ATSAME70J21A-AN - 300MHz Cortex-M7 MCU, 2MB Flash, LQFP-64
Teilenummer: ATSAME70J21A-AN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16.2 | $16,20 |
| 10 | $14.58 | $145,80 |
| 100 | $12.96 | $1.296,00 |
| 500 | $11.5 | $5.750,00 |
| 1.000 | $10.3 | $10.300,00 |
ATSAME70J21A-AN Übersicht
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), data memory (SRAM), and a configurable set of on-chip peripherals such as timers, communication controllers, and ADCs on a single die. Within the embedded hierarchy, MCUs sit below microprocessors (MPUs) in integration but above general-purpose logic ICs in functional scope; the ARM Cortex-M7 architecture specifically targets deterministic real-time control with DSP-grade signal processing and hardware floating point, making it a frequent choice for motor control, audio processing, and industrial networking applications.
Key features of the ATSAME70J21A-AN include a 300 MHz maximum CPU clock, 2 MB embedded Flash for code and data storage, 384 KB SRAM for runtime working memory, a 16-bit AHB peripheral bus matrix, an integrated High-Speed USB 2.0 device/host PHY, an Ethernet MAC (GMAC), dual CAN-FD controllers, a 12-bit ADC up to 2 MSPS, and a TFT LCD controller. The Cortex-M7 core delivers 5 CoreMark/MHz and 2.14 CoreMark/MHz in floating-point benchmarks, with tightly-coupled memory (TCM) ports for deterministic low-latency code execution. The chip also includes an event system, a configurable interrupt controller (NVIC), and a cryptographic accelerator supporting AES, SHA, and TRNG.
Typical applications include industrial motor control (BLDC/PMSM FOC), building automation and HVAC controllers, human-machine interface (HMI) panels with TFT displays, audio processing and Class-D amplifier front-ends, smart-grid energy meters, networked sensor hubs, and USB-connected test/measurement equipment. Designers select this MCU when deterministic Cortex-M7 performance with Ethernet and USB connectivity is required in a single chip without an external MPU subsystem.
When designing with this MCU, ensure the VDDIO and VDDCORE decoupling network follows the recommended 100 nF + bulk capacitor topology; for high-speed USB operation, the VDDPLL and VDDUTMII rails require additional filtering. QSPI/SMC interfaces for external memory should be routed with 50 ohm impedance-controlled traces and length-matched within the bus to maintain signal integrity at 100 MHz DDR modes.
Drop-in-Alternativen für ATSAME70J21A-AN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAME70J21A-AN (gleiche Bauform und Footprint) – abweichend in Mounting Type, Operating Temperature, Core Architecture, Flash Memory, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAME70J20B-AN
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$12.75 / Stück
Datenblatt ansehen →ATSAME70J19B-AN
✅ Drop-In✓ Auf Lager
$9.42 / Stück
Datenblatt ansehen →ATSAME70J19A-ANT
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$9.2 / Stück
Datenblatt ansehen →ATSAMS70J21A-AN
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAME70J21A-ANT
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$9.6 / Stück
Datenblatt ansehen →ATSAME70J21A-AN Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M7 with FPU and DSP extensions |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 384 KB |
| Operating Voltage Range | 1.2 V core / 3.3 V I/O (per SAM E70 family) |
| Gehäuse | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40C to +85C (industrial) |
| USB Interface | High-Speed USB 2.0 Device/Host PHY (integrated) |
| Ethernet | 10/100 Mbps GMAC (IEEE 1588) |
| CAN Interface | 2x CAN-FD controllers |
| ADC | 12-bit, up to 2 MSPS |
| Display Controller | TFT LCD controller (per SAM E70 family) |
| Cryptographic Accelerator | AES, SHA, TRNG (per SAM E70 family) |
| RoHS-Status | Compliant |
ATSAME70J21A-AN 64-lqfp (10x10 mm) Pinbelegungsleitfaden
Pinbelegung für ATSAME70J21A-AN (64-lqfp (10x10 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAME70J21A-AN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAME70J21A-AN ist geeignet für 6 Anwendungs: Industrial Motor Control (BLDC/PMSM FOC), Human-Machine Interface (HMI) Panels, Building Automation and HVAC Controllers, Audio Processing and Class-D Amplifier Front-End, Smart-Grid Energy Meters, Networked Sensor Hubs and IoT Gateways.
Industrial Motor Control (BLDC/PMSM FOC)
The ATSAME70J21A-AN is well suited for sensorless and sensored field-oriented control (FOC) of brushless DC and permanent magnet synchronous motors, where the 300 MHz Cortex-M7 with hardware FPU and DSP extensions can execute space-vector PWM updates and Park/Clarke transforms in under 5 microseconds. Its 12-bit ADC sampling at up to 2 MSPS provides the bandwidth needed for 50 kHz current loops, while the 384 KB SRAM allows phase-current and reference-frame lookup tables to remain in on-chip memory, eliminating external memory latency. Per the SAM E70 datasheet, the PWM controller with 24-bit resolution and dead-time insertion integrates cleanly with 3-phase IGBT/SiC gate drivers for industrial servo and pump drives.
Empfohlen
Human-Machine Interface (HMI) Panels
The integrated TFT LCD controller and large 384 KB SRAM make the ATSAME70J21A-AN a strong fit for industrial HMI panels with 320x240 to 800x480 resolution graphical displays. The Cortex-M7 core can drive the LCD controller in single-buffer or partial-refresh modes, while the 2 MB Flash accommodates graphical assets, fonts, and localized strings without external SPI flash. Per Microchip's HMI reference designs, the device pairs naturally with Microchip's MAUI Widgets graphics library and Atmel Start project templates for rapid UI prototyping.
Empfohlen
Building Automation and HVAC Controllers
Building automation gateways require deterministic processing of multiple communication protocols (Modbus, BACnet, KNX, CAN) running concurrently, which the ATSAME70J21A-AN's dual CAN-FD controllers and Ethernet GMAC support natively. The 300 MHz Cortex-M7 with hardware AES encryption secures IP-based building network traffic without software overhead. Per the SAM E70 datasheet, the 2 MB Flash stores BACnet/IP and MQTT stacks alongside application logic, while the 384 KB SRAM holds protocol buffers and TLS context without external memory expansion.
Empfohlen
Audio Processing and Class-D Amplifier Front-End
Audio applications requiring 24-bit DSP performance benefit from the ATSAME70J21A-AN's Cortex-M7 MAC units, which can execute biquad filters, dynamic range compressors, and crossover networks at low CPU load. The integrated I2S peripheral supports 24/32-bit audio data at sample rates up to 192 kHz, and the 384 KB SRAM provides enough space for audio buffers and coefficient tables. According to the SAM E70 family datasheet, the device drives Class-D amplifiers such as the MCP8026 with sample-rate synchronization and supports multi-channel audio routing over TDM.
Empfohlen
Smart-Grid Energy Meters
Smart electricity meters require precise power calculation from current and voltage transducers, with secure data logging and communication over PLC, RF, or Ethernet. The ATSAME70J21A-AN delivers this with its hardware floating-point unit executing accurate 4-quadrant energy metering algorithms, hardware AES/SHA crypto accelerators securing DLMS/COSEM communication, and dual CAN-FD interfaces for PLC modules. Per the SAM E70 datasheet, the integrated 12-bit ADC at 2 MSPS samples both voltage and current channels simultaneously, achieving Class 0.5 metering accuracy when paired with appropriate sensors.
Empfohlen
Networked Sensor Hubs and IoT Gateways
Industrial IoT gateways aggregating sensor data over CAN, RS-485, and Ethernet can leverage the ATSAME70J21A-AN's multi-protocol peripheral set, with dual CAN-FD controllers, GMAC with IEEE 1588 timestamping, and high-speed USB for cellular modem expansion. The 2 MB Flash accommodates TLS certificates and MQTT/HTTP libraries, while the 384 KB SRAM holds network buffers and JSON parsing workspaces. Per the SAM E70 datasheet, the integrated crypto accelerator handles TLS 1.3 handshakes at IoT-scale throughput, making the device a single-chip hub controller for factory-floor data aggregation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAME70J21A-AN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAME70J20B-AN | ATSAME70J19B-AN | ATSAMS70J21A-AN | ATSAME70J21A-ANT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | LQFP-64 (10x10 mm) | LQFP-64 (10x10 mm) - same | LQFP-64 (10x10 mm) - same | LQFP-64 (10x10 mm) - same | LQFP-64 (10x10 mm) - same |
| CPU Core | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz |
| Flash | 2 MB | 1 MB (-50%) | 1 MB (-50%) | 2 MB (same) | 2 MB (same) |
| SRAM | 384 KB | 384 KB (same) | 256 KB (-33%) | 384 KB (same) | 384 KB (same) |
| Crypto Accelerator | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | Not included | AES/SHA/TRNG |
| High-Speed USB PHY | Integrated | Integrated | Integrated | Integrated | Integrated |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Wichtigste Unterscheidungsmerkmale
- Highest memory configuration in LQFP-64 SAM E70 family (vs. ATSAME70J20B-AN)
- Largest SRAM in the LQFP-64 J-series (vs. ATSAME70J19B-AN)
- Includes hardware cryptographic accelerator (vs. ATSAMS70J21A-AN)
Designhinweise
The ATSAME70J21A-AN requires a clean two-rail supply: a 3.3 V I/O rail (VDDIO) and a 1.2 V core rail (VDDCORE). Per the SAM E70 family datasheet, VDDCORE can be supplied either by an internal regulator from VDDIO or by an external switching regulator for highest efficiency. Recommended decoupling: place one 100 nF X7R 0402 ceramic on every VDDCORE pin and every VDDIO pin, plus a 4.7 uF bulk capacitor on each rail within 5 mm of the package. For USB operation, add 10 uF bulk on VDDUTMII and a ferrite bead filter on the PLL analog rail (VDDPLL).
Route the High-Speed USB DP/DM traces as a 90 ohm differential pair with length matching within 150 mil. Per the SAM E70 datasheet, the GMAC RMII/MII signals and SDRAM clock should also be length-matched within their respective bus groups. Maintain a continuous ground plane under the LQFP-64 package and stitch vias around the perimeter to minimize EMI. The exposed pad (where present on LQFP) should be soldered to a thermal pad connected to the digital ground plane.
Estimated: Running the Cortex-M7 at 300 MHz while executing from Flash can incur wait states if the Flash controller is not pre-fetch enabled - use the same Flash wait state configuration recommended in the SAM E70 family datasheet (typically 5 wait states at 300 MHz with flash prefetch). Also ensure that interrupts above the FreeRTOS kernel priority are configured correctly; the SAM E70 NVIC has 16 priority bits and Micrium/Microchip-FreeRTOS ports assume a minimum of 5 priority bits. Failing to configure these leads to subtle race conditions in motor control and audio applications.
The LQFP-64 package has a thermal resistance of roughly 50 C/W in still air. At full CPU load on both cores drawing approximately 200 mA at 1.2 V (0.24 W) plus I/O, total dissipation is well under 1 W, so no heatsink is required. However, in enclosed industrial enclosures with limited airflow, the user should compute junction temperature using theta_JA and the application-specific duty cycle; keep Tj below +105C for long-term reliability. Per the SAM E70 datasheet, internal thermal protection triggers at +120C.
Compliance-Informationen
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - for automotive applications, use ATSAME70 family variants designated with automotive grade. Conflict minerals statement available from Microchip.