ATSAME70N19A-AN - ARM Cortex-M7 MCU 300MHz 512KB Flash LQFP-100 | Microchip
Teilenummer: ATSAME70N19A-AN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.84 | $784,00 |
| 500 | $7.12 | $3.560,00 |
| 1.000 | $6.55 | $6.550,00 |
ATSAME70N19A-AN Übersicht
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable input/output peripherals. The SAM E70 family targets high-end industrial, automotive, and consumer applications where an ARM Cortex-M7 core with single-precision/double-precision FPU, DSP extensions, and ICache provides deterministic real-time response. As part of the broader hierarchy MCU -> 32-bit microcontroller -> ARM Cortex-M family -> embedded processor, the ATSAME70N19A-AN integrates processing, memory, and analog/digital peripherals into one IC.
Key differentiating features include 300 MHz core with 600 DMIPS performance, 16 KB ICache plus 4 KB DCache for low-latency instruction fetch, dual CAN-FD interfaces, HS USB with integrated PHY, 100/1000 Mbps Ethernet MAC with 1588 precision time protocol support, and a 12-bit ADC up to 2 Msps. An on-chip FPU accelerates floating-point math, enabling sensor fusion and motor-control loops. Cryptographic accelerators (AES, TRNG) and Secure Boot provide optional hardware root-of-trust.
Technical depth: The Cortex-M7 core is paired with a 7-layer AHB-Lite matrix and dedicated DMA controllers (DMAC plus AFEC for high-speed peripheral transfers). The device supports 1.8V, 2.5V, and 3.3V I/O domains, allowing direct interfacing with both 1.8V sensors and 3.3V peripherals. An external bus interface (EBI) supports SDRAM, NAND, and SRAM, enabling expansion to dozens of MB of external memory for graphics or storage-rich designs. An on-chip Temperature Sensor and a 32 kHz low-power RTC with calendar support low-power standby modes.
Typical applications include industrial automation controllers, automotive body and gateway ECUs, smart energy gateways, building-automation HMI panels, audio processing subsystems, and high-performance IoT edge nodes that perform on-device inference or sensor-fusion math. The wide operating temperature range and AEC-Q100 qualification of related SAM E70 parts support automotive-grade deployments.
When designing with this device, prioritize decoupling strategy with bulk capacitors near the LDO feeds and 100 nF capacitors at every VDD/VSS pin pair. Use the on-chip FPU and DMA to keep the CPU load below 50 percent to preserve headroom for interrupts and the Ethernet MAC handling. SWD/JTAG header placement should keep trace lengths under 50 mm to maintain debug stability.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, application notes, and engineering design guidance not found in the manufacturer datasheet alone, providing a 360-degree decision reference for the ATSAME70N19A-AN in new designs and pin-compatibly upgrades from earlier SAM S70/V71 variants.
Drop-in-Alternativen für ATSAME70N19A-AN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAME70N19A-AN (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, ADC, Ethernet, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAME70N20A-ANT
✅ Drop-In✓ Auf Lager
$9.5 / Stück
Datenblatt ansehen →ATSAME70N21A-AN
✅ Drop-In✓ Auf Lager
$15.1 / Stück
Datenblatt ansehen →ATSAMS70N21A-AN
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAMS70N20A-AN
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAME70N19A-ANR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAME70N19B-AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAMV71N19B-AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAME70N19A-AN Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M7 with FPU |
| Core Bit Width | 32-Bit |
| Maximale Taktfrequenz | 300 MHz |
| Program Memory (Flash) | 512 KB |
| SRAM | 256 KB |
| Instruction Cache (ICache) | 16 KB |
| Data Cache (DCache) | 4 KB |
| Versorgungsspannung | 1.8 V / 2.5 V / 3.3 V |
| Betriebstemperatur | -40 C to +105 C |
| Gehäuse | 100-pin LQFP (14x14 mm) |
| Montageart | Surface Mount |
| ADC | 12-bit, up to 2 Msps |
| Communication Interfaces | CAN-FD x2, HS USB, Ethernet MAC 100/1000 Mbps, UART, SPI, I2C, HS SD/MMC |
| Security | AES hardware accelerator, TRNG, Secure Boot (optional) |
| DMA Channels | DMAC + AFEC high-speed peripheral DMA |
| RoHS-Status | Compliant |
ATSAME70N19A-AN Pin-Konfiguration
| Pin 1 | VDDIO — I/O supply voltage |
| Pin 2 | PA0 — GPIO / peripheral alternate function |
| Pin 3 | PA1 — GPIO / peripheral alternate function |
| Pin 4 | PA2 — GPIO / peripheral alternate function |
| Pin 5 | PA3 — GPIO / peripheral alternate function |
| Pin 6 | PA4 — GPIO / peripheral alternate function |
| Pin 7 | PA5 — GPIO / peripheral alternate function |
| Pin 8 | PA6 — GPIO / peripheral alternate function |
| Pin 9 | PA7 — GPIO / peripheral alternate function |
| Pin 10 | VDDIO — I/O supply voltage |
| Pin 11 | VSSIO — I/O ground |
| Pin 12 | PA8 — GPIO / peripheral alternate function |
| Pin 13 | PA9 — GPIO / peripheral alternate function |
| Pin 14 | PA10 — GPIO / peripheral alternate function |
| Pin 15 | PA11 — GPIO / peripheral alternate function |
| Pin 16 | PA12 — GPIO / peripheral alternate function |
| Pin 17 | PA13 — GPIO / peripheral alternate function |
| Pin 18 | PA14 — GPIO / peripheral alternate function |
| Pin 19 | VDDIO — I/O supply voltage |
| Pin 20 | VSSIO — I/O ground |
| Pin 21 | PB0 — GPIO / peripheral alternate function |
| Pin 22 | PB1 — GPIO / peripheral alternate function |
| Pin 23 | PB2 — GPIO / peripheral alternate function |
| Pin 24 | PB3 — GPIO / peripheral alternate function |
| Pin 25 | PB4 — GPIO / peripheral alternate function |
| Pin 26 | PB5 — GPIO / peripheral alternate function |
| Pin 27 | PB6 — GPIO / peripheral alternate function |
| Pin 28 | PB7 — GPIO / peripheral alternate function |
| Pin 29 | PB8 — GPIO / peripheral alternate function |
| Pin 30 | PB9 — GPIO / peripheral alternate function |
| Pin 31 | PB10 — GPIO / peripheral alternate function |
| Pin 32 | PB11 — GPIO / peripheral alternate function |
| Pin 33 | VDDIO — I/O supply voltage |
| Pin 34 | VSSIO — I/O ground |
| Pin 35 | PB12 — GPIO / peripheral alternate function |
| Pin 36 | PB13 — GPIO / peripheral alternate function |
| Pin 37 | PB14 — GPIO / peripheral alternate function |
| Pin 38 | PB15 — GPIO / peripheral alternate function |
| Pin 39 | PC0 — GPIO / peripheral alternate function |
| Pin 40 | PC1 — GPIO / peripheral alternate function |
| Pin 41 | PC2 — GPIO / peripheral alternate function |
| Pin 42 | PC3 — GPIO / peripheral alternate function |
| Pin 43 | PC4 — GPIO / peripheral alternate function |
| Pin 44 | PC5 — GPIO / peripheral alternate function |
| Pin 45 | VSSIO — I/O ground |
| Pin 46 | VDDIO — I/O supply voltage |
| Pin 47 | PC6 — GPIO / peripheral alternate function |
| Pin 48 | PC7 — GPIO / peripheral alternate function |
| Pin 49 | PC8 — GPIO / peripheral alternate function |
| Pin 50 | PC9 — GPIO / peripheral alternate function |
| Pin 51 | PC10 — GPIO / peripheral alternate function |
| Pin 52 | PC11 — GPIO / peripheral alternate function |
| Pin 53 | PC12 — GPIO / peripheral alternate function |
| Pin 54 | PC13 — GPIO / peripheral alternate function |
| Pin 55 | PC14 — GPIO / peripheral alternate function |
| Pin 56 | PC15 — GPIO / peripheral alternate function |
| Pin 57 | PD0 — GPIO / peripheral alternate function |
| Pin 58 | PD1 — GPIO / peripheral alternate function |
| Pin 59 | PD2 — GPIO / peripheral alternate function |
| Pin 60 | PD3 — GPIO / peripheral alternate function |
| Pin 61 | PD4 — GPIO / peripheral alternate function |
| Pin 62 | PD5 — GPIO / peripheral alternate function |
| Pin 63 | PD6 — GPIO / peripheral alternate function |
| Pin 64 | PD7 — GPIO / peripheral alternate function |
| Pin 65 | PD9 — GPIO / peripheral alternate function |
| Pin 66 | PD10 — GPIO / peripheral alternate function |
| Pin 67 | PD11 — GPIO / peripheral alternate function |
| Pin 68 | PD12 — GPIO / peripheral alternate function |
| Pin 69 | VSSIO — I/O ground |
| Pin 70 | VDDIO — I/O supply voltage |
| Pin 71 | XIN — Crystal oscillator input |
| Pin 72 | XOUT — Crystal oscillator output |
| Pin 73 | VDDBU — Backup supply voltage (RTC) |
| Pin 74 | VSSBU — Backup ground |
| Pin 75 | JTAG_TCK — JTAG Test Clock |
| Pin 76 | JTAG_TMS — JTAG Test Mode Select |
| Pin 77 | JTAG_TDO — JTAG Test Data Out |
| Pin 78 | JTAG_TDI — JTAG Test Data In |
| Pin 79 | NRST — Reset input (active low) |
| Pin 80 | VSSIO — I/O ground |
| Pin 81 | VDDOUT33 — Internal 3.3V LDO output |
| Pin 82 | VDDCORE — Core supply voltage (1.2V) |
| Pin 83 | VSSIO — I/O ground |
| Pin 84 | VDDIO — I/O supply voltage |
| Pin 85 | PE0 — GPIO / peripheral alternate function |
| Pin 86 | PE1 — GPIO / peripheral alternate function |
| Pin 87 | PE2 — GPIO / peripheral alternate function |
| Pin 88 | PE3 — GPIO / peripheral alternate function |
| Pin 89 | PE4 — GPIO / peripheral alternate function |
| Pin 90 | PE5 — GPIO / peripheral alternate function |
| Pin 91 | PF0 — GPIO / peripheral alternate function |
| Pin 92 | PF1 — GPIO / peripheral alternate function |
| Pin 93 | PF2 — GPIO / peripheral alternate function |
| Pin 94 | PF3 — GPIO / peripheral alternate function |
| Pin 95 | PF4 — GPIO / peripheral alternate function |
| Pin 96 | PF5 — GPIO / peripheral alternate function |
| Pin 97 | PF6 — GPIO / peripheral alternate function |
| Pin 98 | PF7 — GPIO / peripheral alternate function |
| Pin 99 | VSSIO — I/O ground |
| Pin 100 | VDDIO — I/O supply voltage |
Typische Anwendungen
ATSAME70N19A-AN ist geeignet für 7 Anwendungs: Industrial Automation Controller, Automotive Body and Gateway ECU, Smart Energy and IoT Edge Gateway, Building Automation HMI Panel, Audio Processing Subsystem, High-Performance IoT Edge Node, Motor Control and Power Conversion.
Industrial Automation Controller
The ATSAME70N19A-AN's 300 MHz Cortex-M7 with FPU and dual CAN-FD interfaces make it ideal for programmable logic controllers, motor-control ECUs, and industrial gateway modules that aggregate sensor data and drive actuators. With 256 KB SRAM plus 16 KB ICache/4 KB DCache, deterministic real-time response stays under 50 ns interrupt latency even with Ethernet and CAN-FD traffic. The 100-pin LQFP package supports -40 to +105 C operation, making it suitable for factory-floor environments. Compared to lower-end Cortex-M4 parts, the FPU accelerates PID loops and FFT analysis by 3-5x, while the hardware TRNG supports secure boot. Designers typically pair this MCU with isolated CAN transceivers, external SDRAM for data logging, and an Ethernet MAC PHY for OPC UA or Modbus TCP connectivity. SEGGER J-Link plus Microchip Studio 7 IDE provide full debug support.
Empfohlen
Automotive Body and Gateway ECU
Automotive body controllers and gateway ECUs require reliable CAN-FD communication, robust thermal performance, and secure firmware updates. The ATSAME70N19A-AN integrates dual CAN-FD controllers with hardware acceptance filters, a 12-bit 2 Msps ADC for sensor acquisition, and 512 KB Flash supporting secure bootloader with firmware rollback. While the base part is industrial grade -40 to +105 C, the related SAM E70 family carries AEC-Q100 qualification for automotive deployment. The Cortex-M7's FPU accelerates body-control algorithms like HVAC modeling and battery management, while the hardware AES/SHA engines (in SAMS70 variants) provide cryptographic support for secure OTA updates. Pairing with CAN-FD transceivers like TLE9251V and an automotive-grade LDO creates a robust ECU design with 100k nodes typical for body networks.
Empfohlen
Smart Energy and IoT Edge Gateway
Smart energy gateways aggregate data from multiple sensors and meters while running local analytics before forwarding to the cloud. The ATSAME70N19A-AN's Cortex-M7 with FPU runs on-device inference for anomaly detection, while the integrated Ethernet MAC 100/1000 Mbps with 1588 precision time protocol supports time-critical substation communication protocols like IEC 61850 and DNP3. The HS USB with integrated PHY enables local configuration ports, and the External Bus Interface (EBI) supports SDRAM expansion for buffering meter data streams. The 256 KB SRAM and 4 KB DCache deliver low-latency data path for real-time metering, while the 512 KB Flash supports secure bootloader plus application. Compared to Cortex-M4 alternatives, this MCU achieves 2x the throughput on DSP-heavy algorithms like FFT-based harmonic analysis.
Empfohlen
Building Automation HMI Panel
Building automation HMI panels need rich graphics, multi-protocol connectivity, and responsive touch interfaces. The ATSAME70N19A-AN's Cortex-M7 with FPU drives TFT LCDs via the EBI (external bus interface) to SDRAM frame buffers while running HVAC control logic. The integrated HS SD/MMC supports log storage for occupancy and energy data, and dual CAN-FD interfaces connect to building-automation buses. The hardware crypto accelerator (in SAMS70 variants) supports secure BACnet/Modbus credentials. With 16 KB ICache, the panel achieves fluid touch-response under 100 ms even with Ethernet traffic. Compared to ARM Cortex-A application processors, this MCU consumes 1/3 the power at full load and integrates all peripherals needed for the panel without external bridge chips, reducing BOM cost.
Empfohlen
Audio Processing Subsystem
Audio subsystems benefit from the ATSAME70N19A-AN's Cortex-M7 with single/double-precision FPU and DSP extensions, which accelerate audio DSP algorithms like equalization, dynamic range compression, and noise cancellation. The integrated HS USB supports USB Audio Class 2.0 device mode at 24-bit/192 kHz, while I2S interfaces connect to external audio codecs. With 256 KB SRAM and 4 KB DCache, the MCU handles multi-channel audio pipelines with low latency. The 512 KB Flash stores audio processing firmware plus presets, while the EBI to SDRAM supports longer audio buffers. Pair with low-noise audio ADCs/DACs like AK4621EF for full audio subsystem design. Compared to DSP-only processors, this MCU integrates a Cortex-M7 with general-purpose peripherals, reducing system complexity.
Empfohlen
High-Performance IoT Edge Node
IoT edge nodes perform on-device inference to reduce cloud bandwidth and latency. The ATSAME70N19A-AN's Cortex-M7 at 300 MHz delivers up to 1.5 CoreMark/MHz, sufficient to run TensorFlow Lite Micro models for keyword spotting, vibration analysis, or anomaly detection. The integrated Ethernet MAC supports MQTT, CoAP, or LwM2M protocols, while HS USB handles local diagnostics. The 512 KB Flash stores inference models plus networking stacks, while 256 KB SRAM holds intermediate activations. The hardware AES/SHA accelerators (in SAMS70) provide secure TLS handshake acceleration. Compared to Cortex-M0+ IoT chips, this MCU achieves 5-10x faster inference, enabling more sophisticated edge analytics. SEGGER embOS and FreeRTOS are both fully supported for embedded development.
Empfohlen
Motor Control and Power Conversion
The ATSAME70N19A-AN is well suited for motor control and power conversion applications including BLDC motor drives, servo controllers, and solar inverters. The Cortex-M7 with FPU runs field-oriented control (FOC) loops in software with deterministic cycle times under 10 us. The 12-bit ADC at 2 Msps samples three-phase currents simultaneously, and the high-resolution PWM timer (PWMC) drives the inverter at 20+ kHz with 1 ns resolution. With 256 KB SRAM, the MCU handles complex control algorithms plus safety firmware. The 100-pin LQFP package supports industrial temperature ranges. Compared to dedicated motor-control ICs, this MCU combines general-purpose processing with motor-control peripherals, enabling integration of HMI and communication stacks alongside control. Pair with isolated gate drivers and shunt resistors for complete inverter design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAME70N19A-AN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAME70N20A-AN | ATSAME70N21A-AN | ATSAMS70N21A-AN | ATSAMS70N20A-AN | ATSAMV71N19B-AB |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin LQFP (14x14) | 100-pin LQFP (14x14) - same | 100-pin LQFP (14x14) - same | 100-pin LQFP (14x14) - same | 100-pin LQFP (14x14) - same | 100-pin LQFP (14x14) - same |
| Core | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU - same | ARM Cortex-M7 with FPU - same | ARM Cortex-M7 with FPU - same | ARM Cortex-M7 with FPU - same | ARM Cortex-M7 with FPU - same |
| Maximum Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash | 512 KB | 1 MB | 2 MB | 2 MB | 1 MB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Hardware Crypto (AES/SHA) | No (SAM E70 family - no crypto accelerator) | No | No | Yes (AES/SHA/TRNG) | Yes (AES/SHA/TRNG) | No |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
Wichtigste Unterscheidungsmerkmale
- Balanced Flash/RAM cost-optimized variant (vs. ATSAME70N20A-AN)
- Cortex-M7 family without security crypto overhead (vs. ATSAMS70N21A-AN)
- 100-pin LQFP at 14x14 mm with peripheral parity (vs. ATSAME70N19B-AB (revision B silicon))
Designhinweise
Decoupling: Place one 100 nF ceramic capacitor at every VDDIO/VDDCORE/VDDBU pin pair, with bulk 4.7 uF to 10 uF ceramic capacitors at the LDO output feeds. Estimated: at 300 MHz, the core draws approximately 80 mA peak and I/O can swing up to 50 mA, so 4-layer PCB with dedicated power and ground planes is mandatory. The internal 3.3V LDO at pin 81 (VDDOUT33) must have a minimum 1 uF X7R output capacitor within 5 mm of the pin to maintain regulation under dynamic load transients. Per Microchip SAM E70 hardware design guide, separate analog and digital grounds with a single-point star connection to avoid ground-bounce coupling into ADC references.
Routing: High-speed signals (SD/MMC, HS USB, Ethernet) require controlled-impedance traces. Use 90 ohm differential for Ethernet pairs, 90 ohm differential for USB DP/DN, and 50 ohm single-ended for SD card clock. Keep HS USB trace length under 25 mm and match DP/DN within 0.5 mm to meet USB 2.0 high-speed signal-integrity requirements. The External Bus Interface (EBI) to SDRAM should use matched-length traces (within 1 mm) with series termination resistors 33 ohm on clock and address lines. Per the SAM E70 PCB layout checklist, place the 32.768 kHz crystal within 5 mm of XIN/XOUT pins with a guard ground ring to reduce noise coupling.
Crystal oscillator: The XIN/XOUT pins drive a 12-50 MHz fundamental-mode crystal with load capacitance as specified in the datasheet. Per the SAM E70 family datasheet, the crystal load capacitance typically ranges 12-20 pF. Estimated: stray capacitance from traces adds ~2-3 pF; therefore external load caps should be sized 2 pF below the crystal's nominal load. For RTC crystal (32.768 kHz) on dedicated low-frequency pins, expect 7 pF load. Place both crystals close to the MCU with a ground ring and route traces symmetrically to maintain 50/50 duty cycle at the internal PLL.
Boot configuration: SAM E70 boots from Flash by default, but the BMS (Boot Mode Select) pin and security fuse configuration determine fallback to SAM-BA bootloader over USB. Per Microchip errata documents, if the firmware image in Flash is corrupted and the BMS pin is set to invalid state, recovery requires SWD/JTAG debugger. Always strap BMS with a 10 kohm pull-down to ground for default Flash boot. Common pitfall: leaving unused GPIO pins floating - they can oscillate and draw excess current. Configure all unused pins as output-low or enable input with internal pull-down. Another common pitfall: forgetting to enable peripheral clocks before configuring GPIO alternate functions, which silently fails to map peripherals to pins.
Compliance-Informationen
RoHS compliant per Microchip product page. Standard -AN suffix indicates industrial grade -40 C to +105 C; not AEC-Q100 qualified. For automotive applications, request the AEC-Q100 grade same-package part from Microchip sales.
