CY8C5566LTI-017 - 67MHz PSoC 5 MCU | Infineon Technologies
Teilenummer: CY8C5566LTI-017 ✓ AktivCY8C5566LTI-017 Übersicht
A PSoC, or programmable system-on-chip, is a microcontroller architecture that combines a CPU with configurable analog and digital peripherals. Within the embedded semiconductor hierarchy, PSoC 5 belongs to the microcontroller and embedded-processing category, while the ARM Cortex-M3 core provides a standard 32-bit instruction set and a familiar firmware-development ecosystem.
The CY8C5566LTI-017 operates at 67 MHz and includes 64 KB of flash organized as 64K x 8 bits. Its integrated programmable resources allow designers to implement control logic, analog signal conditioning, and digital peripheral functions without relying on a large collection of discrete components. The 68-QFN package also supports compact, surface-mount PCB designs.
The CY8C55 device is part of the PSoC 5 family, which combines configurable digital blocks and analog peripherals around an ARM Cortex-M3 processor. This architecture is useful when product requirements extend beyond basic GPIO control and include mixed-signal acquisition, programmable filtering, timers, serial communication, or embedded control functions.
Typical design roles include industrial control modules, sensor-conditioning systems, building-automation controllers, compact data-acquisition equipment, consumer peripherals, and embedded motor or power-control systems. Engineers can use the integrated programmable blocks to adapt functionality while retaining a microcontroller-based software model.
PCB planning should account for the exposed-pad construction and thermal path of the 68-QFN package. Follow the manufacturer land-pattern and soldering guidance, place decoupling capacitance close to the supply pins, and verify signal routing against the device pin-description table before fabrication.
This product page consolidates the exact core, clock, memory, and package characteristics into an engineering-oriented selection resource. It also provides application guidance, design considerations, source links, and a structured comparison framework for evaluating replacement decisions.
Drop-in-Alternativen für CY8C5566LTI-017 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernCY8C5566LTI-017 Grenzwerte & elektrische Eigenschaften
| Product Type | 32-bit programmable system-on-chip microcontroller |
| Product Family | PSoC 5 CY8C55 |
| Processor Core | ARM Cortex-M3 |
| Architecture | 32-bit |
| Maximum CPU Frequency | 67 MHz |
| Flash Memory | 64 KB (64K x 8 bits) |
| Core Count | 1 core |
| Package Type | 68-QFN (8 x 8 mm) |
| Package Construction | 68-VFQFN with exposed pad |
| Montageart | Surface mount |
| Programmable Resources | Integrated programmable digital and analog peripheral blocks |
CY8C5566LTI-017 68-vfqfn with exposed pad Pinbelegungsleitfaden
Pinbelegung für CY8C5566LTI-017 (68-vfqfn with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für CY8C5566LTI-017.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
CY8C5566LTI-017 ist geeignet für 6 Anwendungs: Industrial Sensor Conditioning and Control, Compact Data-Acquisition Systems, Building Automation Controllers, Consumer Interface and Peripheral Control, Programmable Motor and Power-Control Modules, Embedded Communication Gateways.
Industrial Sensor Conditioning and Control
The CY8C5566LTI-017 fits compact industrial sensing modules that must acquire analog information, apply configurable signal processing, and execute deterministic control logic. Its 67 MHz ARM Cortex-M3 core provides processing capacity for the PSoC 5 programmable digital and analog resources, while the 64 KB of flash supports device firmware, configuration data, and application code. The 68-QFN 8 x 8 mm package helps reduce board footprint in distributed sensor nodes. Design the analog section against the manufacturer electrical limits, preserve the exposed-pad land pattern, and use local decoupling to keep switching and high-impedance analog circuitry separated.
Empfohlen
Compact Data-Acquisition Systems
CY8C5566LTI-017 can serve as the central controller in a compact data-acquisition system that combines signal conditioning, programmable filtering, digital processing, and data transfer. The 67 MHz ARM Cortex-M3 core is suited to coordinating multiple configurable peripheral blocks, and the 64 KB of flash provides nonvolatile space for acquisition firmware and calibration tables. Use the exact manufacturer pin-description table when assigning analog and digital resources, and validate acquisition bandwidth and accuracy against the device limits before setting sample rates. PCB implementation should account for analog grounding, supply decoupling, and the exposed thermal pad.
Empfohlen
Building Automation Controllers
The CY8C5566LTI-017 is appropriate for building-automation modules that monitor environmental inputs and control outputs while managing communications and local logic. Its 32-bit ARM Cortex-M3 processor at 67 MHz supports responsive multi-peripheral control, and the integrated programmable resources can reduce the need for separate analog and digital interface components. The compact 68-QFN package is useful for space-constrained controllers. Confirm the required serial interfaces, timer resources, operating-temperature range, and supply limits in the manufacturer datasheet before release, and isolate sensitive analog paths from switching nodes on the PCB.
Empfohlen
Consumer Interface and Peripheral Control
The CY8C5566LTI-017 can serve as the primary controller in a consumer peripheral that combines user inputs, analog sensing, status indication, and external communications. The 67 MHz Cortex-M3 core provides ample control bandwidth, while the PSoC 5 architecture allows configurable digital and analog functions to share a common firmware environment. Its 68-QFN 8 x 8 mm package supports dense board layouts. Firmware should initialize only the required peripheral blocks to conserve power, and the hardware design must follow the manufacturer’s exact exposed-pad soldering and decoupling requirements.
Empfohlen
Programmable Motor and Power-Control Modules
CY8C5566LTI-017 is suitable for embedded modules that combine control sequencing, sensor feedback, and configurable signal processing. Its 67 MHz ARM Cortex-M3 core can execute control algorithms and coordinate programmable peripherals, while 64 KB of flash supports firmware and configuration storage. Because the microcontroller must coexist with power stages and switching environments, use the manufacturer electrical limits to define isolation, filtering, and protection requirements. Keep high-current routing away from sensitive analog traces, provide stable local supply decoupling, and thermally design the exposed pad for the module’s actual dissipation.
Empfohlen
Embedded Communication Gateways
The CY8C5566LTI-017 can support compact embedded gateways that acquire local signals, execute protocol handling, and coordinate digital peripherals. Its 32-bit ARM Cortex-M3 core operates at 67 MHz, providing a practical balance of processing performance and integration for mixed-signal control nodes. The 64 KB of flash must be allocated carefully across firmware, configuration, and communication resources. Verify the required serial interfaces, memory map, and peripheral configuration in the manufacturer documentation. For reliable operation, maintain short return paths, separate noisy switching currents, and implement the exposed-pad land pattern exactly.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für CY8C5566LTI-017 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt |
|---|---|
| Brand | Infineon Technologies |
| Package | 68-QFN (8 x 8 mm) |
| Product Type | PSoC 5 CY8C55 microcontroller |
| Processor Core | ARM Cortex-M3 |
| Architecture | 32-bit |
| Maximum CPU Frequency | 67 MHz |
| Flash Memory | 64 KB (64K x 8 bits) |
| Core Count | 1 core |
| Programmable Resources | Integrated programmable digital and analog peripheral blocks |
| Mounting Type | Surface mount |
Wichtigste Unterscheidungsmerkmale
- Compact PSoC 5 integration (vs. Discrete Cortex-M3 and analog-component design)
- Defined nonvolatile program-memory capacity (vs. A controller with a different flash organization)
- 32-bit processing performance (vs. An 8-bit or 16-bit embedded controller)
Designhinweise
Use the manufacturer’s 68-QFN land pattern and exposed-pad drawing rather than a generic 68-pin footprint. Confirm pad dimensions, solder-mask definition, paste-aperture design, and the electrical connection assigned to the exposed pad. A small dimension mismatch can shift solder volume, weaken thermal performance, or create an unintended connection even when the nominal package body is 8 x 8 mm.
Place required bypass capacitors close to their associated supply pins and route each connection with minimum loop area. Keep the return path beneath the device continuous, and separate sensitive analog inputs from digital switching and high-current outputs. The exposed pad should be connected to the designated potential shown in the manufacturer package documentation, with thermal-via placement selected from the recommended PCB stack-up.
Do not assume that another PSoC 5 suffix code is pin-compatible. Compare the complete pin-description table, package drawing, supply limits, clock configuration, memory map, peripheral assignments, and exposed-pad connection before substituting any variant. Firmware compiled for one ordering code should not be assumed to operate correctly on another device even when both descriptions include the CY8C55 family name.
Thermal performance depends on the exposed-pad copper, via pattern, board area, copper layers, and the device’s actual dissipation. Evaluate those factors together rather than treating the 68-QFN package as an independent heat sink. For temperature-sensitive designs, verify the selected ordering code against the required ambient and junction limits and monitor thermal rise during worst-case operating conditions.
Compliance-Informationen
Compliance status was not stated in the cited product listings. Confirm the exact ordering code’s declarations and certifications with the manufacturer before regulatory submission or qualification.