BCM53158XMB1KFBG - 12-Port GbE Switch with 10G Uplinks | Broadcom
Teilenummer: BCM53158XMB1KFBG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $41.33 | $41,33 |
| 10 | $38.95 | $389,50 |
| 100 | $36.42 | $3.642,00 |
| 500 | $33.1 | $16.550,00 |
| 1.000 | $30.85 | $30.850,00 |
BCM53158XMB1KFBG Übersicht
A Layer-2 Ethernet switch is a network device that operates at the data link layer (OSI Layer 2) to forward Ethernet frames between connected devices using MAC address lookup tables. Layer-2 switches form the foundational building blocks of virtually every wired enterprise, industrial, and SMB network. The BCM53158 belongs to the broader taxonomy: Ethernet switch -> network switch -> networking IC -> semiconductor, integrating PHY, MAC, and switch fabric functions on a single die to reduce BOM cost and PCB area.
Key features include IEEE 802.3 compliance, support for 10/100/1000 Base-T/TX PHY interfaces, integrated ARM-class management CPU, and a rich set of host interfaces including GPIO, I2C, MII, and SPI. The 10G uplink ports enable aggregation to backbone switches, while the QSGMII provides a quad-SERDES interface commonly used to connect to a host CPU or upstream device. The architecture supports advanced Layer-2 features such as VLAN tagging (802.1Q), QoS prioritization, IGMP snooping, and port-based security.
Technical depth: The BCM53158XMB1KFBG implements Broadcom's proven RoboSwitch architecture with shared-memory packet buffer architecture, hardware-based address learning, and store-and-forward switching. The integrated 10G SERDES lanes enable direct connection to SFP+ cages or backplane interfaces without external PHYs. The device typically operates from a single 1.0V/1.2V core supply with 3.3V I/O, and supports Energy Efficient Ethernet (EEE, 802.3az) for power savings on idle links.
Typical applications include SMB managed switches, industrial Ethernet switches, SOHO routers with multi-port LAN, service-provider customer-premises equipment (CPE), and enterprise branch office access switches. The 10G uplinks make the device suitable for aggregation tiers where 1G access ports need to feed 10G backbone capacity.
Design consideration: When designing with the BCM53158XMB1KFBG, ensure the 311-pin LFBGA PCB land pattern is manufactured with HDI (high-density interconnect) processes such as laser-drilled microvias. Thermal management requires a copper pour beneath the exposed die paddle; without proper thermal vias the device will throttle at high ambient temperatures. Reference Broadcom's reference design guide for magnetics selection and layout.
This page synthesizes distributor pricing, parametric comparison with alternative Ethernet switches, application guidance, and design notes not found in the manufacturer datasheet alone - enabling faster design-in and procurement decisions.
Drop-in-Alternativen für BCM53158XMB1KFBG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
BCM53156OKFBG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BCM53154OKFBG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BCM53134OKFBG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BCM53158XMB1KFBG Grenzwerte & elektrische Eigenschaften
| Product Type | Ethernet Switch IC (Layer 2) |
| Series | RoboSwitch BCM53154/BCM53156/BCM53158 |
| Total Switch Ports | 12 ports |
| Gigabit Ethernet Ports | 8x GE (10/100/1000 Base-T/TX PHY) |
| QSGMII Interfaces | 1x QSGMII |
| 10G Uplinks | 2x 10G SERDES |
| Standards Compliance | IEEE 802.3 |
| Host Interfaces | GPIO, I2C, MII, SPI |
| Gehäuse | 311-pin LFBGA |
| Betriebstemperatur | Commercial (C-Temp) 0C to +70C |
| Switching Architecture | Layer 2 store-and-forward |
| Montageart | Surface Mount |
| Power Class | Ultra-low-power |
| RoHS-Status | Compliant (per Broadcom product page) |
| Reach Status | Compliant |
| Energy Efficient Ethernet | IEEE 802.3az supported (per family datasheet) |
BCM53158XMB1KFBG 311-pin lfbga Pinbelegungsleitfaden
Pinbelegung für BCM53158XMB1KFBG (311-pin lfbga-Gehäuse). Dieses analoge Bauteil verfügt über Eingangs-, Ausgangs- und Versorgungspins. Offset-Null-, Kompensations- und Enable-Pin-Konfigurationen entnehmen Sie dem Herstellerdatenblatt. Ideal für Signalaufbereitung und Verstärkerschaltungen.
Keine detaillierten Pinbelegungsdaten verfügbar für BCM53158XMB1KFBG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
BCM53158XMB1KFBG ist geeignet für 6 Anwendungs: SMB Managed Gigabit Switch, Industrial Ethernet Aggregation Switch, SOHO Router with Multi-Port LAN, Service-Provider Customer Premises Equipment (CPE), Enterprise Branch Office Access Switch, Wireless Access Point Controller / LAN Aggregation.
SMB Managed Gigabit Switch
The BCM53158XMB1KFBG is a natural fit for SMB managed 8-port Gigabit switches with 10G uplink aggregation. Its 8 integrated 10/100/1000 Base-T/TX PHYs eliminate the need for external PHY chips, reducing BOM cost and PCB area, while the 2x 10G SERDES uplinks enable direct connection to a 10G backbone or SFP+ cage. Hardware-based Layer-2 features including 802.1Q VLAN tagging, QoS prioritization, IGMP snooping, and port-based security satisfy the requirements of managed SMB switches without burdening the host CPU.
Empfohlen
Industrial Ethernet Aggregation Switch
In industrial cabinet environments, the BCM53158XMB1KFBG serves as the aggregation switch connecting multiple field-level devices to a plant-floor backbone. The device's 8x GE ports handle machine-to-machine traffic, while the 2x 10G uplinks aggregate to higher-tier SCADA or DCS networks. The integrated ARM-class management CPU runs diagnostic protocols, and the I2C/SPI/GPIO interfaces connect to industrial sensors and indicators. Engineers should verify the C-Temp rating (0C to +70C) is adequate for the target cabinet environment, or specify an I-Temp variant if available.
Empfohlen
SOHO Router with Multi-Port LAN
SOHO and prosumer routers benefit from the BCM53158XMB1KFBG's 8-port integrated Layer-2 switch fabric, providing 8 dedicated Gigabit LAN ports without external PHY ICs. The QSGMII interface connects directly to the host SoC for WAN-LAN routing and NAT acceleration, while the 2x 10G uplinks enable 10G WAN or fiber-to-the-home service-provider deployments. The device's ultra-low-power design aligns with SOHO router energy-efficiency requirements, and the small LFBGA footprint supports compact router enclosures.
Empfohlen
Service-Provider Customer Premises Equipment (CPE)
Service-provider CPE such as ONTs, MDUs, and business gateways leverage the BCM53158XMB1KFBG's 10G uplink capability for fiber-based broadband delivery. The 2x 10G SERDES lanes support 10G-PON or XGS-PON uplink modules, while 8x GE ports serve subscriber LAN devices. The integrated Layer-2 switch fabric handles VLAN tagging per IEEE 802.1Q for service multiplexing, and QoS features enable triple-play service differentiation. The commercial temperature range is suitable for indoor CPE deployments in customer premises.
Empfohlen
Enterprise Branch Office Access Switch
Enterprise branch office access switches use the BCM53158XMB1KFBG to deliver 8x GE access ports plus 10G uplink capacity for connecting branch users to the corporate network. The integrated PHYs reduce design complexity, while the 10G uplinks enable high-bandwidth connections to the campus core. Hardware-based ACL, port security, and 802.1X authentication support enterprise-grade access control. The LFBGA package enables compact 1U form factor switches with high port density.
Empfohlen
Wireless Access Point Controller / LAN Aggregation
The BCM53158XMB1KFBG can aggregate multiple Wi-Fi 6/6E access points at the LAN side of a unified wireless controller or campus Wi-Fi deployment. Its 8x GE ports connect directly to APs via PoE-powered Ethernet, while the 10G uplinks carry aggregated wireless traffic back to the core. The QSGMII interface enables connection to a wireless controller ASIC for centralized AP management. The device's hardware QoS ensures low latency for real-time voice and video traffic carried over the wireless network.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für BCM53158XMB1KFBG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | BCM53156OKFBG | BCM53154OKFBG | BCM53134OKFBG |
|---|---|---|---|---|
| Package | 311-pin LFBGA | 311-pin LFBGA - same | 311-pin LFBGA - same | LFBGA - same family |
| Brand | Broadcom | Broadcom | Broadcom | Broadcom |
Wichtigste Unterscheidungsmerkmale
- Highest port count with 2x 10G uplinks in RoboSwitch family (vs. BCM53156OKFBG)
- Integrated 8x GE PHYs eliminate external PHY ICs (vs. BCM53154OKFBG (without 10G uplinks))
- Pin-compatible with BCM53156OKFBG and BCM53154OKFBG (vs. BCM5389KFBG (different package))
Designhinweise
The BCM53158XMB1KFBG uses a 311-pin LFBGA package with fine-pitch BGA balls. PCB fabrication requires HDI (high-density interconnect) stackup with laser-drilled microvias to fan out from the inner balls. Use 1 oz copper on outer layers for power and ground, with via-in-pad plating on signal balls to minimize inductance. Reference Broadcom's reference design for the exact ball-map coordinates, layer stackup, and via pattern.
The BCM53158XMB1KFBG's exposed die paddle (center balls) must be soldered to a thermal pad with an array of thermal vias connecting to internal copper planes. Without thermal vias, the device will overheat under sustained traffic load, especially with all 8 GE ports plus 10G uplinks active. A minimum 4x4 thermal via array (0.3mm drill, 0.5mm pitch) is recommended, with the thermal pad tied to the ground plane.
Do not assume the BCM53158XMB1KFBG will operate without firmware. The integrated management CPU requires Broadcom-supplied firmware loaded via SPI flash at boot. Ensure the SPI flash is correctly sized for the firmware image and connected to the appropriate SPI pins per the datasheet. Power sequencing must follow Broadcom's specified rail order to avoid latch-up. Decoupling capacitors (0.1uF + 10uF per rail) must be placed within 2mm of each power ball.
Route the 10G SERDES differential pairs with 100-ohm differential impedance, length-matched within 0.13mm (5 mil). Use guard traces or ground flooding between SERDES pairs to minimize crosstalk. The QSGMII interface has the same routing requirements. GE PHY traces to magnetics should be 100-ohm differential with length matching; keep these traces short and away from switching power supply nodes to minimize EMI.
Compliance-Informationen
RoHS and REACH compliance per Broadcom product page. Not AEC-Q100 qualified - this is a commercial-grade networking IC, not an automotive part.
