DSPIC33CK256MP502T-I/2N - 100MHz 256KB DSC CAN-FD | Microchip
Teilenummer: DSPIC33CK256MP502T-I/2N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.35 | $2,35 |
| 10 | $2.15 | $21,50 |
| 100 | $2.09 | $209,00 |
| 500 | $1.98 | $990,00 |
| 1.000 | $1.89 | $1.890,00 |
DSPIC33CK256MP502T-I/2N Übersicht
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and deterministic interrupt architecture of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits at the top of Microchip's 16-bit lineup, targeting closed-loop control loops that run at hundreds of kilohertz where a general-purpose MCU would lack the DSP MAC instructions and PWM resolution required.
Key differentiating features include the 250 ps PWM resolution (achieved through the high-resolution PWM peripheral with FIFO and local DMA support), three integrated op-amps and comparators that offload analog front-end signal conditioning, dual-panel flash enabling live firmware updates, and CAN Flexible Data (CAN FD) for automotive and industrial networking at data rates beyond classical CAN.
Technically, the core executes up to 100 MIPS with DSP engine support (single-cycle MAC, dual fetch), 4 DMA channels, and independent peripheral pin select (PPS) for flexible I/O mapping. The 12-bit ADC supports high-speed conversions needed for current-loop sampling in switch-mode power supplies.
Typical applications include digital power supplies (PFC, LLC, totem-pole converters), brushless DC and PMSM motor control, wireless charging, and high-brightness LED drivers where fast control loops are essential.
Design consideration: the 3.0-3.6 V supply range means the part cannot run directly from 5 V rails; level shifting is required for 5 V peripherals.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33CK256MP502T-I/2N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CK256MP502T-I/2N (gleiche Bauform und Footprint) – abweichend in Package, CAN Interface, Core Architecture, Program Flash.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CK256MP502T-E/2N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK256MP502-I/2N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CK256MP202-I/2N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CH64MP202-I/2N
✅ Drop-In✓ Auf Lager
$3.31 / Stück
Datenblatt ansehen →DSPIC33CK128MP202-I/2N
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →DSPIC33CK256MP502T-I/2N Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit dsPIC33C DSC |
| Maximale Taktfrequenz | 100 MHz (100 MIPS) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM | 24 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| PWM Resolution | 250 ps |
| CAN Interface | CAN FD |
| On-chip Op-Amps | 3 |
| Comparators | 3 |
| ADC Resolution | 12-bit |
| DMA Channels | 4 |
| Timers | 3 |
| Betriebstemperatur | -40C to +85C |
| Gehäuse | 28-UQFN (6x6 mm) with exposed pad |
| Montageart | Surface Mount |
| Packaging | Tape and Reel (T suffix) |
| RoHS-Status | Compliant |
DSPIC33CK256MP502T-I/2N 28-uqfn (6x6 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33CK256MP502T-I/2N (28-uqfn (6x6 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33CK256MP502T-I/2N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33CK256MP502T-I/2N ist geeignet für 6 Anwendungs: Digital Power Supplies, BLDC and PMSM Motor Control, Automotive and Industrial Networking Nodes, Wireless Charging Systems, High-Brightness LED Drivers, Advanced Sensing and Control.
Digital Power Supplies
The DSPIC33CK256MP502T-I/2N fits digital power conversion directly: its 250 ps PWM resolution allows duty-cycle and dead-time adjustment far finer than switch-period limits, which is essential for PFC stages, LLC resonant converters, and totem-pole PFC running at 100 kHz to 1 MHz. The three integrated op-amps read shunt currents without external amplifiers, and the 12-bit ADC can sample synchronously with PWM triggers to reduce switching-noise error. Used as the main supervisory controller between the feedback dividers and gate drivers, the 100 MHz core closes current-mode loops in a few microseconds. Trade-off: the 3.0-3.6 V rail means gate-drive logic must be level-shifted to 5 V or 12 V drivers.
Empfohlen
BLDC and PMSM Motor Control
For field-oriented control (FOC) of brushless DC and PMSM motors, the DSPIC33CK256MP502T-I/2N provides the complete signal chain on chip. The three op-amps amplify low-side shunt phase currents, the 12-bit ADC converts them synchronized to the PWM center, and the high-resolution PWM peripheral generates six outputs with 250 ps dead-time resolution - critical for efficiency and audible-noise reduction. The 100 MHz DSP core with single-cycle MAC executes Clarke/Park transforms and PI loops at update rates of 20 kHz and above with heavy margin. The CAN FD interface supports industrial drive networking. Firmware-only trade-off: the single-core design must sequence control and communication tasks in one core.
Empfohlen
Automotive and Industrial Networking Nodes
The integrated CAN FD module makes the DSPIC33CK256MP502T-I/2N suitable for in-vehicle sensor/actuator nodes and industrial fieldbus endpoints. CAN FD raises payload to 64 bytes and switches to a faster data phase, and having it on-chip eliminates an external controller and SPI latency, improving worst-case message turnaround. The -40C to +85C I-grade operating range covers automotive cabin and industrial environments (choose the E/2N variant to +125C for under-hood). Dual-panel flash permits field firmware updates over the network. Design consideration: the 3.0-3.6 V supply requires a 3.3 V LDO from the 12 V automotive battery rail, with load-dump transient protection upstream.
Empfohlen
Wireless Charging Systems
Qi-compliant wireless power transmitters and receivers demand precisely controlled high-frequency switching with fast fault response, which the DSPIC33CK256MP502T-I/2N addresses with its 250 ps PWM resolution and 100 MHz loop bandwidth. The high-resolution PWM adjusts the operating point for foreign-object detection and power-negotiation algorithms, while the 12-bit ADC monitors coil current and temperature simultaneously. The DSP engine computes the demodulated communication signal from the power coil in firmware. On-chip comparators provide hardware over-current protection without software latency. Typical use is as the transmitter-side controller driving a half-bridge at 100-200 kHz with complementary PWM and adaptive dead-time.
Empfohlen
High-Brightness LED Drivers
Digitally controlled LED drivers for stage lighting, machine-vision illumination, and horticultural fixtures benefit from the DSPIC33CK256MP502T-I/2N's 250 ps PWM granularity, which enables dimming ratios beyond 10,000:1 without visible flicker at PWM frequencies above 1 kHz. The on-chip op-amps read current-sense shunts for constant-current loops, and comparators trigger cycle-by-cycle current limiting in hardware, protecting the LEDs during transients. The CAN FD interface allows multiple fixtures to be networked for synchronized color and intensity control. The single DSC replaces an analog controller plus a separate microcontroller, reducing BOM count and simplifying dimming-curve firmware customization.
Empfohlen
Advanced Sensing and Control
High-precision sensor front ends - pressure transmitters, load-cell scales, ultrasonic flow meters - use the DSPIC33CK256MP502T-I/2N to perform oversampling, digital filtering, and compensation math on one die. The 12-bit ADC with hardware averaging and the DSP core's MAC units execute FIR/IIR filtering and gain calibration at rates unattainable by general-purpose MCUs at this price. Three op-amps buffer bridge sensors directly, cutting external analog components. The 24 KB RAM buffers waveform captures for diagnostics, and dual-panel flash stores two firmware images for safe field updates. Peripheral Pin Select lets designers match the PCB routing without external crosspoint logic, shortening board spins.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CK256MP502T-I/2N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CK256MP502T-E/2N | DSPIC33CK256MP202-I/2N | DSPIC33CH64MP202-I/2N | DSPIC33CK128MP202-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 64 KB | 128 KB |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 2x100 MHz (dual core) | 100 MHz |
| PWM Resolution | 250 ps | 250 ps | 250 ps | 250 ps | 250 ps |
| CAN FD | Yes (integrated) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
Wichtigste Unterscheidungsmerkmale
- Maximum memory in the 28-pin UQFN family member (vs. DSPIC33CH64MP202-I/2N)
- Extended-temperature drop-in option (vs. DSPIC33CK256MP502T-E/2N)
- Integrated analog front end (vs. DSPIC33CK128MP202-I/2N)
Designhinweise
The DSPIC33CK256MP502T-I/2N operates only from 3.0 V to 3.6 V - it cannot be powered from a 5 V rail. In systems with 5 V peripherals (sensors, transceivers), plan level shifters or choose 5 V-tolerant parts. Place a 0.1 uF ceramic decoupling capacitor at each VDD pin plus one 10 uF bulk capacitor, routed directly to the ground plane through the exposed pad, which must be soldered to a grounded copper pour for both electrical and thermal reasons.
The 28-UQFN (6x6) exposed-pad package requires the center pad to be connected to VSS with a thermal-relief via array (typically 4-9 vias) to the ground plane. For high-resolution PWM traces driving gate drivers, keep the PWM outputs short and route away from the ADC input traces; the 250 ps resolution means even small digital coupling can appear as duty-cycle jitter. Follow the layout guidance in the manufacturer datasheet PCB layout section.
When using the on-chip op-amps for current shunt amplification in motor control or digital power, use Kelvin connections at the shunt resistor and keep the amplifier input traces paired and away from switching nodes. The ADC should be triggered synchronously from the PWM peripheral (rather than free-running) to sample at a fixed point in the switching cycle, minimizing ripple-induced measurement error in the feedback loop.
Migrating from dsPIC33F/33E to dsPIC33CK is not code-compatible in all peripherals - the CK family uses a new PWM and ADC register map, and compiler settings (XC16 with the correct device selection) must be updated. Also note the tape-and-reel T suffix: DSPIC33CK256MP502T-I/2N is supplied in reel form for automated assembly; hand-proto users may prefer the tray-packaged non-T variant DSPIC33CK256MP502-I/2N.
Compliance-Informationen
RoHS compliant and lead-free per Master Electronics datasheet listing. REACH, halogen-free, and conflict-minerals declarations were not present in the verified data; request official certificates from Microchip.
