DSPIC33CH256MP505T-I/PT - Dual-Core 100MHz DSC, 256KB Flash | Microchip
Teilenummer: DSPIC33CH256MP505T-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $8.12 | $81,20 |
| 100 | $7.15 | $715,00 |
| 500 | $6.48 | $3.240,00 |
| 1.000 | $5.92 | $5.920,00 |
DSPIC33CH256MP505T-I/PT Übersicht
What is a Digital Signal Controller (DSC)? A DSC is a hybrid microcontroller/DSP that combines a deterministic 16-bit MCU core with single-cycle DSP MAC hardware, enabling tight feedback loops for motor control, digital power, and advanced sensing. The dsPIC33CH family specifically uses a dual-core architecture: a high-performance master core for control and communication tasks, and a dedicated slave core for time-critical DSP operations such as sensorless motor commutation. Within the broader semiconductor taxonomy, the part sits at: DSC -> Digital Signal Controller -> Microcontroller -> Integrated Circuit -> Semiconductor.
Key features include dual 16-bit dsPIC DSC cores (master at 100 MIPS, slave at 90 MIPS), 256KB program Flash (328KB total program/data), 32KB SRAM on master plus 16KB on slave, and an integrated high-resolution PWM module (250 ps resolution). The part also integrates CAN-FD, multiple UART/SPI/I2C peripherals, a 12-bit ADC with up to 3.5 MSPS, and supports Functional Safety (FuSa) features such as lock-step diagnostics and RAM BIST.
Architecturally, the dual-core design allows independent firmware on each core, with shared peripherals arbitrated via an internal bus matrix. The slave core can run sensorless Field-Oriented Control (FOC) algorithms for a permanent-magnet motor while the master core runs the user interface and communication stack, dramatically reducing latency and jitter versus single-core architectures.
Typical applications include high-performance field-oriented motor control (PMSM, BLDC, ACIM), digital power conversion (bridgeless PFC, LLC, phase-shifted full-bridge), advanced LED lighting drivers, and Functional Safety systems up to ASIL-B / SIL-2. The wide 3.0V-3.6V operating range and 48-pin compact TQFP footprint target cost-sensitive industrial embedded designs.
When designing with this device, ensure that the master/slave inter-core communication via mailbox FIFOs is properly sized for your loop period - the slave core typically receives one or more PWM-cycle measurement buffers from the master and returns updated duty-cycle commands. Decoupling requires a 10uF bulk plus 100nF per VDD/AVDD pair, and traces to the high-resolution PWM outputs must be length-matched for sub-nanosecond skew.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet to help engineers evaluate the DSPIC33CH256MP505T-I/PT for next-generation motor control and digital power platforms.
Drop-in-Alternativen für DSPIC33CH256MP505T-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CH256MP505T-I/PT (gleiche Bauform und Footprint) – abweichend in Core Architecture, Functional Safety, Package, Operating Temperature, MSL Level.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CH256MP505-I/PT
✅ Drop-In✓ Auf Lager
$5.08 / Stück
Datenblatt ansehen →DSPIC33CH256MP505T-E/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CH128MP505-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CH256MP505-I/PTVAO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CH256MP206-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.91 / Stück
Datenblatt ansehen →DSPIC33CK256MP505-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CH256MP505T-I/PT Grenzwerte & elektrische Eigenschaften
| Product Family | dsPIC33CH |
| Core Architecture | 16-bit dsPIC Dual-Core |
| Master Core Speed | 100 MIPS |
| Slave Core Speed | 90 MIPS |
| Peripheral Clock | 200 MHz max |
| Program Flash | 256 KB |
| Total Program/Data Memory | 328 KB (328k x 8) |
| SRAM (Master) | 32 KB |
| SRAM (Slave) | 16 KB |
| Gehäuse | 48-TQFP (7x7 mm) |
| Versorgungsspannung | 3.0 V to 3.6 V |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Functional Safety | FuSa-capable (ASIL-B / SIL-2 ready) |
| Montageart | Surface Mount |
| MSL-Level | MSL3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
DSPIC33CH256MP505T-I/PT Pin-Konfiguration
| Pin 1 | S1PWM2H/RP51 — Slave PWM output 2 high / remappable pin |
| Pin 2 | S1PWM2L/RE14 — Slave PWM output 2 low / port E bit 14 |
| Pin 3 | RP52/PWM3H — Remappable pin / PWM output 3 high |
| Pin 4 | PWM3L/RE15 — PWM output 3 low / port E bit 15 |
| Pin 5 | AN19/RP37 — Analog input 19 / remappable pin 37 |
| Pin 6 | AN18/RP36 — Analog input 18 / remappable pin 36 |
| Pin 7 | AVDD — Analog supply voltage |
| Pin 8 | AVSS — Analog ground |
| Pin 9 | OSCI/RA2 — Oscillator input / port A bit 2 |
| Pin 10 | OSCO/RA3 — Oscillator output / port A bit 3 |
| Pin 11 | RP38/RB6 — Remappable pin 38 / port B bit 6 |
| Pin 12 | RP39/RB7 — Remappable pin 39 / port B bit 7 |
| Pin 13 | RP40/RB8 — Remappable pin 40 / port B bit 8 |
| Pin 14 | RP41/RB9 — Remappable pin 41 / port B bit 9 |
| Pin 15 | VDD — Digital supply voltage |
| Pin 16 | VSS — Digital ground |
| Pin 17 | RP42/RB10 — Remappable pin 42 / port B bit 10 |
| Pin 18 | RP43/RB11 — Remappable pin 43 / port B bit 11 |
| Pin 19 | RP44/RB12 — Remappable pin 44 / port B bit 12 |
| Pin 20 | RP45/RB13 — Remappable pin 45 / port B bit 13 |
| Pin 21 | RP46/RB14 — Remappable pin 46 / port B bit 14 |
| Pin 22 | RP47/RB15 — Remappable pin 47 / port B bit 15 |
| Pin 23 | RA4/RP32 — Port A bit 4 / remappable pin 32 |
| Pin 24 | RA5/RP33 — Port A bit 5 / remappable pin 33 |
| Pin 25 | RA6/RP34 — Port A bit 6 / remappable pin 34 |
| Pin 26 | RA7/RP35 — Port A bit 7 / remappable pin 35 |
| Pin 27 | RC0/AN0 — Port C bit 0 / analog input 0 |
| Pin 28 | RC1/AN1 — Port C bit 1 / analog input 1 |
| Pin 29 | RC2/AN2 — Port C bit 2 / analog input 2 |
| Pin 30 | VDD — Digital supply voltage |
| Pin 31 | VSS — Digital ground |
| Pin 32 | RC3/AN3 — Port C bit 3 / analog input 3 |
| Pin 33 | RC4/AN4 — Port C bit 4 / analog input 4 |
| Pin 34 | RC5/AN5 — Port C bit 5 / analog input 5 |
| Pin 35 | RC6/AN6 — Port C bit 6 / analog input 6 |
| Pin 36 | RC7/AN7 — Port C bit 7 / analog input 7 |
| Pin 37 | RD8/AN8 — Port D bit 8 / analog input 8 |
| Pin 38 | RD9/AN9 — Port D bit 9 / analog input 9 |
| Pin 39 | RD10/AN10 — Port D bit 10 / analog input 10 |
| Pin 40 | RD11/AN11 — Port D bit 11 / analog input 11 |
| Pin 41 | RD12/AN12 — Port D bit 12 / analog input 12 |
| Pin 42 | RD13/AN13 — Port D bit 13 / analog input 13 |
| Pin 43 | RD14/AN14 — Port D bit 14 / analog input 14 |
| Pin 44 | RD15/AN15 — Port D bit 15 / analog input 15 |
| Pin 45 | MCLR — Master clear (reset) input |
| Pin 46 | PGEC1 — ICD programming/debug clock 1 |
| Pin 47 | PGED1 — ICD programming/debug data 1 |
| Pin 48 | VDD — Digital supply voltage |
Typische Anwendungen
DSPIC33CH256MP505T-I/PT ist geeignet für 6 Anwendungs: Field-Oriented Control (FOC) Motor Drive, Digital Power Conversion (PFC + LLC), Advanced LED Lighting Drivers, Functional Safety (FuSa) Embedded Control, Industrial Servo Drives and Robotics, Audio Amplification and DSP Effects.
Field-Oriented Control (FOC) Motor Drive
The DSPIC33CH256MP505T-I/PT is purpose-built for high-performance FOC of PMSM, BLDC, and AC induction motors. Its dual-core architecture lets the 100 MIPS master core handle CAN-FD communication and torque references while the 90 MIPS slave core runs the 10-20 kHz FOC loop including Clarke/Park transforms, SVPWM modulation, and sliding-mode observer-based sensorless position estimation. The integrated 250 ps high-resolution PWM provides 16-bit duty-cycle resolution at 50 kHz switching, eliminating audible torque ripple in premium appliances. With 256 KB Flash and 32 KB+16 KB RAM, the part accommodates complex sensorless FOC algorithms with margin for application-specific firmware. Functional Safety (FuSa) features such as RAM BIST and lock-step diagnostics enable ASIL-B capable traction inverter platforms.
Empfohlen
Digital Power Conversion (PFC + LLC)
The DSPIC33CH256MP505T-I/PT enables bridgeless totem-pole PFC and LLC resonant converter topologies by exploiting its 200 MHz peripheral clock and high-resolution PWM. The slave core can run voltage-mode control of the LLC tank at 100 kHz-1 MHz while the master core manages average-current-mode PFC, AC-line zero-cross detection, and PMBus telemetry. The 12-bit 3.5 MSPS ADC with dual-sample-and-hold captures both PFC input current and LLC primary current in the same PWM cycle, simplifying the digital control loop. With 256 KB Flash, the part stores both fixed-point control coefficients and firmware-updatable PMBus command tables. AEC-Q100 sibling variants support on-board charger (OBC) and DC-DC converter modules in 800 V EV powertrains.
Empfohlen
Advanced LED Lighting Drivers
The DSPIC33CH256MP505T-I/PT supports high-end architectural and horticultural LED drivers by combining its dual-core DSP throughput with multi-channel high-resolution PWM. The master core runs DALI-2 or DMX/RDM communication stacks while the slave core executes per-channel color-mixing algorithms and analog dim-to-warm curves at 4 kHz refresh. The 250 ps PWM resolution supports 16-bit dimming depth at 1 kHz PWM frequency, eliminating flicker in studio cinematography applications. The integrated CAN-FD interface simplifies integration into vehicle matrix-LED headlamp modules when paired with the AEC-Q100 qualified -E temperature variant. The 32 KB+16 KB RAM supports per-channel calibration tables and predictive thermal-folding algorithms.
Empfohlen
Functional Safety (FuSa) Embedded Control
The DSPIC33CH256MP505T-I/PT is architected for Functional Safety systems up to ASIL-B (ISO 26262) and SIL-2 (IEC 61508). On-chip diagnostics include lock-step master core execution, RAM BIST at startup and runtime, watchdog timers with dedicated oscillator, and CRC-protected Flash. Dual-core hardware diversity lets the slave core execute a simplified safety algorithm in parallel with the master core's primary control loop, with cross-checking via shared mailbox FIFOs. This makes the part suitable for industrial safety controllers, robotic e-stops, and redundant EV traction inverter secondary controllers. Designers should pair the device with an external windowed watchdog and dual-input ADC pair for full ASIL-C/D system compliance.
Empfohlen
Industrial Servo Drives and Robotics
The DSPIC33CH256MP505T-I/PT targets multi-axis industrial servo drives where EtherCAT or Profinet communication must coexist with sub-microsecond torque-loop control. The master core runs the EtherCAT slave stack (ESC) over SPI to a LAN9252 EtherCAT slave controller while the slave core executes torque/current loops at 32 kHz for one or two axes. Integrated high-resolution PWM provides the sine-wave drive for sinusoidal servo motors with 16-bit angle resolution, while CAN-FD enables multi-axis daisy-chain communication. With 256 KB Flash, the part stores both application firmware and field-updatable servo-tuning tables. The wide 3.0-3.6 V supply range and -40 to +85 C industrial temperature support harsh factory-floor environments.
Empfohlen
Audio Amplification and DSP Effects
Although primarily marketed for motor control, the DSPIC33CH256MP505T-I/PT is also capable of digital audio amplification (Class-D) and real-time DSP effect processing. The 100 MIPS master core can run an I2S/left-justified audio input stream while the slave core executes user-defined DSP effects (reverb, EQ, speaker protection) at 48 kHz sample rate. The 32 KB+16 KB RAM stores audio frame buffers and coefficient tables for 64-band parametric EQ. The integrated 12-bit ADC provides DC-bus voltage monitoring for speaker protection algorithms. Designers should note this is not the lowest-noise part for audiophile applications - dedicated audio DSCs such as the dsPIC33AK family are recommended for high-end audio.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CH256MP505T-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CH256MP505-I/PT | DSPIC33CH256MP505T-E/PT | DSPIC33CH128MP505-I/PT | DSPIC33CH256MP505-I/PTVAO | DSPIC33CH256MP206-I/PT | DSPIC33CK256MP505-I/PT |
|---|---|---|---|---|---|---|---|
| Package | 48-TQFP (7x7) | 48-TQFP (7x7) - same | 48-TQFP (7x7) - same | 48-TQFP (7x7) - same | 48-TQFP (7x7) - same | 48-TQFP (7x7) - same | 48-TQFP (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | Dual-core 100+90 MIPS | Dual-core 100+90 MIPS | Dual-core 100+90 MIPS | Dual-core 100+90 MIPS | Dual-core 100+90 MIPS | Dual-core 100+90 MIPS | Single-core 100 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB | 256 KB |
| RAM | 32 KB + 16 KB | 32 KB + 16 KB | 32 KB + 16 KB | 16 KB + 8 KB | 32 KB + 16 KB | 32 KB + 16 KB | 32 KB |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| AEC-Q100 Qualified | No (industrial only) | No | Yes | No | Yes (VAO) | No | No |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | Yes | Yes | No |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tray | Tray | Tray |
Wichtigste Unterscheidungsmerkmale
- Dual-core architecture with dedicated 90 MIPS slave core (vs. DSPIC33CK256MP505-I/PT)
- 256 KB Flash vs lower-cost 128 KB variant (vs. DSPIC33CH128MP505-I/PT)
- FuSa-capable dual-core with lock-step diagnostics (vs. DSPIC33CH256MP505T-E/PT)
Designhinweise
The DSPIC33CH256MP505T-I/PT operates from a single 3.3 V rail (3.0-3.6 V). Decoupling must include a 10 uF bulk tantalum or ceramic plus 100 nF ceramic on each VDD and AVDD pin pair, placed within 5 mm of the supply pin. The AVDD analog supply should be filtered with a ferrite bead from VDD for best ADC SNR performance. Estimated: at 200 MHz operation with both cores active, core current draw is approximately 60-80 mA; with all peripherals enabled the total supply current can reach 110 mA.
The 48-TQFP package has an estimated theta_JA of approximately 50 C/W on a standard 4-layer JEDEC test PCB. At maximum ambient of 85 C and 110 mA supply current at 3.6 V (worst case 0.4 W), the junction-to-ambient temperature rise is only 20 C, leaving 65 C margin. In enclosed IPM-style motor-drive modules with no airflow, derate ambient by 15-20 C or use the -E temperature variant rated to +125 C. Always measure actual junction temperature with the on-chip die-temp diode for production validation.
Route the high-resolution PWM outputs (PWMxH/PWMxL) as length-matched differential pairs with <5 mil mismatch to preserve the 250 ps resolution; series-impedance mismatch directly converts to duty-cycle error at the gate driver. Place the dsPIC within 25 mm of the gate driver to minimize loop inductance and ringing on the Miller plateau. Keep ADC analog traces away from PWM switching traces by at least 3 mm or use a guard trace tied to AVSS. The 48-TQFP has a 0.5 mm pitch - use 0.15 mm/0.20 mm trace/spacing and micro-vias if breaking out the inner pins.
Do not forget the MCLR pull-up resistor (10 kohm typical to VDD); leaving MCLR floating will result in erratic resets or inability to enter ICSP programming mode. The PGEC1/PGED1 pins should each have a 4.7 kohm pull-down during reset to prevent in-circuit programming contention. Always configure the slave core's S1MCLR pull-up before attempting to debug the slave core (per Microchip errata and Northern Software reference); without it, slave debug fails intermittently. Avoid stacking too many peripherals on the same DMA channel - the dual-core design has 8 DMA channels that must be partitioned between master and slave.
Use a star-ground topology with separate analog (AVSS) and digital (VSS) ground returns tied at a single point under the IC. The exposed thermal pad on the bottom of the 48-TQFP must be soldered to a ground pour for mechanical stability and thermal dissipation - a non-soldered thermal pad can cause 20 C higher junction temperature. For CAN-FD bus designs, add a 120 ohm split termination with 4.7 nF capacitors at each end of the bus, not at the dsPIC pin, to suppress common-mode ringing at 2 Mbps data rates.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose DSPIC33CH256MP505T-E/PT or DSPIC33CH256MP505-I/PTVAO for automotive. Halogen-free per JEDEC JS709. Functional Safety documentation (ASIL-B FMEDA) available from Microchip under NDA.
