CL10B106MQ8NRNC - 10uF 6.3V X7R 0603 MLCC | Samsung Electro-Mechanics
Teilenummer: CL10B106MQ8NRNC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.1 | $0,10 |
| 10 | $0.075 | $0,75 |
| 100 | $0.05 | $5,00 |
| 500 | $0.042 | $21,00 |
| 1.000 | $0.038 | $38,00 |
| 4.000 | $0.035 | $140,00 |
CL10B106MQ8NRNC Übersicht
What is an MLCC? A multilayer ceramic capacitor is a surface-mount passive component built by stacking alternating layers of metal electrodes and a ceramic dielectric body, then sintering and terminating the structure with nickel-barrier and tin solder end-caps. MLCCs sit in the hierarchy of passive components -> capacitors -> ceramic capacitors, and within that branch they are the dominant technology for general-purpose decoupling, filtering, and bypass functions on modern digital and analog boards.
Key features of the CL10B106MQ8NRNC include the industry-standard 0603 EIA footprint, 6.3V rated DC working voltage (well above the typical 3.3V or 5V rails where it is most often deployed), and +/-20% capacitance tolerance that is acceptable for bulk decoupling. The X7R dielectric delivers reasonable volumetric efficiency at 10 uF in 0603, a capacitance that historically would have required a much larger case such as 1210. The X7R temperature characteristic trades off against C0G's near-zero temperature coefficient for a substantially higher capacitance-per-volume.
Typical applications for the CL10B106MQ8NRNC include bulk decoupling of 3.3V and 5V digital IC rails, local bypass on microcontroller power pins, smoothing on low-dropout (LDO) regulator outputs, and energy storage for short power-rail transients on portable and IoT devices. The 6.3V rating gives designers comfortable margin on 3.3V rails and acceptable margin on 5V rails where DC plus AC ripple stays below the rated voltage.
When laying out the 0603 land pattern, follow IPC-7351 nominal pads (roughly 0.9 mm x 0.8 mm) and avoid placing the part directly under tall components that could trap solder during reflow. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für CL10B106MQ8NRNC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit CL10B106MQ8NRNC (gleiche Bauform und Footprint) – abweichend in Capacitance, Capacitance Tolerance, Mounting Type, Rated Voltage (DC), Temperature Coefficient.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
CL10B106MQ8NRN
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CL10B106KP8NNNC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
GRM188R60J106KE47D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
C1608X5R0J106K080AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CC0603KRX7R6BB106
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EMK107BBJ106MA-T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
CL10B106MQ8NRNC Grenzwerte & elektrische Eigenschaften
| Capacitance | 10 uF |
| Capacitance Tolerance | +/-20% |
| Rated Voltage (DC) | 6.3 V |
| Dielectric Characteristic | X7R (EIA) |
| Gehäuse / Bauform | 0603 (1608 Metric) |
| Length | 1.60 mm |
| Width | 0.80 mm |
| Thickness (Max) | 0.90 mm |
| Betriebstemperatur | -55C to +125C |
| Temperature Coefficient | +/-15% over -55C to +125C (X7R) |
| Montageart | Surface Mount |
| Termination Style | SMD - Nickel barrier / Tin solder |
| Packaging | Tape & Reel (7-inch) |
| RoHS-Status | Compliant |
CL10B106MQ8NRNC 0603 (1608 metric) Pinbelegungsleitfaden
Pinbelegung für CL10B106MQ8NRNC (0603 (1608 metric)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für CL10B106MQ8NRNC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
CL10B106MQ8NRNC ist geeignet für 6 Anwendungs: Microcontroller Power Rail Decoupling, LDO Regulator Output Smoothing, USB and Portable Device Power Filtering, DC-DC Converter Input/Output Filtering, Audio Codec and Analog Signal Decoupling, IoT and Sensor Module Power Conditioning.
Microcontroller Power Rail Decoupling
The CL10B106MQ8NRNC is widely deployed as a local bulk-decoupling capacitor on microcontroller power pins (VDD/AVDD). At 10 uF in 0603, it provides low-impedance energy storage for sub-microsecond load transients that switching regulators cannot respond to quickly. The X7R dielectric maintains +/-15% capacitance over -55C to +125C, ensuring stable decoupling across industrial temperature ranges. Mount the part within 1-2 mm of the IC VDD pin with wide, short traces to minimize parasitic inductance. For multi-rail MCUs, place one 10 uF CL10B106MQ8NRNC near each VDD domain alongside smaller 100 nF X7R bypass capacitors for high-frequency noise suppression. The 6.3V rating is comfortable margin for 3.3V MCU rails.
Empfohlen
LDO Regulator Output Smoothing
Place the CL10B106MQ8NRNC at the output of low-dropout regulators (LDOs) to suppress load-transient spikes and stabilize the regulator control loop. Its 10 uF capacitance satisfies the minimum output capacitance requirement of most 1A-rated LDOs and reduces output impedance to below 10 milliohms in the 100 kHz to 1 MHz band. The 6.3V rating is compatible with 5V LDO outputs and leaves adequate margin for load-dump transients. For optimal LDO stability, observe the ESR window specified by the regulator datasheet - X7R MLCCs typically fall within the stable range for most modern LDOs. Pair the 10 uF bulk cap with a 1 uF or 100 nF X7R to handle both low-frequency load steps and high-frequency noise.
Empfohlen
USB and Portable Device Power Filtering
The CL10B106MQ8NRNC is well-suited for filtering on USB VBUS rails and inside portable battery-powered devices. Its 0603 footprint occupies only 1.6 mm x 0.8 mm of board area, critical for wearables, TWS earbuds, and IoT sensor nodes where PCB real estate is scarce. The X7R dielectric provides stable performance across the -20C to +70C range typical of consumer portable devices. For USB 2.0 applications, place a 10 uF CL10B106MQ8NRNC on the VBUS line along with ESD protection to absorb hot-plug inrush transients. Battery-powered designs benefit from the MLCC's negligible leakage current compared to electrolytic alternatives, extending standby time.
Empfohlen
DC-DC Converter Input/Output Filtering
Use the CL10B106MQ8NRNC on switching regulator inputs to attenuate high-frequency ripple and on outputs to smooth PWM switching transients. The 0603 X7R MLCC handles the high di/dt loops around buck/boost converters effectively up to several MHz. For a 1A buck converter running at 1 MHz, two parallel 10 uF MLCCs typically provide <20 mV peak-to-peak output ripple. Note that X7R capacitors lose significant capacitance under DC bias - a 10 uF 6.3V X7R may deliver only 5-6 uF at 5V bias. For applications requiring tight DC bias performance, consider X5R alternatives or parallel multiple smaller-value capacitors. The 6.3V rating works on 3.3V and 5V rails.
Empfohlen
Audio Codec and Analog Signal Decoupling
The CL10B106MQ8NRNC serves as a clean power-rail bypass for audio codecs, ADCs, DACs, and op-amp supply pins where low-noise performance is critical. X7R dielectric has lower piezoelectric noise than larger-case MLCCs and is preferred for audio signal chains where capacitor microphonics would otherwise inject audible noise. Place the 10 uF MLCC close to the AVDD pin of audio ICs, paired with a 100 nF X7R for high-frequency noise rejection. The 0603 size enables dense analog/digital mixed-signal PCB layouts common in audio interfaces. For premium audio applications, consider C0G/NP0 alternatives in smaller capacitance values since C0G has zero piezoelectric effect.
Empfohlen
IoT and Sensor Module Power Conditioning
The CL10B106MQ8NRNC is ideal for IoT sensor modules, BLE/Zigbee transceivers, and low-power wireless nodes where compact size and reliable decoupling are required. At 10 uF in 0603, it provides energy reservoir capacity for radio TX bursts that draw 20-50 mA peaks from a coin-cell or small Li-ion source. The X7R dielectric handles the -40C to +85C industrial IoT range with stable capacitance. Place one CL10B106MQ8NRNC at each sensor IC power pin and at the wireless module's VDD input. The RoHS-compliant lead-free termination supports modern SMT assembly lines common in IoT product manufacturing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für CL10B106MQ8NRNC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | CL10B106MQ8NRN | CL10B106KP8NNNC | GRM188R60J106KE47D | C1608X5R0J106K080AB | CC0603KRX7R6BB106 | EMK107BBJ106MA-T |
|---|---|---|---|---|---|---|---|
| Brand | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Murata Manufacturing | TDK | YAGEO | Taiyo Yuden |
| Package | 0603 (1608 Metric) | 0603 (1608 Metric) - same | 0603 (1608 Metric) - same | 0603 (1608 Metric) - same | 0603 (1608 Metric) - same | 0603 (1608 Metric) - same | 0603 (1608 Metric) - same |
| Capacitance | 10 uF | 10 uF | 10 uF | 10 uF | 10 uF | 10 uF | 10 uF |
| Rated Voltage | 6.3 V | 6.3 V | 10 V | 6.3 V | 6.3 V | 10 V | 6.3 V |
| Dielectric | X7R | X7R | X7R | X7R | X5R | X7R | X5R |
| Tolerance | +/-20% | +/-20% | +/-10% | +/-10% | +/-10% | +/-10% | +/-20% |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +85C | -55C to +125C | -55C to +85C |
Wichtigste Unterscheidungsmerkmale
- Industry-standard 10 uF X7R in compact 0603 case (vs. GRM188R60J106KE47D)
- Lower voltage rating for higher volumetric efficiency (vs. CL10B106KP8NNNC)
- Wide temperature range X7R for industrial use (vs. EMK107BBJ106MA-T)
Designhinweise
Follow IPC-7351 nominal land pattern for 0603 MLCCs: pads of approximately 0.9 mm x 0.8 mm with solder mask clearance per the IPC standard. Place the CL10B106MQ8NRNC within 1-2 mm of the IC power pin it is decoupling, and use wide, short traces to minimize parasitic inductance. For multi-layer boards, place vias adjacent to the pad to connect the ground side to an inner ground plane - this reduces inductance by an order of magnitude versus routing the ground return on the surface layer. Avoid routing noisy digital signals directly over the MLCC to prevent coupling.
X7R MLCCs like the CL10B106MQ8NRNC lose substantial capacitance under DC bias. A 10 uF 6.3V X7R part may deliver only 5-6 uF of effective capacitance when biased at 5V DC due to the dielectric's voltage coefficient. This is normal physics, not a defect. For applications where DC bias loss is unacceptable, consider paralleling two 4.7 uF X7R parts (which together still fit in a small footprint) or use an X5R part. Always check the manufacturer's DC bias curves in the datasheet before finalizing your design.
Solder the CL10B106MQ8NRNC using a standard lead-free reflow profile with peak temperature of 245-260C for 20-40 seconds above 217C (per JEDEC J-STD-020). The nickel-barrier termination prevents silver migration and the tin-solder plating is compatible with SAC305 lead-free solder paste. For double-sided assembly, mount MLCCs on the top side first to reduce risk of tombstoning during the second reflow pass. Avoid hand-soldering with excessive heat that can crack the ceramic body due to thermal shock - use a temperature-controlled iron at 310-340C.
Compliance-Informationen
RoHS compliant per Samsung Electro-Mechanics product information. Lead-free nickel-barrier / tin-solder termination. Not AEC-Q100 qualified (this is a passive component; AEC-Q200 is the relevant automotive passive standard - Q200 grade is typically industrial here). Always confirm latest compliance statements with the manufacturer's latest datasheet revision.
