CL05A106MP5NUNC - 10µF 10V X5R 0402 MLCC | Samsung Electro-Mechanics
Teilenummer: CL05A106MP5NUNC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.08 | $0,08 |
| 10 | $0.05 | $0,50 |
| 100 | $0.025 | $2,50 |
| 500 | $0.019 | $9,50 |
| 1.000 | $0.015 | $15,00 |
CL05A106MP5NUNC Übersicht
An MLCC (Multilayer Layer Ceramic Capacitor) is a passive component constructed by alternating layers of ceramic dielectric and metal electrodes, then sintered into a monolithic block. X5R is a Class 2 dielectric defined by EIA-198, offering moderate volumetric efficiency with capacitance change typically within ±15% over its rated temperature range. In the broader taxonomy, MLCCs sit under ceramic capacitors, which fall under capacitors, which fall under passive components. MLCCs dominate decoupling, bypass, and energy-storage applications in modern electronics because of their low ESR, low ESL, small footprint, and ability to be placed directly under IC power pins.
Key features of the CL05A106MP5NUNC include 10 µF nominal capacitance, ±20% tolerance, 10 V rated voltage, X5R dielectric, and a 0402 footprint (1.0 × 0.5 mm). The device is supplied in tape-and-reel packaging suitable for high-speed automated assembly. Per the manufacturer datasheet, the cap exhibits typical ESR well below 100 mΩ at 1 kHz, making it highly effective for high-frequency decoupling. The X5R temperature profile trades wide temperature stability for higher capacitance density compared to C0G/NP0 parts.
Typical applications include bulk decoupling of IC power rails, smartphone PMIC output filtering, IoT module bypass, and battery management bypass networks. The compact 0402 footprint supports high-density PCB layouts where board real estate is at a premium, particularly under SoCs and microcontrollers. Design engineers commonly select this part as a 1-3 piece-per-rail bypass capacitor paired with smaller 0.1 µF values.
When designing with X5R MLCCs, engineers must apply DC bias derating: a 10 µF 0402 X5R part may lose 60-80% of its nominal capacitance at 5 V DC bias. Always verify effective capacitance under operating voltage, not just nominal 1 Vrms capacitance. For designs requiring tight tolerance or low-loss RF coupling, C0G/NP0 dielectrics should be considered instead.
This page synthesizes distributor pricing, drop-in alternatives, and DC-bias-aware design notes not consolidated in any single manufacturer datasheet, supporting faster sourcing decisions for compact decoupling applications.
Drop-in-Alternativen für CL05A106MP5NUNC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit CL05A106MP5NUNC (gleiche Bauform und Footprint) – abweichend in Capacitance, Capacitance Tolerance, Capacitor Type, Mounting Type, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
CL05A106MP5NUNL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CL05A106MQ5NUNC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
GRM155R61A106ME11
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CC0402MRX5R6BB106
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
C1005X5R1A106M050BC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
KGM05AR51A106MH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CL05A106MP5NUNC Grenzwerte & elektrische Eigenschaften
| Capacitance | 10 µF |
| Capacitance Tolerance | ±20% |
| Rated Voltage | 10 V |
| Dielectric Characteristic | X5R (EIA) |
| Betriebstemperaturbereich | -55 °C to +85 °C |
| Gehäuse / Bauform | 0402 (1005 metric) |
| Package Size (inches) | 0.039 × 0.020 in |
| Package Size (mm) | 1.0 × 0.5 mm |
| Montageart | Surface Mount (SMT) |
| Termination Style | Solder plated Ni/Sn (standard) |
| Capacitor Type | Multilayer Ceramic Capacitor (MLCC) |
| Temperature Coefficient | ±15% (X5R) |
| DC Bias Characteristic | Subject to DC bias derating (see datasheet) |
| RoHS-Status | Compliant |
| Packaging | Tape & Reel |
CL05A106MP5NUNC 1.0 × 0.5 mm Pinbelegungsleitfaden
Pinbelegung für CL05A106MP5NUNC (1.0 × 0.5 mm-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für CL05A106MP5NUNC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
CL05A106MP5NUNC ist geeignet für 6 Anwendungs: Microcontroller Power Rail Decoupling, Smartphone PMIC Output Filtering, IoT Wireless Module Bypass Network, Battery Management IC (BMIC) Bypass, USB-PD Controller Decoupling, Sensor Module Local Regulation.
Microcontroller Power Rail Decoupling
Place 1-3 pieces of CL05A106MP5NUNC directly beneath the VDD pins of a 32-bit MCU (e.g., a Cortex-M4 running at 180 MHz) to provide bulk energy storage between the regulator and the load. The 10 µF capacitance combined with 0402's sub-100 mΩ ESR at 1 MHz handles instantaneous load steps during code execution and peripheral activation. Compared to a single 10 µF tantalum, the X5R MLCC delivers equivalent or better high-frequency decoupling in roughly 1/3 the board area, enabling tighter SoC power-pin placement.
Empfohlen
Smartphone PMIC Output Filtering
Use CL05A106MP5NUNC as output filter capacitance on PMIC LDO or buck outputs in compact mobile designs where board area is at a premium. The 0402 footprint supports direct placement under PMIC land pads while delivering 10 µF bulk capacitance for transient response during Wi-Fi or 5G RF power amplifier ramp events. Engineers should verify effective capacitance under 3.8-4.5 V DC bias, since X5R derating may reduce usable capacitance by 50-70% from the 10 µF nominal rating.
Empfohlen
IoT Wireless Module Bypass Network
Pair CL05A106MP5NUNC with 0.1 µF X7R 0402 caps in parallel to form a wide-bandwidth bypass network for Wi-Fi/BLE module power pins. The 10 µF bulk handles low-frequency transient loading during TX bursts while the 0.1 µF handles high-frequency switching noise above 10 MHz. This 1+1 decoupling topology is standard for modules integrating Nordic nRF52, ESP32, and similar 3.3 V SoCs where clean power directly impacts RF performance and link stability.
Empfohlen
Battery Management IC (BMIC) Bypass
Use CL05A106MP5NUNC as bulk bypass capacitance on BMIC input and output rails, supporting up to 2 A continuous discharge spikes during battery authentication and fuel-gauge measurement events. The 10 V rating provides ample headroom for charging voltages up to 9 V when used with quick-charge adapter front-ends. Compared to polymer capacitors, the MLCC delivers faster transient response in a smaller footprint for compact wearable and earbud designs.
Empfohlen
USB-PD Controller Decoupling
Place CL05A106MP5NUNC on VBUS and CC line protection circuits of USB-PD controllers handling up to 5 A load. The 10 V rating exceeds USB-PD 9 V fast-charge levels with margin for transients, while the 0402 footprint enables tight placement adjacent to Type-C connector pins. Effective capacitance may drop below 5 µF at 5 V bias per X5R characteristics, so use 2-3 capacitors in parallel if bulk energy storage is critical for hot-plug events.
Empfohlen
Sensor Module Local Regulation
Apply CL05A106MP5NUNC on the output of local LDO regulators powering MEMS sensors (accelerometers, gyros, environmental sensors) on IoT sensor boards. The X5R 10 µF MLCC filters LDO switching noise and provides instantaneous current during sensor wake/sleep transitions, which can spike to 10-50 mA. The compact 0402 footprint fits easily under sensor BGA packages where board area constraints are severe.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für CL05A106MP5NUNC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | CL05A106MP5NUNL | CL05A106MQ5NUNC | GRM155R61A106ME11 | CC0402MRX5R6BB106 | C1005X5R1A106M050BC | KGM05AR51A106MH |
|---|---|---|---|---|---|---|---|
| Package | 0402 (1005 metric) | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same |
| Brand | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Murata Manufacturing | YAGEO | TDK | KYOCERA AVX |
| Capacitance | 10 µF | 10 µF | 10 µF | 10 µF | 10 µF | 10 µF | 10 µF |
| Rated Voltage | 10 V | 10 V | 6.3 V | 10 V | 10 V | 10 V | 10 V |
| Tolerance | ±20% | ±20% | ±20% | ±20% | ±20% | ±20% | ±20% |
| Dielectric | X5R | X5R | X5R | X5R | X5R | X5R | X5R |
| Operating Temperature | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Wichtigste Unterscheidungsmerkmale
- Authorized Samsung Electro-Mechanics OEM sourcing (vs. GRM155R61A106ME11 (Murata))
- 10 V rating provides headroom margin (vs. CL05A106MQ5NUNC (6.3 V version))
- Compact 0402 footprint enables dense layouts (vs. GRM155R61A106ME11 (Murata))
Designhinweise
Estimated: A 10 µF 0402 X5R MLCC may deliver only 2-4 µF effective capacitance at 5 V DC bias due to dielectric derating. Always check the manufacturer's DC bias curve for your actual operating voltage, and consider using 2-3 capacitors in parallel if bulk energy storage is critical. Nominal capacitance (measured at 0 V bias or 1 Vrms AC) overstates real-world available capacitance.
Recommended: Place the MLCC as close as possible to the IC power pin, ideally within 1-2 mm of the pad. Use vias-in-pad or short traces to minimize parasitic inductance. For high-current transients, pair the 10 µF bulk cap with a smaller 0.1 µF X7R 0402 in parallel to cover both low-frequency bulk storage and high-frequency decoupling above 10 MHz.
Optional: For solder reflow, follow JEDEC J-STD-020 profile with peak temperature not exceeding 260 °C for lead-free assembly. The 0402 package has limited thermal mass, so excessive dwell time above 200 °C can cause silver migration or thermal shock. Always use SAC305 (Sn96.5/Ag3.0/Cu0.5) solder paste for reliable 0402 solder joints.
Compliance-Informationen
RoHS compliant per Samsung product page. Not AEC-Q200 qualified for automotive - choose automotive-grade MLCC for AEC-Q200 designs. Conflict-minerals compliance per Samsung Electro-Mechanics declarations.
