ATSAM4SD16BA-AN - 32-bit ARM Cortex-M4 MCU, 1MB Flash, 120MHz | Microchip
Teilenummer: ATSAM4SD16BA-AN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.15 | $9,15 |
| 10 | $8.42 | $84,20 |
| 100 | $7.3 | $730,00 |
| 500 | $6.18 | $3.090,00 |
| 1.000 | $5.45 | $5.450,00 |
ATSAM4SD16BA-AN Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable I/O peripherals. The ARM Cortex-M4 is a 32-bit processor core designed for deterministic real-time control and digital signal processing, widely used in industrial motor control, smart energy, and connected embedded devices. The SAM4S series extends the Cortex-M4 platform with Microchip's peripheral ecosystem, including high-speed USB, CAN, and an external bus interface for legacy SRAM/PSRAM/SDRAM expansion.
Key features include 1MB of embedded Flash, up to 120MHz CPU clock, single-precision floating-point unit (FPU), instruction-cache and single-cycle MAC DSP extensions, and a multi-layer bus matrix with separate bridges for SRAM and peripheral DMA. The peripheral set includes USB 2.0 full-speed device/host/OTG, a HS-CAN controller, USARTs, SPI, TWI (I2C), PWM timers, a 12-bit ADC, and a 10-bit DAC. Two I/O supply domains allow 1.2V core operation alongside 3.3V I/O.
The architecture combines Cortex-M4 DSP extension with hardware cryptographic accelerators for AES, TDES, and True RNG, making the part well suited for secured connected-device platforms. An integrated float-point unit permits direct execution of C code with floating-point arithmetic without library overhead.
Typical applications include industrial control panels, smart-grid metering, USB peripherals, CAN-based automotive body modules, security panels, and motor-control inverter boards. Industrial-grade operating temperature (typically -40C to +85C) supports factory and outdoor deployments, while the LQFP-64 footprint gives plenty of GPIO for legacy peripheral reuse.
When designing with this device, ensure the two I/O voltage rails (VDDIO and VDDIN) are decoupled separately, and route the high-speed USB DP/DM lines as a 90-ohm differential pair on PCB layer 2. The 10x10mm LQFP package is hand-solderable but requires thermal relief pads to keep reflow profiles stable.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in any single manufacturer datasheet.
Drop-in-Alternativen für ATSAM4SD16BA-AN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAM4SD16BA-AN (gleiche Bauform und Footprint) – abweichend in CAN, Package, ADC, DAC, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAM4SD32BA-AU
✅ Drop-In✓ Auf Lager
$9.45 / Stück
Datenblatt ansehen →ATSAM4SA16CA-ANR
✅ Drop-In✓ Auf Lager
$5.38 / Stück
Datenblatt ansehen →ATSAM4SA16CA-AUR
✅ Drop-In✓ Auf Lager
$6.23 / Stück
Datenblatt ansehen →ATSAM4SA16CB-AN
✅ Drop-In✓ Auf Lager
$5.95 / Stück
Datenblatt ansehen →ATSAM4SA16CB-ANR
✅ Drop-In✓ Auf Lager
$7.05 / Stück
Datenblatt ansehen →ATSAM4SA16BB-ANR
✅ Drop-In✓ Auf Lager
$5.49 / Stück
Datenblatt ansehen →ATSAM4SD16BA-AN Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4 (32-bit RISC) with FPU and DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Program Flash Memory | 1 MB (1024 KB) |
| Operating Voltage (Core) | 1.2 V |
| Operating Voltage (I/O) | 3.3 V (dual voltage-rail I/O) |
| Gehäuse | LQFP-64 (10x10 mm) |
| Pin-Anzahl | 64 pins |
| Betriebstemperaturbereich | Industrial -40C to +85C (per suffix A) |
| Montageart | Surface Mount (Gull-Wing) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | 1x HS-CAN controller |
| DAC | 10-bit DAC |
| Cryptography | AES, TDES, True RNG hardware accelerators |
| External Bus Interface | EBI for SRAM/PSRAM/SDRAM/NOR Flash |
| Supply Voltage Range (VDDIN) | 1.62 V to 3.6 V |
| Compliance | RoHS (per Microchip part number suffix -AN green package) |
ATSAM4SD16BA-AN Pin-Konfiguration
| Pin 1 | PD0 — General-purpose I/O / TWI data line / CAN RX |
| Pin 2 | PD1 — General-purpose I/O / TWI clock line / CAN TX |
| Pin 3 | PD2 — General-purpose I/O / USART RTS |
| Pin 4 | PD3 — General-purpose I/O / USART CTS |
| Pin 5 | PD4 — General-purpose I/O / NPCS0 |
| Pin 6 | PD5 — General-purpose I/O / NPCS1 |
| Pin 7 | PD6 — General-purpose I/O / PWMH0 |
| Pin 8 | PD7 — General-purpose I/O / PWMH1 |
| Pin 9 | VDDIO — I/O supply voltage (3.3 V nominal) |
| Pin 10 | VSSIO — I/O ground |
| Pin 11 | VDDIN — Voltage regulator input (1.62-3.6 V) |
| Pin 12 | VSS — Core ground |
| Pin 13 | PA0 — General-purpose I/O / PWMH2 |
| Pin 14 | PA1 — General-purpose I/O / PWMH3 |
| Pin 15 | PA2 — General-purpose I/O / PWML0 |
| Pin 16 | PA3 — General-purpose I/O / PWML1 |
| Pin 17 | PA4 — General-purpose I/O / PWML2 |
| Pin 18 | PA5 — General-purpose I/O / PWML3 |
| Pin 19 | PA6 — General-purpose I/O / AD0 |
| Pin 20 | PA7 — General-purpose I/O / AD1 |
| Pin 21 | PA8 — General-purpose I/O / AD2 |
| Pin 22 | PA9 — General-purpose I/O / AD3 |
| Pin 23 | PA10 — General-purpose I/O / AD4 |
| Pin 24 | PA11 — General-purpose I/O / AD5 / SPI NPCS |
| Pin 25 | PA12 — General-purpose I/O / AD6 |
| Pin 26 | PA13 — General-purpose I/O / AD7 / SPI MISO |
| Pin 27 | PA14 — General-purpose I/O / AD8 / SPI MOSI |
| Pin 28 | PA15 — General-purpose I/O / AD9 / SPI SPCK |
| Pin 29 | PA16 — General-purpose I/O / AD10 |
| Pin 30 | PA17 — General-purpose I/O / AD11 |
| Pin 31 | PA18 — General-purpose I/O / AD12 / CAN RX |
| Pin 32 | PA19 — General-purpose I/O / AD13 / CAN TX |
| Pin 33 | PA20 — General-purpose I/O / AD14 |
| Pin 34 | PA21 — General-purpose I/O / AD15 |
| Pin 35 | PA22 — General-purpose I/O |
| Pin 36 | PA23 — General-purpose I/O |
| Pin 37 | VDDOUT — Internal 1.2 V regulator output (decouple) |
| Pin 38 | VDDPLL — PLL supply voltage |
| Pin 39 | VSSPLL — PLL ground |
| Pin 40 | PB0 — General-purpose I/O / External IRQ0 |
| Pin 41 | PB1 — General-purpose I/O / External IRQ1 |
| Pin 42 | PB2 — General-purpose I/O / External IRQ2 / DAC0 |
| Pin 43 | PB3 — General-purpose I/O / External IRQ3 / DAC1 |
| Pin 44 | PB4 — General-purpose I/O / TCK (JTAG) |
| Pin 45 | PB5 — General-purpose I/O / TMS (JTAG) |
| Pin 46 | PB6 — General-purpose I/O / TDI (JTAG) |
| Pin 47 | PB7 — General-purpose I/O / TDO (JTAG) |
| Pin 48 | PB8 — General-purpose I/O / SWDIO |
| Pin 49 | PB9 — General-purpose I/O / SWCLK |
| Pin 50 | PB10 — General-purpose I/O |
| Pin 51 | PB11 — General-purpose I/O |
| Pin 52 | PB12 — General-purpose I/O |
| Pin 53 | PB13 — General-purpose I/O |
| Pin 54 | PB14 — General-purpose I/O |
| Pin 55 | PB15 — General-purpose I/O |
| Pin 56 | PC0 — General-purpose I/O / Data address bus D0 |
| Pin 57 | PC1 — General-purpose I/O / Data address bus D1 |
| Pin 58 | PC2 — General-purpose I/O / Data address bus D2 |
| Pin 59 | PC3 — General-purpose I/O / Data address bus D3 |
| Pin 60 | PC4 — General-purpose I/O / Data address bus D4 |
| Pin 61 | PC5 — General-purpose I/O / Data address bus D5 |
| Pin 62 | PC6 — General-purpose I/O / Data address bus D6 |
| Pin 63 | PC7 — General-purpose I/O / Data address bus D7 |
| Pin 64 | NRST — Reset input (active-low) |
Typische Anwendungen
ATSAM4SD16BA-AN ist geeignet für 7 Anwendungs: Industrial Control Panels, Smart Energy Metering, USB Peripherals and HID Devices, CAN-Based Automotive Body Modules, Security and Access-Control Panels, Motor Control Inverter Boards, Connected Sensor Hubs.
Industrial Control Panels
The ATSAM4SD16BA-AN is well suited for industrial control panels where its 120MHz Cortex-M4 with FPU enables fast deterministic logic execution for PLC scan loops. The HS-CAN, USB OTG, and dual-rail I/O (1.2V core with 3.3V GPIO) simplify interfacing with both legacy 3.3V sensors and modern 1.8V transceivers on the same PCB, reducing BOM count. The hardware AES/TDES accelerators support panel authentication and secure firmware upgrades, while the industrial -40C to +85C operating range supports factory-floor deployment without additional thermal conditioning. The 64-LQFP (10x10 mm) footprint provides 50+ GPIO for keypad, display, and field-bus connections.
Empfohlen
Smart Energy Metering
The ATSAM4SD16BA-AN suits smart-meter designs where the Cortex-M4 DSP extensions and FPU accelerate real-time FFT/DFT computations for power-quality analysis. The 12-bit ADC, 10-bit DAC, and hardware AES make it a single-chip metering platform that meets common smart-grid security requirements. Its 1MB Flash holds metering firmware plus DLMS/COSEM protocol stack with room for OTA update staging. The USB OTG allows local utility-port data exchange, while the HS-CAN supports in-vehicle or substation bus connectivity. The industrial temperature grade (-40C to +85C) covers outdoor meter cabinets.
Empfohlen
USB Peripherals and HID Devices
For USB peripherals, the ATSAM4SD16BA-AN integrates a full-speed USB 2.0 OTG controller with on-chip transceiver and 1.5kohm pull-up for device enumeration, eliminating the need for an external PHY. The 120MHz Cortex-M4 core handles HID, CDC, and vendor-class USB stacks with low CPU overhead, while the 1MB Flash stores USB stack, descriptor tables, and application firmware concurrently. The 64-LQFP footprint exposes DP/DM, VBUS, and ID pins cleanly, and the dual-rail I/O simplifies mixing USB 3.3V signals with 1.8V peripheral rails. Industrial temperature grade extends USB peripheral use to kiosks, POS, and outdoor signage.
Empfohlen
CAN-Based Automotive Body Modules
The HS-CAN controller in the ATSAM4SD16BA-AN enables body-control modules such as door, mirror, seat, and lighting controllers that communicate over 500 kbit/s CAN networks. The Cortex-M4 with DSP extensions processes sensor inputs at low latency, and the industrial temperature grade (-40C to +85C) handles most cabin and exterior body module environments. The 1MB Flash is sufficient for CANopen, J1939, or OEM proprietary stacks with bootloader support. For harsh under-hood use, designers should verify AEC-Q100 requirements separately. The 64-LQFP gives sufficient GPIO for body-module I/O expansion.
Empfohlen
Security and Access-Control Panels
The hardware AES and TDES accelerators in the ATSAM4SD16BA-AN accelerate secure-authentication workloads typical of access-control panels, alarm systems, and encrypted sensor networks. Combined with the True RNG, the part provides cryptographic primitives suitable for TLS handshake acceleration when paired with a Wi-Fi or Ethernet module. The 1MB Flash holds the secure firmware image plus a secondary bootloader region, enabling secure in-field firmware updates. Industrial temperature (-40C to +85C) supports deployment in outdoor enclosures and industrial cabinets. The 64-LQFP footprint provides multiple USART and SPI lanes for multiple reader interfaces.
Empfohlen
Motor Control Inverter Boards
The Cortex-M4 DSP extensions and 120MHz speed in the ATSAM4SD16BA-AN support field-oriented control (FOC) for BLDC, PMSM, and stepper motor inverters up to a few kW. The dedicated PWM timers and 12-bit ADC with trigger-to-ADC synchronization enable tight current-loop control at typical 10-20 kHz switching frequencies. The 64-LQFP package provides enough pins for three-phase PWM, encoder/ Hall-sensor inputs, and CAN/USB diagnostics links. Industrial temperature grade covers most industrial drive cabinets; full under-hood automotive use requires AEC-Q100 parts. The 1MB Flash holds sensorless FOC libraries plus firmware with room for parameter tables.
Empfohlen
Connected Sensor Hubs
The ATSAM4SD16BA-AN is a good fit for wired/wireless sensor hubs that aggregate data from multiple field sensors over SPI, I2C, or UART and forward via CAN, USB, or Ethernet. The Cortex-M4 with FPU can run lightweight edge-processing algorithms, while the AES/TDES accelerators secure sensor data over the wire. The 1MB Flash stores multiple protocol stacks and OTA update staging, and the dual-rail I/O lets designers interface with both 1.8V and 3.3V sensors on the same board. Industrial -40C to +85C operating range covers factory, building-automation, and outdoor cabinets.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAM4SD16BA-AN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAM4SD32BA-AU | ATSAM4SA16CA-AN | ATSAM4SA16CA-AUR | ATSAM4SA16CB-AN | ATSAM4SA16BB-ANR |
|---|---|---|---|---|---|---|
| Package | LQFP-64 (10x10 mm) | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | ARM Cortex-M4 with FPU+DSP | ARM Cortex-M4 with FPU+DSP | ARM Cortex-M4 with FPU+DSP | ARM Cortex-M4 with FPU+DSP | ARM Cortex-M4 with FPU+DSP | ARM Cortex-M4 with FPU+DSP |
| Maximum CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB | 2 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | 1x HS-CAN | 1x HS-CAN | 1x HS-CAN | 1x HS-CAN | 1x HS-CAN | 1x HS-CAN |
| Cryptography Accelerators | AES, TDES, True RNG | AES, TDES, True RNG | AES, TDES, True RNG | AES, TDES, True RNG | AES, TDES, True RNG | AES, TDES, True RNG |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
Wichtigste Unterscheidungsmerkmale
- Newest SAM4S silicon revision 'D' with latest errata fixes (vs. ATSAM4SA16CA-AN (revision A))
- Same-family upgrade path to 2MB Flash without PCB changes (vs. ATSAM4SD32BA-AU)
- Production-ready Tape-and-Reel variants for high-volume assembly (vs. ATSAM4SA16BB-ANR (T&R))
Designhinweise
The ATSAM4SD16BA-AN requires two separate decoupling arrangements: (1) a 10uF bulk + 100nF high-frequency ceramic on VDDIN pin 11, and (2) a 1uF + 100nF pair on VDDIO pin 9. The internal 1.2V regulator output VDDOUT (pin 37) MUST be decoupled with at least 1uF ceramic; do not load VDDOUT with external circuitry other than local bypass capacitors. Estimated: based on standard ARM Cortex-M4 reference designs, expect ~80 mA peak current draw when CPU is fully active at 120 MHz with all peripherals on.
Route USB DP (pin related to PB11 typically, refer to datasheet) and DM as a 90-ohm differential pair on the top or inner signal layer, with a continuous ground plane on the adjacent layer. Keep the pair length-matched to within 150 mil. Place the 1.5kohm pull-up resistor on D+ as close to the MCU as possible to ensure reliable full-speed USB enumeration. The 64-LQFP (10x10 mm) package has 0.5mm lead pitch; use 8-12 mil traces and 8 mil clearance to the pad edges for hand-reworkable designs.
At 120 MHz CPU clock with all peripherals active, the ATSAM4SD16BA-AN dissipates approximately 200-300 mW typical. With a 64-LQFP package theta_JA around 50-60 C/W typical, junction temperature rise is approximately 10-18 C above ambient at room temperature. Estimated: design assumes a standard 4-layer JEDEC test board; actual thermal performance depends on PCB copper area, layer stackup, and airflow. For industrial -40C to +85C operation, ensure junction stays below 100C under worst-case load.
Do not leave NRST (pin 64) floating; it requires a 10kohm pull-up to VDDIO and a 1nF capacitor to ground for stable reset. The JTAG pins PB4-PB7 default to GPIO after reset and must be reprogrammed for SWD/JTAG use. The VDDPLL pin 38 needs its own 100nF bypass; PLL performance is sensitive to noisy supplies. Lastly, when using the External Bus Interface, dedicate PC0-PC7 (pins 56-63) for data bus D0-D7, and ensure timing constraints in the datasheet are met for the chosen SRAM/SDRAM device.
The HS-CAN bus on the ATSAM4SD16BA-AN requires an external MCP2562 or similar transceiver; the on-chip CAN controller is a protocol engine only. Route the CAN TX/RX lines to the transceiver with a short stub (<25 mm). The CAN bus itself needs a 120-ohm termination resistor at each end of the trunk, and the transceiver should be placed near a board edge connector to keep bus stubs short. For SPI peripherals operating above 25 MHz, place series 22-33 ohm resistors near the MCU pins to dampen reflections.
Compliance-Informationen
Per Microchip SAM4S datasheet and the -AN green-package suffix, the part is RoHS compliant and lead-free. AEC-Q100 qualification is not stated for this industrial-temperature MPN; check with Microchip sales for AEC-Q100 alternatives in the SAM4S family if automotive use is required.
