DSPIC33CK256MP505-E/M4 - 100MHz 256KB Flash DSC | Microchip
Teilenummer: DSPIC33CK256MP505-E/M4 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.29 | $5,29 |
| 10 | $4.85 | $48,50 |
| 25 | $4.55 | $113,75 |
| 100 | $4.12 | $412,00 |
| 1.000 | $3.75 | $3.750,00 |
DSPIC33CK256MP505-E/M4 Übersicht
A digital signal controller is a hybrid device that merges the computational throughput of a digital signal processor with the control peripherals and interrupt architecture of a microcontroller. Within the power management hierarchy, the dsPIC33CK family sits above general-purpose MCUs and below dedicated DSPs, making it the standard choice where real-time control loops and signal processing must execute on a single chip.
Key differentiating features include the 100 MHz dsPIC DSC core (up to 100 MIPS), 256KB (256K x 8) ECC Flash supporting dual-partition boot operation, 24KB of SRAM, and a flexible high-resolution PWM module purpose-built for switch-mode power supplies and PFC stages. The -E temperature grade qualifies the device for -40C to +125C operation.
Architecturally, the CMOS 16-bit core includes a barrel shifter, a 24-bit program memory width, DSP multiply-accumulate instructions, four DMA channels, and boundary-scan (JTAG) debug support. The device can run unpartitioned or be divided into two independent boot partitions (program memory 0x000000-0x02c000), enabling field-safe firmware updates.
Typical applications include digital power supplies (LLC, buck, boost, totem-pole PFC), brushless DC and PMSM motor control, advanced sensing and control nodes, automotive and industrial subsystems leveraging the CAN FD interface, and functional-safety (FuSa) oriented designs.
Design consideration: the exposed-pad UQFN-48 requires a solid ground vias array under the thermal pad for both electrical grounding and heat dissipation; budget the 3.3V rail and decouple each VDD pin with 100 nF close to the package.
This page synthesizes distributor pricing, drop-in family alternatives, verified pin-level data, and practical design notes not found together on any single distributor or manufacturer page.
Drop-in-Alternativen für DSPIC33CK256MP505-E/M4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CK256MP505-E/M4 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Qualification, Core, CAN Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CK256MP505-I/M4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK256MP205-E/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.92 / Stück
Datenblatt ansehen →DSPIC33CK256MP505-E/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK128MP505-E/M4
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.52 / Stück
Datenblatt ansehen →DSPIC33CK256MP506-E/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.05 / Stück
Datenblatt ansehen →DSPIC33CK256MP505-E/M4 Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (up to 100 MIPS) |
| Program Memory Size | 256KB (256K x 8) Flash |
| Program Memory Width | 24 bit |
| RAM Size | 24KB |
| Datenbusbreite | 16 bit |
| Anzahl der Pins | 48 |
| Gehäuse | 48-UQFN (6x6 mm) with exposed pad |
| On-Chip Op Amps | 3 |
| Analog Comparators | 3 |
| CAN Interface | CAN FD (Flexible Data) |
| DMA Channels | 4 |
| Special Peripherals | PTG (Pattern Generator), High-Resolution PWM |
| DSP Features | Barrel shifter, MAC instructions |
| Boundary Scan | Yes (JTAG) |
| Betriebstemperatur | -40C to +125C (E grade) |
| Montageart | Surface Mount |
DSPIC33CK256MP505-E/M4 48-uqfn (6x6 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33CK256MP505-E/M4 (48-uqfn (6x6 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33CK256MP505-E/M4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33CK256MP505-E/M4 ist geeignet für 6 Anwendungs: Digital Power Supplies (LLC, Buck/Boost, PFC), BLDC / PMSM Motor Control, Automotive and CAN FD Networked Nodes, Advanced Sensing and Control, High-Power LED Drivers and Lighting, Embedded Industrial Control and Functional Safety.
Digital Power Supplies (LLC, Buck/Boost, PFC)
The DSPIC33CK256MP505-E/M4 is purpose-built for digital power conversion: its 100 MHz core closes voltage and current loops fast enough for 100-500 kHz LLC and totem-pole PFC stages, while the high-resolution PWM provides sub-nanosecond-class duty resolution for precise switch timing. The three on-chip op amps condition current-shunt signals internally, and the three comparators deliver cycle-by-cycle overcurrent protection without CPU intervention. Placed as the sole controller between the power stage and feedback divider, it eliminates a separate analog controller and reduces BOM count. Trade-off: software control loop latency must be budgeted versus a hardware controller at very high switching frequencies.
Empfohlen
BLDC / PMSM Motor Control
For field-oriented control of brushless DC and permanent-magnet synchronous motors, the DSPIC33CK256MP505-E/M4 combines the DSP multiply-accumulate throughput of its 100 MHz core with complementary PWM outputs and fast analog comparators for overcurrent fault shutdown. The three integrated op amps buffer phase-current sense signals, reducing external component count in the inverter gate-drive path. Four DMA channels offload ADC result transfers, keeping CPU cycles focused on the FOC mathematical loop. The -40C to +125C E-grade rating suits industrial drives and automotive-adjacent pump/fan modules, while CAN FD links the drive to higher-level networked control systems.
Empfohlen
Automotive and CAN FD Networked Nodes
The integrated CAN Flexible Data controller supports 64-byte payloads and higher arbitration bit rates than classical CAN, making the DSPIC33CK256MP505-E/M4 suitable for automotive body modules, sensor fusion nodes, and gateway sub-functions. The -E temperature grade (-40C to +125C) plus Microchip's functional-safety (FuSa) support align the device with automotive qualification environments. On-chip boundary scan (JTAG) aids production test at the module level. Designers should pair the CAN FD peripheral with an external CAN transceiver and confirm EMC layout practice, since the DSC executes time-critical control and network stacks concurrently on one 100 MHz core.
Empfohlen
Advanced Sensing and Control
In precision sensing and control nodes, the DSPIC33CK256MP505-E/M4 applies its 16-bit DSP engine, barrel shifter, and MAC instructions to digital filtering, FFT-based condition monitoring, and sensor linearization. The 24KB SRAM holds multi-sample filter histories, while 256KB ECC Flash retains calibration tables and the application image, optionally split into dual boot partitions for safe field updates. On-chip comparators implement windowed threshold alarms with zero CPU load. The PTG (Pattern Generator) peripheral automates sensor excitation sequences. This makes the part a strong fit for vibration monitoring, load-cell front ends, and industrial process control where DSP-class math and deterministic I/O coexist.
Empfohlen
High-Power LED Drivers and Lighting
Digitally controlled LED drivers benefit directly from the DSPIC33CK256MP505-E/M4's high-resolution PWM, which delivers fine average-current control for dimming without visible flicker, and from its 100 MHz core running constant-current regulation loops for multi-string fixtures. The three op amps sense string currents and the comparators trip fast on open/short faults, protecting the power stage. CAN FD enables DALI-over-CAN or networked architectural lighting control. In high-bay and stage lighting luminaires where junction temperatures run high, the -40C to +125C E-grade provides thermal margin. The dual-partition Flash supports field firmware updates for changing dimming profiles.
Empfohlen
Embedded Industrial Control and Functional Safety
As a general industrial controller, the DSPIC33CK256MP505-E/M4 offers deterministic 100 MIPS execution, 4 DMA channels, and a rich timer/PWM suite for sequencing, metering, and actuator control. Microchip's functional-safety (FuSa) support package assists designs targeting safety-related industrial functions, complemented by ECC Flash protecting program memory integrity and dual-boot partitions enabling redundant image fallback. The 48-pin UQFN balances I/O count against a compact 6x6 mm footprint for dense control cards. Boundary-scan (JTAG) coverage supports ICT-based production test. CAN FD and UART/SPI/I2C links integrate the node into factory networks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CK256MP505-E/M4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CK256MP505-I/M4 | DSPIC33CK256MP505-E/PT | DSPIC33CK256MP205-E/PT |
|---|---|---|---|---|
| Package | 48-UQFN (6x6) | 48-UQFN (6x6) - same | 48-TQFP (7x7) | 48-TQFP (7x7) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 256KB | 256KB | 256KB | 256KB |
| RAM | 24KB | 24KB | 24KB | 24KB |
| On-Chip Op Amps | 3 | 3 | 3 | 2 |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| CAN FD | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Extended -40C to +125C temperature qualification (vs. DSPIC33CK256MP505-I/M4)
- Three on-chip operational amplifiers (vs. DSPIC33CK256MP205-E/PT)
- Compact 6x6 mm UQFN vs 7x7 mm TQFP (vs. DSPIC33CK256MP505-E/PT)
Designhinweise
The 48-UQFN (M4) package has an exposed pad that serves as the primary ground connection. Solder it to a ground copper pour with an array of thermal vias (typically 3x3 to 4x4, filled or plugged) to achieve low ground impedance and acceptable junction-to-board thermal resistance. Do not rely on perimeter pins alone for grounding; high dI/dt from digital power loops will otherwise inject noise into the analog domain. Follow Microchip's UQFN land-pattern application note for stencil aperture design.
Decouple every VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus one bulk capacitor (4.7-10 uF) near the package. When the on-chip op amps and high-resolution PWM are active simultaneously, supply transients increase; a local ferrite bead plus bulk cap on the analog supply helps keep ADC reference noise low. Estimated: at 100 MHz with all peripherals active, core current is in the tens of mA range - confirm the exact figure in the datasheet electrical characteristics section before sizing the 3.3V rail.
Two frequent mistakes: (1) selecting the -I grade where ambient plus self-heating exceeds +85C - the -E grade of this same die is rated to +125C, so verify worst-case junction temperature early; (2) assuming the TQFP /PT and UQFN /M4 parts share a footprint - they do not, so package choice must be locked before layout. Also configure dual-partition boot mode deliberately; an unpartitioned image will not boot correctly if the config bits expect partitioned mode.
Compliance-Informationen
Compliance data not present in retrieved web data; the family is associated with AEC-Q100-adjacent automotive and functional-safety (FuSa) support per GlobalSpec listing, but specific certification values require the Microchip product page confirmation.
