, Embedded Wireless Modules, Fleet Management & Asset Tracking.
Automotive Telematics & Connectivity
The 88W8887-A2-NNWA/B fits automotive telematics units because it merges dual-band 1x1 802.11ac Wi-Fi 5 with Bluetooth 5.2 in one AEC-Q100-family device, reducing board area and external RBOM through integrated front-ends. NXP explicitly positions this family for in-vehicle connectivity, where 5 GHz 802.11ac throughput (up to 433 Mbps PHY class) backhauls infotainment content while BLE 5.2 handles low-power accessories. Placed as the wireless front end of a telematics control unit with the antenna matched per the NXP reference design, it provides a single-chip radio chain; the trade-off is 1x1 SISO throughput versus 2x2 solutions, acceptable for companion connectivity where power and space dominate.
Empfohlen
In-Vehicle Infotainment (IVI) Systems
IVI head units require simultaneous high-throughput WLAN screen mirroring and Bluetooth audio. The 88W8887 delivers 802.11ac 5 GHz performance for Wi-Fi Display/Miracast streams while its Bluetooth 5.2 controller handles hands-free and A2DP audio, all from a single chip. Its integrated PA/LNA front-end simplifies RF layout within the dense IVI environment, improving production consistency versus discrete front-end modules. The exposed-pad 72-VFQFN provides good thermal and ground performance for the always-on duty cycle of a head unit. Designers should budget for the 1x1 SISO ceiling when planning multi-passenger concurrent streaming, and use NXP combo firmware coexistence scheduling to keep BT audio jitter-free during heavy WLAN traffic.
Empfohlen
Industrial IoT Gateways
Industrial gateways benefit from the 88W8887 combination of dual-band WLAN and BLE 5.2: 2.4 GHz provides wall-penetrating coverage for sensor clusters while 5 GHz 802.11ac backhauls aggregated telemetry at high rate. The single-chip SoC reduces gateway BOM versus separate Wi-Fi and BT parts, and integrated front-ends cut matching-component count on crowded industrial PCBs. Its automotive pedigree (AEC-Q100 qualified variants) signals robustness suitable for factory-floor temperature and vibration environments. Typical deployment places the SoC behind an industrial Linux host over SDIO/PCIe-class interface, with the exposed pad tied to a solid ground pour. The power-optimized design suits fanless, passively cooled enclosures where thermal budget is constrained.
Empfohlen
Smart Access Points & Soft AP
For compact soft-AP products - travel routers, vehicle hotspots, and guest-access dongles - the 88W8887 provides the complete 2.4/5 GHz 802.11ac radio plus a Bluetooth controller for provisioning, eliminating a second radio chip. NXP notes the integrated front-end significantly reduces RBOM, which shrinks the RF section of cost-sensitive AP hardware. In soft-AP mode, the 1x1 802.11ac link serves a handful of concurrent clients at Wi-Fi 5 speeds sufficient for internet sharing and local media. BLE provisioning via the same chip simplifies first-time setup flows on mobile apps. Designers should follow the NXP antenna matching network exactly, since integrated PA output matching tolerance drives regulatory conducted-power compliance across production lots.
Empfohlen
Embedded Wireless Modules
Module manufacturers building Wi-Fi + BT combination modules can base designs on the 88W8887 to obtain 802.11ac Wi-Fi 5 and Bluetooth 5.2 with minimal external RF components, thanks to the on-chip front-end. This shortens module design cycles and shrinks the castellated-edge module footprint, since the 72-VFQFN exposed-pad SoC is the only RF IC on the board. Regulatory pre-scans are simplified because fewer external gain stages vary between builds. Modules aimed at automotive Tier-1 customers can use the AEC-Q100-qualified /AZ suffix silicon to inherit qualification headroom. Typical companion circuitry includes a power-management IC for the radio rails and a shield-can-friendly layout that keeps the antenna feed short and referenced to a clean ground region.
Empfohlen
Fleet Management & Asset Tracking
Fleet trackers increasingly double as in-cab Wi-Fi hotspots and driver smartphone peripherals. The 88W8887 supports both roles from one chip: BLE 5.2 pairs with driver devices for keyless and configuration functions, while dual-band Wi-Fi 5 provides cabin internet from the vehicle LTE modem. Its low-power, space-minimized design suits compact telematics boxes behind the dashboard, and the automotive-qualified variants give reliability margins for wide temperature extremes in windshield- or A-pillar-mounted units. Integrated front-ends remove the need for an external FEM, keeping the tracker PCB within two layers of RF complexity. The trade-off remains the 1x1 throughput ceiling, which is acceptable for a handful of concurrent cabin clients.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 88W8887-A2-NNWA/B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 88W8887-A2-NNWA/AZ | 88W8887-A2-NNWA/BZ | 88W8887-A2-NNWA/CZ | 88W8887-A2-NNWA/AK |
|---|---|---|---|---|---|
| Package | 72-VFQFN Exposed Pad | 72-VFQFN EP - same | 72-VFQFN EP - same | 72-VFQFN EP - same | 72-VFQFN EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| WLAN Standard | 802.11ac (Wi-Fi 5), 1x1 | 802.11ac, 1x1 | 802.11ac, 1x1 | 802.11ac, 1x1 | 802.11ac, 1x1 |
| Bluetooth Version | Bluetooth 5.2 | Bluetooth 5.2 | Bluetooth v4.2 dual mode (DigiKey listing) | BT combo (Mouser listing) | Bluetooth 5.x combo |
| Frequency Bands | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz |
| Integrated Front-End | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active | NRND (not recommended for new designs) |
| Additional Radio Features | Family supports FM receive (+NFC in some variants) | WLAN + BT | WLAN + BT | 11ac + BT + FM + NFC (Mouser) | WLAN + BT combo |
Wichtigste Unterscheidungsmerkmale
- Bluetooth 5.2 support versus older combo silicon (vs. 88W8887-A2-NNWA/BZ (DigiKey lists BT v4.2 dual mode))
- Automotive AEC-Q100-qualified tray variant available (vs. 88W8887-A2-NNWA/MP)
- Integrated front-ends reduce external RBOM versus discrete-FEM designs (vs. 88W8897-B0-CBK2-T (sibling comparison part))
Designhinweise
The 72-VFQFN exposed-pad package requires a solid ground connection under the exposed pad. Use an array of at least 3x3 (9) vias under the pad tied to a continuous ground plane to minimize RF ground inductance and dissipate die heat. Keep the 2.4 GHz and 5 GHz antenna feedlines as 50-ohm coplanar waveguide with a short, direct route from the SoC RF pin to the matching network, and reference the NXP reference design matching component values exactly - integrated front-end output matching affects both conducted power and EMI regulatory compliance.
Wireless SoCs draw burst currents during transmit bursts at the peak of the 802.11ac PA duty cycle. Place low-ESR bulk capacitance (10 uF ceramic) plus 0.1 uF high-frequency decoupling at each supply pin per the NXP datasheet recommendation, and keep the power rail routed from a dedicated LDO or PMIC rail capable of handling TX burst transients without droop. Undervoltage during PA bursts manifests as reduced throughput and retry storms on the WLAN link; verify supply ripple under TX load during bring-up.
Do not assume all 88W8887 suffix codes are identical: the /AZ is documented as the AEC-Q100 automotive tray variant, while other suffixes differ in packing and qualification. The /MP suffix is marked NRND and must not be used in new designs. Bluetooth capability is listed by DigiKey as v4.2 dual mode for the /BZ while NXP advertises BT 5.2 for the family - firmware version determines the effective BT feature set, so confirm the target firmware release before committing the design.
Compliance-Informationen
Arrow lists 88W8887-A2-NNWA/AZ as automotive AEC-Q100. RoHS/REACH status for the specific /B suffix not stated in provided data - confirm on the NXP product page.
