88W9098 - 2x2 Wi-Fi 6 + Bluetooth 5.3 SoC | NXP
Teilenummer: 88W9098 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $15.1 | $15,10 |
| 10 | $14.4 | $144,00 |
| 100 | $13.8 | $1.380,00 |
| 500 | $13.4 | $6.700,00 |
| 1.000 | $13.05 | $13.050,00 |
88W9098 Übersicht
A wireless SoC (System-on-Chip) integrates the RF transceiver, baseband modem, MAC, and often the host interface into a single semiconductor device, sitting at the top of the wireless connectivity hierarchy: SoC -> wireless transceiver IC -> wireless chipset -> RF integrated circuit. This level of integration eliminates the need for discrete baseband and MAC devices, shrinking BOM count and board area for Wi-Fi product designs.
Key features of the 88W9098 include concurrent operation of two independent Wi-Fi radios plus dual-mode Bluetooth 5.3 on one chip, gigabit-level throughput enabled by 802.11ax OFDMA and MU-MIMO technology, dual-band 2.4 GHz and 5 GHz coverage, and a 148-VFQFN dual-row exposed-pad package for thermal and RF performance in compact designs.
Architecturally, the 88W9098 was the industry-first Wi-Fi 6 combo SoC with this concurrent dual-Wi-Fi, dual-Bluetooth architecture, meaning it can serve as an access point on one band while simultaneously acting as a station or maintaining Bluetooth Classic and BLE links. This concurrency enables gateway, mesh backhaul, and client functions to run at the same time without time-slicing penalties.
Typical applications include IoT gateways and hubs, enterprise and residential Wi-Fi access points, industrial wireless infrastructure, and embedded connectivity in smart home and industrial equipment where gigabit-level Wi-Fi 6 performance, reliability, and security are required.
Design consideration: the 88W9098 is packaged in a fine-pitch dual-row VFQFN and requires careful RF layout, impedance-controlled antenna routing, and exposed-pad thermal grounding; also note NXP reports long lead times (52-99 weeks on some orderables), so plan sourcing early.
This page synthesizes distributor pricing, orderability data, same-family variants, and practical sourcing notes not found in the manufacturer product page.
Drop-in-Alternativen für 88W9098 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 88W9098 (gleiche Bauform und Footprint) – abweichend in Antenna Configuration, Architecture, Frequency Bands.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
88W9098-A2-NYGC/MP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W9098-A2-NYKC/MP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W9098-A2-NYKC
✅ Drop-In✓ Auf Lager
$13.05 / Stück
Datenblatt ansehen →88W9098-A2-NYKC/AK
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W9098-A1-NYGC/AK
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
88W9098 Technische Daten
| Product Type | Wi-Fi 6 + Bluetooth 5.3 Wireless SoC |
| Wi-Fi Standard | IEEE 802.11ax (Wi-Fi 6) |
| Bluetooth Version | Bluetooth 5.3 (dual-mode, BR/EDR + BLE) |
| Frequency Bands | 2.4 GHz and 5 GHz |
| Antenna Configuration | 2x2 (dual spatial streams) |
| Architecture | Concurrent dual Wi-Fi + dual-mode Bluetooth |
| Throughput Class | Gigabit-level performance |
| Target Markets | IoT, Access, Industrial |
| Gehäuse | 148-VFQFN Dual Rows, Exposed Pad |
| Montageart | Surface Mount |
| Silicon Revision (representative orderable) | A1 and A2 |
| Packing (88W9098-A2-NYKC) | REEL - Reel 13 inch Q2/T3 in Drypack |
| Minimum Package Quantity (88W9098-A2-NYKC) | 2000 |
| Minimum Order Quantity (88W9098-A2-NYGC) | 168 (tray) |
| Budgetary Price | $13.05 USD at 1K quantity (as of 2026-10-10) |
| Lead Time (88W9098-A2-NYKC) | 52 weeks |
| Lead Time (88W9098-A2-NYGC) | 99 weeks |
88W9098 2000 Pinbelegungsleitfaden
Pinbelegung für 88W9098 (2000-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für 88W9098.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
88W9098 ist geeignet für 6 Anwendungs: IoT Gateways and Hubs, Wi-Fi Access Points, Industrial Wireless Infrastructure, Smart Home Devices, Mesh Wi-Fi Systems, Embedded Wi-Fi + BT Connectivity Modules.
IoT Gateways and Hubs
The 88W9098 fits IoT gateways because its concurrent dual Wi-Fi architecture lets one 2x2 radio backhaul to the cloud on 5 GHz while the second radio serves local 2.4 GHz nodes, and its dual-mode Bluetooth 5.3 provides an out-of-band provisioning and commissioning channel. With Wi-Fi 6 (802.11ax) OFDMA, a gateway can aggregate many low-duty sensor clients efficiently, and gigabit-level throughput supports video and edge-compute traffic. The trade-off is the 148-VFQFN dual-row package's RF layout demands and the 52-99 week NXP lead time, so design-in planning and buffer stock are essential for gateway products.
Empfohlen
Wi-Fi Access Points
For residential and enterprise access points, the 88W9098 provides 2x2 dual-band Wi-Fi 6 with MU-MIMO and OFDMA, delivering gigabit-level throughput and improved client density handling. Its industry-first concurrent dual Wi-Fi design allows simultaneous AP and station or mesh backhaul operation on one SoC, removing the need for a second discrete radio in mesh nodes and extenders. Bluetooth 5.3 enables easy setup via smartphone apps. Engineers should budget exposed-pad thermal grounding and impedance-controlled antenna routing in the RF layout, and should qualify the A2 silicon revision for production errata coverage.
Empfohlen
Industrial Wireless Infrastructure
NXP explicitly targets the Industrial market with the 88W9098. In factory wireless infrastructure, its Wi-Fi 6 target wake time and OFDMA scheduling reduce airtime contention among many polled devices, while 5 GHz operation avoids the crowded 2.4 GHz band typical of brownfield plants. The concurrent dual-radio capability supports parallel control and monitoring networks on one chip, and Bluetooth 5.3 supports commissioning tools. Industrial deployments should select the AK-grade orderable for extended temperature qualification and account for the long factory lead time in spare-part planning.
Empfohlen
Smart Home Devices
High-bandwidth smart home products such as security cameras, video doorbells, and streaming media hubs benefit from the 88W9098's dual-band 2x2 Wi-Fi 6 throughput and Bluetooth 5.3 setup flow. OFDMA and uplink scheduling maintain stable camera streams in congested RF environments, and target wake time reduces idle power for battery-assisted devices. The SoC's integrated architecture reduces BOM count versus discrete baseband plus radio designs. Designers must accommodate the 148-VFQFN dual-row footprint's antenna keep-out and exposed-pad grounding in compact consumer enclosures.
Empfohlen
Mesh Wi-Fi Systems
Mesh routers and extenders are a natural fit: the 88W9098 can dedicate one 2x2 radio to wireless backhaul while the second serves client stations concurrently, achieving simultaneous backhaul and access without time-slicing a single radio. Wi-Fi 6 features such as OFDMA and BSS coloring improve coexistence in dense multi-node mesh deployments, and gigabit-level throughput preserves backhaul capacity for multi-gigabit fiber plans. For product lines, qualifying both the A2-NYGC tray and A2-NYKC reel orderables provides sourcing flexibility given the 52-99 week lead times.
Empfohlen
Embedded Wi-Fi + BT Connectivity Modules
Module makers (for example, designs built around the 88W9098 such as Ezurio and Murata-based M.2 connectivity modules referenced in the verified data) integrate the SoC to offer drop-in Wi-Fi 6 + Bluetooth 5.3 connectivity to OEM customers. The SoC's concurrent dual-radio architecture allows modules certified for both infrastructure and client roles, and Bluetooth 5.3 covers BLE provisioning. Module designers should implement the exposed pad as the primary RF ground, follow NXP's hardware design package for pinout and reference clock routing, and plan for the part's minimum order quantities (168 tray / 2000 reel).
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 88W9098 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 88W9098-A2-NYGC/MP | 88W9098-A2-NYKC/MP | 88W9098-A2-NYKC/AK | 88W9098-A1-NYGC/AK |
|---|---|---|---|---|---|
| Package | 148-VFQFN Dual Rows, Exposed Pad | 148-VFQFN Dual Rows, Exposed Pad - same | 148-VFQFN Dual Rows, Exposed Pad - same | 148-VFQFN Dual Rows, Exposed Pad - same | 148-VFQFN Dual Rows, Exposed Pad - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wi-Fi Standard | 802.11ax (Wi-Fi 6), 2x2 | 802.11ax, 2x2 | 802.11ax, 2x2 | 802.11ax, 2x2 | 802.11ax, 2x2 |
| Bluetooth Version | Bluetooth 5.3 dual-mode | Bluetooth 5.3 | Bluetooth 5.3 | Bluetooth 5.3 | Bluetooth 5.x (A1 revision, datasheet-dependent) |
| Silicon Revision | A2 (latest) | A2 | A2 | A2 | A1 (earlier) |
Wichtigste Unterscheidungsmerkmale
- Industry-first concurrent dual Wi-Fi + dual-mode Bluetooth architecture (vs. 88W9098-A1-NYGC/AK (and all single-radio combo SoCs))
- Latest A2 silicon revision (vs. 88W9098-A1-NYGC/AK)
- Wi-Fi 6 (802.11ax) with gigabit-level throughput (vs. Legacy 802.11ac/n combo SoCs)
Designhinweise
The 88W9098 uses a fine-pitch 148-VFQFN dual-row package with exposed pad. Solder the exposed pad to a grounded thermal land with an array of vias to internal ground planes - this is both the primary RF ground return and the main heat removal path. Follow NXP's hardware design package for the dual-row breakout, antenna port impedance control (50-ohm microstrip/stripline), and keep-out zones around RF pins. Obtain the datasheet and hardware design guide from the NXP product page (account-gated) before starting layout.
Distinguish silicon revisions and ordering suffixes carefully: 88W9098-A1 versus A2 denote different silicon revisions with potentially different errata and firmware support, and suffixes NYGC/NYKC and AK/MP encode package/temperature and ordering grade. Ordering the wrong orderable can mean an unsupported revision or wrong temperature grade. Verify firmware compatibility with your chosen revision on the NXP software portal, and confirm packing (tray MOQ 168 vs reel MOQ 2000) matches your production volume.
Wi-Fi 6 SoCs exhibit high peak transmit current bursts during 2x2 OFDM transmissions. Provide a low-impedance supply with bulk capacitance near the RF power pins and follow NXP reference design decoupling. Sequence the radio's power domains per the hardware design guide, and consider a load switch (such as an NXP NX5P2553GV) for clean power-up. Budget thermal margin for sustained concurrent dual-radio operation, which raises average dissipation versus single-radio duty.
Keep the 2.4 GHz and 5 GHz antenna feed lines short, impedance-controlled, and routed away from switching regulators and crystal circuits. Isolate each antenna port's ground return to prevent inter-radio coupling, since the concurrent dual-Wi-Fi architecture means both chains can transmit simultaneously. Shield-sensitive analog supplies and follow the module reference designs (e.g., Murata/Ezurio 88W9098-based modules) for proven layouts.
Compliance-Informationen
RoHS/REACH declarations not present in the provided web data. Consult NXP's official compliance documentation for each specific orderable (88W9098-A2-NYKC, 88W9098-A2-NYGC/AK).
