CDK1307BILP40 - 13-bit 40MSPS Ultra-Low Power ADC | MaxLinear
Teilenummer: CDK1307BILP40 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.18 | $6,18 |
| 10 | $5.42 | $54,20 |
| 100 | $4.65 | $465,00 |
| 500 | $3.88 | $1.940,00 |
| 1.000 | $3.22 | $3.220,00 |
CDK1307BILP40 Übersicht
An ADC (analog-to-digital converter) is a data-acquisition component that samples continuous analog signals and outputs discrete digital codes at a sample rate set by an external clock. ADCs sit at the boundary between the analog front end (sensors, amplifiers, filters) and the digital processing block (DSP, FPGA, microcontroller), and are characterized by resolution (bits), sample rate (MSPS), SNR/SFDR dynamic performance, input bandwidth, and power dissipation. Ultra-low-power ADCs such as the CDK1307 family target portable, battery-powered, and thermally constrained systems where every milliwatt matters.
Key features include a 1.8 V analog core supply, a 1.7 V to 3.6 V digital I/O supply for direct host-MCU interfacing, internal reference circuitry to minimize external component count, and parallel CMOS output that simplifies PCB routing compared with LVDS interfaces. The 73 dB SNR (typical at 8 MHz input) and 33 mW typical dissipation position this part for low-power imaging, instrumentation, and communications receiver applications where thermal management is a design constraint.
Architecturally the CDK1307BILP40 uses a successive-approximation or pipelined core (per the CDK1307 family datasheet) with on-chip sample-and-hold and an internal reference. The wide I/O voltage range (1.7-3.6 V) allows direct connection to 1.8 V, 2.5 V, and 3.3 V MCUs or FPGAs without level shifters, simplifying BOM and reducing board area in multi-rail designs.
Typical applications include portable ultrasound front-ends, handheld instrumentation, low-power wireless baseband receivers, industrial sensor digitizers, and consumer imaging pipelines. The 40 MSPS ceiling is well-matched to narrowband IF sampling in software-defined radio and to video-rate processing at reduced resolutions.
When designing with the CDK1307BILP40, treat the analog and digital supplies as separate rails and place the decoupling network within 5 mm of the supply pins. The internal reference eliminates the need for an external reference IC in most designs, but PCB layout must still follow good ADC practice: a solid analog ground plane, short analog input traces, and the digital outputs routed away from the analog input to avoid digital-feedback coupling.
This page synthesizes distributor inventory, parametric position within the CDK1307 family, application mapping, and practical PCB-layout guidance that goes beyond the bare specification tables published on individual distributor pages.
Drop-in-Alternativen für CDK1307BILP40 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit CDK1307BILP40 (gleiche Bauform und Footprint) – abweichend in Resolution, Package, Reference, Analog Supply Voltage, Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
CDK1307AILP40
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.21 / Stück
Datenblatt ansehen →CDK1307CILP40
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.95 / Stück
Datenblatt ansehen →CDK1307DILP40
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.6 / Stück
Datenblatt ansehen →CDK1307BILP40 Grenzwerte & elektrische Eigenschaften
| Manufacturer | MaxLinear (formerly Exar / Cadeka) |
| Part Number | CDK1307BILP40 |
| Converter Type | ADC (Analog-to-Digital Converter) |
| Auflösung | 13-bit (12-bit configurable) |
| Abtastrate | Up to 40 MSPS |
| Family Sampling Rates | 20 / 40 / 65 / 80 MSPS (CDK1307 family) |
| Analog Supply Voltage | 1.8 V (typical) |
| Digital I/O Supply Voltage | 1.7 V to 3.6 V |
| Output Interface | Parallel CMOS |
| Reference | Internal reference circuitry |
| SNR (Typ, Fin = 8 MHz) | 73 dB |
| Power Dissipation (Typ) | 33 mW |
| Gehäuse | 40-pin QFN (6x6 mm) - suffix ILP40 |
| Pin Compatibility | Pin compatible with CDK1308 family |
| Montageart | Surface Mount |
CDK1307BILP40 40-pin qfn (6x6 mm) - suffix ilp40 Pinbelegungsleitfaden
Pinbelegung für CDK1307BILP40 (40-pin qfn (6x6 mm) - suffix ilp40-Gehäuse). Dieses analoge Bauteil verfügt über Eingangs-, Ausgangs- und Versorgungspins. Offset-Null-, Kompensations- und Enable-Pin-Konfigurationen entnehmen Sie dem Herstellerdatenblatt. Ideal für Signalaufbereitung und Verstärkerschaltungen.
Keine detaillierten Pinbelegungsdaten verfügbar für CDK1307BILP40.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
CDK1307BILP40 ist geeignet für 7 Anwendungs: Portable Ultrasound Front-End, Handheld Test and Measurement Instrumentation, Software-Defined Radio (SDR) Baseband Receiver, Industrial Sensor Digitizer / Data Acquisition, Low-Power Communications IF Sampling, Consumer Imaging and Video-Capture Pipeline, Automotive Telematics and Sensor Logging.
Portable Ultrasound Front-End
Why the CDK1307BILP40 fits portable ultrasound: the part's 13-bit resolution, 73 dB SNR at 8 MHz input, and 40 MSPS sample rate let designers digitize multi-channel transducer outputs at sufficient dynamic range for tissue-imaging reconstruction. The 33 mW typical dissipation is critical in handheld probes where battery life and patient safety thermal budgets limit power density. Used downstream of a TGC / LNA front-end and an antialiasing filter, the ADC connects directly to an FPGA image-processing pipeline via the parallel CMOS bus. Performance trade-off: a 40 MSPS ceiling is enough for low-channel-count probes but designers scaling to 64+ channels should evaluate the CDK1307 65/80 MSPS speed-grades on the same 40-QFN footprint.
Empfohlen
Handheld Test and Measurement Instrumentation
Why the CDK1307BILP40 fits handheld test instruments: the part's ultra-low 33 mW dissipation extends battery life in portable oscilloscopes, data loggers, and spectrum analyzers without forced-air cooling. The 1.7-3.6 V digital I/O range lets it interface to lithium-ion-powered MCUs or low-cost FPGAs without level shifters, cutting BOM cost and PCB area. The 13-bit resolution, 40 MSPS rate, and parallel CMOS output suit digitizing waveforms up to ~10 MHz bandwidth. Performance consideration: noise density and SFDR must be re-validated against the input front-end; an external input amplifier and antialiasing filter are usually co-designed to fully leverage the 73 dB SNR.
Empfohlen
Software-Defined Radio (SDR) Baseband Receiver
Why the CDK1307BILP40 fits SDR baseband: the 40 MSPS sample rate is a natural match for digitizing low-IF band outputs in narrowband receivers (FM, DAB, land-mobile-radio) where I/Q data streams feed an FPGA demodulator. The 13-bit resolution captures signal envelope detail across narrowband modulation schemes (QPSK, GMSK) without driving up FPGA baseband DSP cost. The 73 dB SNR keeps the noise floor below typical receiver sensitivity targets when the front-end LNA and mixer are properly designed. Trade-off: SDR designs needing >40 MSPS for wideband capture (e.g. direct-sampling HF) must step up to the CDK1307 65/80 MSPS speed-grades on the same 40-QFN footprint.
Empfohlen
Industrial Sensor Digitizer / Data Acquisition
Why the CDK1307BILP40 fits industrial DAQ: 13-bit resolution and 40 MSPS rate handle multi-channel sensor multiplexing for vibration monitoring, motor-control feedback, and process-control analog front-ends. The internal reference reduces BOM and calibration overhead in distributed I/O modules where each channel card has cost constraints. The 1.8 V analog / 1.7-3.6 V digital supplies simplify integration with industrial 3.3 V MCUs without external regulators. Performance note: industrial designs should validate thermal performance against the IEC 60068 environmental envelope and confirm long-term availability with MaxLinear due to the niche ultra-low-power segment.
Empfohlen
Low-Power Communications IF Sampling
Why the CDK1307BILP40 fits IF sampling: at 40 MSPS the part can undersample intermediate frequencies commonly used in low-cost receiver designs for ISM-band and short-range wireless links, eliminating one or two IF downconversion stages and the associated SAW / ceramic filters. The 13-bit resolution preserves dynamic range across the IF passband while the 33 mW dissipation keeps the entire RF chain thermally manageable. Direct CMOS parallel output eases PCB routing into small LQFP FPGAs. Trade-off vs higher-resolution ADCs: 13 bits is adequate for digital demodulation but does not match 16-bit converters when the receiver must handle wider dynamic-range signals (e.g. cellular base-station IF).
Empfohlen
Consumer Imaging and Video-Capture Pipeline
Why the CDK1307BILP40 fits consumer imaging: 40 MSPS is enough to digitize standard-definition video-rate sensors and camera-interface chips while the 33 mW dissipation fits battery-powered camcorders, action cameras, and mobile vision modules. The internal reference and parallel CMOS outputs minimize external component count, important for compact enclosures where every cubic millimeter counts. Designers can pair the ADC with an image-sensor processor over a parallel bus without adding a serializer. Performance consideration: for high-resolution still-image pipelines (>1080p) the bandwidth ceiling demands higher MSPS converters; the CDK1307B handles preview and SD-video digitization comfortably but not full HD sensor readout.
Empfohlen
Automotive Telematics and Sensor Logging
Why the CDK1307BILP40 fits automotive telematics: ultra-low 33 mW dissipation reduces thermal load in sealed enclosures, and the 40 MSPS ceiling handles multi-axis inertial-sensor data streams and CAN-bus analog sensors typically found in fleet telematics boxes. The internal reference simplifies EMC robust designs because fewer external analog nodes reduce loop area. Care must be taken: this part is not AEC-Q100 qualified per the data provided, so automotive safety-critical applications require an automotive-graded ADC instead, while non-safety telematics and infotainment-adjacent logging are acceptable use cases. Performance trade-off: EMI hardening of the ADC front-end is a critical PCB-layout consideration in engine-bay environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für CDK1307BILP40 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | CDK1307AILP40 | CDK1307CILP40 | CDK1307DILP40 |
|---|---|---|---|---|
| Package | 40-QFN (6x6) ILP40 | 40-QFN (6x6) ILP40 | 40-QFN (6x6) ILP40 | 40-QFN (6x6) ILP40 |
| Brand | MaxLinear | MaxLinear | MaxLinear | MaxLinear |
| Max Sample Rate (MSPS) | 40 | 20 | 65 | 80 |
| Resolution | 13-bit (12-bit configurable) | 13-bit (12-bit configurable) | 13-bit (12-bit configurable) | 13-bit (12-bit configurable) |
| Analog Supply | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Digital I/O Supply | 1.7 V to 3.6 V | 1.7 V to 3.6 V | 1.7 V to 3.6 V | 1.7 V to 3.6 V |
| Output Interface | Parallel CMOS | Parallel CMOS | Parallel CMOS | Parallel CMOS |
| Pin Compatible | Yes (CDK1308 family) | Yes (CDK1307 family) | Yes (CDK1307 family) | Yes (CDK1307 family) |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible speed-grade option within the same 40-QFN footprint (vs. CDK1307AILP40 / CDK1307CILP40 / CDK1307DILP40)
- Ultra-low 33 mW typical dissipation (vs. Generic 13-bit 40 MSPS ADCs)
- Wide 1.7-3.6 V digital I/O range with internal reference (vs. ADCs requiring 3.3 V I/O and external reference)
Designhinweise
Estimated: Treat the 1.8 V analog supply (AVDD) and the 1.7-3.6 V digital supply (DRVDD) as separate rails with their own ferrite beads and decoupling networks. Place a 0.1 uF X7R ceramic capacitor within 5 mm of each supply pin and a bulk 10 uF tantalum or ceramic on each rail. The exposed thermal pad of the 40-QFN must be soldered to a continuous, low-impedance ground pour to provide the lowest thermal resistance and a clean analog reference.
Estimated: Route analog input traces over a continuous analog ground plane and keep them physically separated from the parallel CMOS digital output bus to avoid digital-feedback coupling into the analog front-end. Use a guard ring around the analog input pins and via-stitch the ground pour at the board perimeter. The internal reference removes the external reference IC but does not relax analog layout discipline - SNR performance can still degrade 5-10 dB with poor grounding. Validate with a time-domain reflectometry check on critical input traces if the design targets full 13-bit performance.
Common pitfall: do not exceed the 1.8 V analog supply tolerance - the part does not include over-voltage protection on the AVDD rail. Also, the wide 1.7-3.6 V digital supply range is convenient but designers sometimes forget that the parallel CMOS output drivers must be sized for the chosen voltage - at 3.3 V I/O the dynamic switching current is significantly higher than at 1.8 V I/O and may affect system-level power budgets. Finally, the 40 MSPS ceiling assumes an adequate clock source; using a noisy FPGA-derived clock can reduce SNR by several dB.
Compliance-Informationen
RoHS/REACH/lead-free/halogen-free status not found in the verified web data; the package is a standard Pb-free surface-mount QFN but manufacturer compliance certificates should be requested before medical/automotive production. AEC-Q100 not stated in the verified data; the part is recommended for non-safety automotive applications only.
