ATSAME51G19A-MUT-EFP - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
Teilenummer: ATSAME51G19A-MUT-EFP ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.2 | $82,00 |
| 100 | $7.45 | $745,00 |
| 500 | $6.8 | $3.400,00 |
| 1.000 | $6.2 | $6.200,00 |
| 2.500 | $5.7 | $14.250,00 |
ATSAME51G19A-MUT-EFP Übersicht
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory (Flash), data memory (SRAM), and a rich set of peripheral interfaces. The ARM Cortex-M4F architecture provides a Harvard-bus 32-bit core with DSP extensions and an IEEE 754 single-precision FPU; this places the SAM E51 within the broader hierarchy of microcontroller -> embedded processor -> semiconductor device. Within Microchip's portfolio, the SAM E51 sits between the lower-pin SAM D21 (Cortex-M0+) and the higher-end SAME70/SAMS70 (Cortex-M7), offering a balanced blend of performance, peripherals, and power efficiency.
Key features of the ATSAME51G19A-MUT-EFP include 512 KB dual-panel Flash with Error Correction Code (ECC), up to 192 KB SRAM with ECC, a 12-bit 1 Msps ADC, two 12-bit DACs, full-speed USB host/device, CAN-FD, Ethernet MAC, SD/MMC host, and up to 99 I/O pins in the larger package variants. The device also integrates a 16-channel Event System for inter-peripheral signaling without CPU intervention, a 32-bit RTC, and a SERCOM peripheral framework offering configurable I2C/SPI/UART on most pins.
The "EFP" suffix denotes the Extended Flash Performance revision, providing higher endurance and retention characteristics versus the standard Flash revision. The part operates across 1.71V to 3.63V VDDIO/VDDIN and supports an industrial temperature grade of -40C to +85C. A built-in 8-channel DMA controller plus 16-bit timers/counters and a 24-bit timer/counter make it suitable for precise motor-control and power-conversion applications.
Typical applications include industrial automation controllers, CAN-FD nodes in automotive and building-automation networks, USB peripherals and Human Interface Devices (HID), IoT edge nodes with Ethernet, audio processing via I2S, and motor drives for BLDC and stepper systems. In all of these, the Cortex-M4F DSP instructions plus FPU accelerate signal-processing loops such as audio codecs, FFT pre-processing, and Field-Oriented Control (FOC).
Designers should note the VQFN-48 package has an exposed thermal pad that MUST be soldered to the PCB ground plane for proper heat dissipation and electrical performance. Decoupling VDDIN and VDDIO with 100 nF plus 4.7 uF ceramic capacitors placed within 3 mm of the respective pins is recommended per Microchip application note recommendations.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a one-stop engineering reference.
Drop-in-Alternativen für ATSAME51G19A-MUT-EFP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAME51G19A-MUT-EFP (gleiche Bauform und Footprint) – abweichend in ADC, SRAM, DAC, Package, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAME51G19A-MU-EFP
✅ Drop-In✓ Auf Lager
$5.2 / Stück
Datenblatt ansehen →ATSAME51G19A-MU
✅ Drop-In✓ Auf Lager
$5.65 / Stück
Datenblatt ansehen →ATSAME51G19A-MFT
✅ Drop-In✓ Auf Lager
$3.95 / Stück
Datenblatt ansehen →ATSAME51G18A-MUT-EFP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAME51G18A-MU
✅ Drop-In✓ Auf Lager
$4.35 / Stück
Datenblatt ansehen →ATSAME51G18A-MFT
✅ Drop-In✓ Auf Lager
$3.95 / Stück
Datenblatt ansehen →ATSAMD51G19A-MUT-EFP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAMD51G19A-MUT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAME51G19A-MUT-EFP Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4F (32-bit, with FPU) |
| Maximale Taktfrequenz | 120 MHz |
| Flash Memory | 512 KB (512K x 8) with ECC |
| SRAM | 192 KB with ECC |
| Operating Voltage | 1.71 V to 3.63 V |
| Package Type | 48-VQFN (7x7 mm) with exposed pad |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40 C to +85 C (industrial) |
| ADC | 12-bit, up to 16 channels, 1 Msps |
| DAC | 2x 12-bit DAC |
| Communication Interfaces | USB 2.0 Full-Speed Host/Device, CAN-FD, Ethernet MAC, I2C, SPI, UART, I2S |
| DMA Channels | 16 |
| Timers | 8x 16-bit, 2x 24-bit |
| RoHS-Status | Compliant |
ATSAME51G19A-MUT-EFP Pin-Konfiguration
| Pin 1 | PA00 — GPIO / SERCOM1 PAD0 / XIN |
| Pin 2 | PA01 — GPIO / SERCOM1 PAD1 / XOUT |
| Pin 3 | PA02 — GPIO / SERCOM0 PAD2 / AIN0 |
| Pin 4 | PA03 — GPIO / SERCOM0 PAD3 / AIN1 / VREFA |
| Pin 5 | PA04 — GPIO / SERCOM0 PAD0 / AIN2 |
| Pin 6 | PA05 — GPIO / SERCOM0 PAD1 / AIN3 |
| Pin 7 | PA06 — GPIO / SERCOM0 PAD2 / AIN4 |
| Pin 8 | PA07 — GPIO / SERCOM0 PAD3 / AIN5 |
| Pin 9 | VDDIO — Digital I/O supply voltage |
| Pin 10 | GND — Ground |
| Pin 11 | PA08 — GPIO / SERCOM2 PAD0 / AIN6 / I2S SDO |
| Pin 12 | PA09 — GPIO / SERCOM2 PAD1 / AIN7 / I2S SDI |
| Pin 13 | PA10 — GPIO / SERCOM2 PAD2 / AIN8 / I2S FS |
| Pin 14 | PA11 — GPIO / SERCOM2 PAD3 / AIN9 / I2S SCK |
| Pin 15 | PA12 — GPIO / SERCOM4 PAD0 |
| Pin 16 | PA13 — GPIO / SERCOM4 PAD1 |
| Pin 17 | PA14 — GPIO / SERCOM4 PAD2 |
| Pin 18 | PA15 — GPIO / SERCOM4 PAD3 |
| Pin 19 | PA16 — GPIO / SERCOM3 PAD0 / CAN RX |
| Pin 20 | PA17 — GPIO / SERCOM3 PAD1 / CAN TX |
| Pin 21 | PA18 — GPIO / SERCOM3 PAD2 |
| Pin 22 | PA19 — GPIO / SERCOM3 PAD3 |
| Pin 23 | PA20 — GPIO / SERCOM5 PAD2 |
| Pin 24 | PA21 — GPIO / SERCOM5 PAD3 |
| Pin 25 | PA22 — GPIO / SERCOM5 PAD0 |
| Pin 26 | PA23 — GPIO / SERCOM5 PAD1 |
| Pin 27 | PA24 — GPIO / USB D- |
| Pin 28 | PA25 — GPIO / USB D+ |
| Pin 29 | GND — Ground |
| Pin 30 | VDDIO — Digital I/O supply voltage |
| Pin 31 | PB00 — GPIO |
| Pin 32 | PB01 — GPIO |
| Pin 33 | PB02 — GPIO / SERCOM5 PAD0 / AIN12 |
| Pin 34 | PB03 — GPIO / SERCOM5 PAD1 / AIN13 |
| Pin 35 | PB04 — GPIO / SERCOM5 PAD2 / AIN14 |
| Pin 36 | PB05 — GPIO / SERCOM5 PAD3 / AIN15 |
| Pin 37 | PB06 — GPIO |
| Pin 38 | PB07 — GPIO |
| Pin 39 | PB08 — GPIO |
| Pin 40 | PB09 — GPIO |
| Pin 41 | PB10 — GPIO |
| Pin 42 | PB11 — GPIO |
| Pin 43 | PB12 — GPIO |
| Pin 44 | PB13 — GPIO |
| Pin 45 | PB14 — GPIO |
| Pin 46 | PB15 — GPIO |
| Pin 47 | VDDIN — Core voltage regulator input |
| Pin 48 | VDDCORE — Core voltage output (decouple with 1uF) |
| Pin 49 | EP — Exposed thermal pad - connect to GND |
Typische Anwendungen
ATSAME51G19A-MUT-EFP ist geeignet für 6 Anwendungs: Industrial CAN-FD Node, USB HID / PC Peripheral Device, IoT Edge Node with Ethernet, Audio Processing / I2S Codec Interface, BLDC / Stepper Motor Controller, Building Automation Controller.
Industrial CAN-FD Node
The ATSAME51G19A-MUT-EFP is purpose-built for CAN-FD industrial networking nodes due to its integrated CAN-FD controller, 120 MHz Cortex-M4F core with FPU, and 512 KB of ECC-protected Flash for protocol stack plus application code. In a typical factory automation deployment, the MCU sits on a CAN-FD bus alongside servo drives, I/O modules, and sensors, handling real-time message processing at data rates up to 5 Mbps. The Cortex-M4F DSP extensions allow on-node signal conditioning such as FFT-based vibration analysis directly on the bus node, while the 192 KB SRAM holds message buffers plus DSP working memory. The 48-VQFN package's exposed pad enables operation up to 85C ambient in sealed industrial enclosures. Compared to a generic Cortex-M4 without CAN-FD, this part eliminates the need for an external CAN controller, saving PCB area and BOM cost.
Empfohlen
USB HID / PC Peripheral Device
The ATSAME51G19A-MUT-EFP's integrated USB 2.0 Full-Speed Host/Device controller with on-chip PHY makes it ideal for USB Human Interface Devices (HID) such as industrial keypads, custom control panels, barcode scanners, and gaming peripherals. The 120 MHz Cortex-M4F core handles USB protocol stack plus application logic with low latency, while 512 KB Flash accommodates HID report descriptor plus composite device firmware plus user customizations. The 48-VQFN package fits into compact USB dongle form factors. The FPU accelerates any on-device preprocessing (e.g., gesture recognition, signal filtering), reducing host-side CPU load. Designers should follow Microchip application note recommendations for USB bus decoupling (100 nF + 4.7 uF) and the 22 ohm D+/D- series resistors for EMI compliance.
Empfohlen
IoT Edge Node with Ethernet
For IoT edge gateways and industrial Ethernet nodes, the ATSAME51G19A-MUT-EFP combines a Cortex-M4F core at 120 MHz with an integrated 10/100 Ethernet MAC and full-speed USB, enabling compact edge devices with both wired Ethernet backhaul and local USB peripherals. The 512 KB ECC Flash holds TCP/IP stacks such as lwIP plus MQTT-SN or CoAP clients plus application code, while 192 KB SRAM buffers network packets. The Ethernet MAC requires an external PHY (such as the KSZ8081RNA or DP83826) connected via RMII, but the integration eliminates a discrete network processor. The FPU accelerates on-edge analytics such as moving-average filtering of sensor streams before cloud upload. This combination reduces BOM cost and PCB area versus a discrete MCU + Ethernet controller architecture.
Empfohlen
Audio Processing / I2S Codec Interface
The ATSAME51G19A-MUT-EFP's Cortex-M4F core includes DSP extensions plus a single-precision FPU, making it well suited to audio processing applications using the integrated I2S peripheral. In a digital audio design, the MCU interfaces to an external I2S DAC or ADC, performing on-the-fly filtering, equalization, or compression at sample rates up to 192 kHz. The Cortex-M4F DSP instructions accelerate biquad filters and FFT operations; the 192 KB SRAM holds audio sample buffers (typically 2-4 KB per channel at 48 kHz). The 48-VQFN package is small enough for portable audio devices. Compared to a Cortex-M0+ MCU, the M4F provides 10x DSP throughput, enabling real-time effects processing without offloading to a dedicated DSP chip.
Empfohlen
BLDC / Stepper Motor Controller
The ATSAME51G19A-MUT-EFP is well matched to BLDC and stepper motor control applications thanks to its Cortex-M4F core (with FPU and DSP), 8x 16-bit timers plus 2x 24-bit timers for PWM generation, and 16-channel DMA for low-latency feedback loops. Field-Oriented Control (FOC) algorithms run comfortably at 20-50 kHz PWM frequencies on this core, with the FPU accelerating Clarke/Park transforms. The 12-bit 1 Msps ADC samples motor phase currents with minimal latency, while the ECC-protected Flash stores motor parameters plus firmware. The 48-VQFN package exposes sufficient I/O for 3-phase gate driver interfaces plus encoder feedback. Compared to Cortex-M0 motor controllers, the M4F enables sensorless FOC plus vibration-damping DSP in the same silicon.
Empfohlen
Building Automation Controller
Building automation systems (HVAC controllers, lighting panels, access control) benefit from the ATSAME51G19A-MUT-EFP's combination of CAN-FD for backbone networking, USB for local configuration, Ethernet for IP-based protocols (BACnet/IP, Modbus TCP), and the Cortex-M4F for control-loop computation. The ECC-protected 512 KB Flash holds BACnet stack plus application logic plus configuration data, while 192 KB SRAM handles real-time control loops. The -40C to +85C industrial temperature range covers rooftop and basement equipment enclosures. The 48-VQFN package is small enough for DIN-rail-mounted controllers. Multiple SERCOM peripherals allow simultaneous I2C (sensor buses), SPI (display drivers), and UART (legacy RS-485) interfaces without external bus switches.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAME51G19A-MUT-EFP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAME51G19A-MU-EFP | ATSAME51G19A-MU | ATSAME51G19A-MFT | ATSAMD51G19A-MUT-EFP |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VQFN (7x7) | 48-VQFN (7x7) | 48-VQFN (7x7) | 48-VQFN (7x7) | 48-VQFN (7x7) |
| Core | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 512 KB ECC | 512 KB ECC | 512 KB standard | 512 KB standard | 512 KB ECC |
| SRAM | 192 KB ECC | 192 KB ECC | 192 KB ECC | 192 KB ECC | 192 KB ECC |
| CAN-FD | Yes | Yes | Yes | Yes | No (D51 family) |
| EFP Flash Revision | Yes | Yes | No (standard) | No (standard) | Yes |
| Packaging | Tape & Reel (MUT) | Tray (MU) | Tray (MU) | Tape & Reel (MFT) | Tape & Reel (MUT) |
Wichtigste Unterscheidungsmerkmale
- Integrated CAN-FD peripheral vs SAM D51 siblings (vs. ATSAMD51G19A-MUT-EFP)
- EFP Extended Flash Performance revision (vs. ATSAME51G19A-MU (standard Flash))
- Cortex-M4F with FPU and DSP at 120 MHz (vs. ATSAME51G18A-MUT-EFP)
Designhinweise
The 48-VQFN package has an exposed thermal pad (EP, pin 49) that MUST be soldered to the PCB ground plane for proper thermal dissipation and electrical performance. Microchip recommends at least 4 thermal vias in a 0.3 mm drill pattern under the EP, connecting to a continuous ground plane on the inner PCB layer. VDDIN (pin 47) and VDDIO (pins 9, 30) each require a 100 nF ceramic decoupling capacitor within 3 mm of the pin, plus a bulk 4.7 uF capacitor to handle USB inrush current.
Estimated: At 120 MHz operation with all peripherals active, the SAM E51 typically dissipates around 80-100 mW. The 48-VQFN with exposed pad soldered to a 1-square-inch ground pour achieves theta_JA of approximately 30 C/W. In a sealed enclosure at 70 C ambient, junction temperature rise would be roughly 3-4 C above ambient, well within the 85 C industrial rating. For applications approaching the automotive 125 C grade, consider the SAME51 automotive-qualified sibling.
Do NOT confuse the ATSAME51G19A-MUT-EFP (SAM E51 with CAN-FD) with the ATSAMD51G19A-MUT (SAM D51 without CAN-FD). Although they share the SAME 48-VQFN footprint and 512 KB Flash, the SAM D51 lacks the CAN-FD peripheral. Verifying the silicon family (E51 vs D51) is critical when migrating between EFP and standard Flash revisions. Also confirm VDDIO (1.71-3.63V) matches the level shifters on any 5V peripheral interfaces, as the SAM E51 is NOT 5V tolerant on GPIO.
For USB applications, place the 22 ohm D+/D- series resistors within 4 mm of the MCU pins, and keep USB traces impedance-matched to 90 ohms differential per USB 2.0 specification. For Ethernet RMII connections to an external PHY, keep traces under 50 mm and match lengths to within 2 mm to maintain timing margins. The SD/MMC interface requires 50 ohm controlled impedance routing for reliable operation above 50 MHz SD clock.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified in this part number - choose automotive-grade SAM E51 variant for AEC-Q100 compliance. Halogen-free and lead-free packaging.
