DSPIC33CK32MP502T-I/SS - 100MHz 16-bit DSC 32KB Flash | Microchip
Teilenummer: DSPIC33CK32MP502T-I/SS ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.48 | $1.240,00 |
| 1.000 | $2.21 | $2.210,00 |
DSPIC33CK32MP502T-I/SS Übersicht
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control architecture of a microcontroller. Within the power-management hierarchy, the DSC sits above general-purpose MCUs for closed-loop control tasks: its modified Harvard architecture executes DSP multiply-accumulate instructions while simultaneously servicing fast control loops, making the dsPIC33CK family a standard choice in digital power and motor control systems.
Key features include operation from DC to 100 MIPS at 3.0V to 3.6V, dual-panel flash enabling live firmware updates, high-resolution PWM peripherals for switching power stages, and functional-safety (FuSa) support per DigiKey classification. The integrated analog front-end reduces external component count in current-sense and voltage-feedback loops.
Architecturally, the dsPIC33CK core uses a modified Harvard design with separate program and data buses, hardware DSP engine, and the enhanced peripherals noted by Mouser: CAN-FD, op-amps, 12-bit ADCs and PWM. The device is specified for industrial temperature ranges with the I suffix and is supplied in tape-and-reel packaging for automated assembly.
Typical applications include digital power supplies (PFC, LLC), brushless DC and PMSM motor control, solar inverters, and advanced sensing nodes where deterministic 100 MIPS execution and CAN-FD connectivity are required.
For design, reserve the dual-partition flash scheme to implement live updates and verify supply decoupling on the 3.3V rail for high-frequency PWM switching environments.
This page synthesizes distributor pricing context, same-family drop-in alternatives, and practical design notes beyond the raw datasheet.
Drop-in-Alternativen für DSPIC33CK32MP502T-I/SS – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CK32MP502T-I/SS (gleiche Bauform und Footprint) – abweichend in Architecture, Core, Data SRAM, Package, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CK32MP502-I/SS
✅ Drop-In✓ Auf Lager
$2.35 / Stück
Datenblatt ansehen →DSPIC33CK32MP202-I/SS
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CK256MP202-I/SS
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.15 / Stück
Datenblatt ansehen →DSPIC33CK32MP502T-I/SS Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (up to 100 MIPS) |
| Program Flash | 32 KB (dual-partition, with ECC) |
| Data SRAM | 8 KB |
| Versorgungsspannung | 3.0 V to 3.6 V |
| CAN Interface | CAN-FD |
| Analog Peripherals | On-chip op-amps, 12-bit ADCs |
| PWM | High-resolution PWM peripherals |
| Architecture | Modified Harvard |
| Functional Safety | FuSa supported (per DigiKey classification) |
| Gehäuse | 28-SSOP |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (I grade) |
| Packaging | Tape & Reel (T suffix) |
| RoHS-Status | Compliant |
| Family | dsPIC33CK (MP series) |
DSPIC33CK32MP502T-I/SS 28-ssop Pinbelegungsleitfaden
Pinbelegung für DSPIC33CK32MP502T-I/SS (28-ssop-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33CK32MP502T-I/SS.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33CK32MP502T-I/SS ist geeignet für 6 Anwendungs: Digital Power Supplies, BLDC and PMSM Motor Control, Solar Inverters and Power Conversion, Industrial Sensing and Control Nodes, CAN-FD Networked Embedded Control, Battery Management Systems.
Digital Power Supplies
The DSPIC33CK32MP502T-I/SS fits digitally controlled AC-DC and DC-DC converters because its 100 MHz (100 MIPS) core closes current- and voltage-mode loops fast enough for switching frequencies in the hundreds of kHz, while the high-resolution PWM peripherals deliver the fine duty-cycle and dead-time resolution those topologies demand. The 12-bit ADCs sample feedback signals synchronously with the PWM for predictable control-loop latency, and the dual-partition 32 KB flash with ECC enables live firmware update of the power-supply controller without dropping the output. Use the on-chip op-amps to condition shunt or inductor-current sense signals, minimizing external analog parts. Place the controller near the power stage, keep the analog ground reference quiet, and budget 3.0V-3.6V supply with local decoupling.
Empfohlen
BLDC and PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK32MP502T-I/SS provides field-oriented control execution at 100 MIPS with deterministic interrupt latency, complementary high-resolution PWM outputs for the three-phase inverter, and 12-bit ADCs that trigger on PWM boundaries for phase-current sampling. The on-chip operational amplifiers can amplify shunt-current signals internally, reducing BOM cost in sensorless FOC designs. CAN-FD connectivity integrates the drive into industrial fieldbus networks for command and telemetry. Design consideration: with 32 KB of flash, keep the FOC framework and sensorless observer lean; if sensorless algorithms grow, the pin-compatible 256 KB DSPIC33CK256MP202-I/SS offers headroom on the same 28-SSOP footprint.
Empfohlen
Solar Inverters and Power Conversion
Grid-tied microinverters and solar optimizers benefit from the DSPIC33CK32MP502T-I/SS combination of fast DSP math (MPYT/MPYS instructions on the dsPIC33CK core), precise PWM generation for MPPT and inverter switching stages, and CAN-FD for system-level communication with monitoring gateways. The 3.0V-3.6V supply domain simplifies interfacing with isolated feedback front-ends, and the 12-bit ADC captures voltage/current channels synchronously for MPPT algorithms running at kilohertz rates. The functional-safety (FuSa) classification noted by DigiKey supports designs targeting reliability-focused power conversion. Live-update dual-partition flash allows field firmware upgrades of MPPT or grid-compliance algorithms without service intervention - a meaningful lifetime-cost advantage in deployed solar assets.
Empfohlen
Industrial Sensing and Control Nodes
As an advanced sensing node, the DSPIC33CK32MP502T-I/SS combines a 100 MHz DSP core with an integrated analog front-end: on-chip op-amps amplify small sensor signals (strain gauges, current shunts, thermistor bridges) before the 12-bit ADC digitizes them, all within one 3.3V 28-SSOP device. The modified Harvard architecture sustains DSP filtering (FIR/IIR) concurrently with control tasks, and CAN-FD provides robust noise-immune communication across factory floors. The industrial -40C to +85C temperature grade and ECC-protected flash address the reliability expectations of industrial equipment. For designs, exploit the dual-panel flash for parameter logging and field updates, and verify sensor impedance against the op-amp input specifications in the datasheet.
Empfohlen
CAN-FD Networked Embedded Control
Any embedded controller that must speak CAN-FD - factory automation modules, battery packs, HVAC controllers - is a natural fit for the DSPIC33CK32MP502T-I/SS. The integrated CAN-FD controller handles data payloads beyond classical CAN without external protocol chips, while the 100 MIPS core runs application logic and message processing concurrently. The 32 KB ECC flash comfortably hosts a CANopen-style stack plus application code for focused nodes, and 8 KB of SRAM buffers receive FIFOs. Because the part is a DSC rather than a plain MCU, the same silicon also covers motion or power subfunctions of the node, consolidating the BOM. Validate transceiver selection for the target bus speed and use the device's wake-up features for low-power standby.
Empfohlen
Battery Management Systems
In battery management systems, the DSPIC33CK32MP502T-I/SS executes pack-current integration, cell-voltage monitoring coordination and protection state machines on its 100 MHz core while the 12-bit ADCs multiplex cell and temperature channels. On-chip op-amps condition the shunt signal for coulomb counting, and CAN-FD links the BMS to vehicle or inverter controllers with modern payload and arbitration behavior. The ECC dual-partition flash supports safe field updates of protection thresholds - important for long-life battery assets - and the -40C to +85C industrial grade matches typical deployment environments. Layout tip: route the analog cell-measurement lines away from the PWM or communication traces and verify the op-amp bandwidth against your required current-loop sampling rate before committing the design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CK32MP502T-I/SS – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CK32MP502-I/SS | DSPIC33CK32MP202-I/SS | DSPIC33CK256MP202-I/SS |
|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / CPU Speed | dsPIC33CK 16-bit, 100 MHz | dsPIC33CK 16-bit, 100 MHz | dsPIC33CK 16-bit, 100 MHz | dsPIC33CK 16-bit, 100 MHz |
| Program Flash | 32 KB (dual-partition, ECC) | 32 KB (dual-partition, ECC) | 32 KB | 256 KB |
| On-chip Op-Amps | Yes | Yes | No (MP2 tier) | No (MP2 tier) |
| Packaging | Tape & Reel | Tube / Cut Tape | Tube / Cut Tape | Tube / Cut Tape |
Wichtigste Unterscheidungsmerkmale
- Integrated analog front-end (op-amps + 12-bit ADC) (vs. DSPIC33CK32MP202-I/SS)
- Live-update capable dual-partition flash with ECC (vs. DSPIC33CK32MP202-I/SS)
- Flash headroom option without respin (vs. DSPIC33CK256MP202-I/SS)
Designhinweise
Supply the DSPIC33CK32MP502T-I/SS from a clean 3.0V to 3.6V rail; the core runs its full 100 MIPS only within this window. Decouple each VDD pin with 0.1uF ceramic capacitors placed within 2-3 mm of the pin, plus a 4.7uF-10uF bulk capacitor. In digital power and motor-control layouts, separate the controller ground from the power-stage gate-driver return and join them at a single point to keep ADC readings free of switching noise.
The 28-SSOP has a 0.65 mm lead pitch; design the land pattern to the SSOP-28 dimensions in the Microchip datasheet and keep serpentine-free, short traces for the oscillator and PWM outputs. Route analog inputs (ADC/op-amp) away from PWM and CAN-FD lines; use ground pour on the analog side. If you may later migrate to the 256 KB DSPIC33CK256MP202-I/SS, the footprint is identical, so no layout change is needed.
Two firmware-level pitfalls recur with the dsPIC33CK MP series. First, the T part is tape-and-reel; ensure your pick-and-place feeder supports 28-SSOP reels and observe MSL baking rules from the packing label. Second, peripheral sets differ between MP5 and MP2 tiers: code written for the on-chip op-amps of the MP502 will not behave on MP2-family pin-compatible parts. Use MPLAB CODE CONFIGURATOR and verify peripheral availability against the family reference manual before any substitution.
Compliance-Informationen
RoHS compliance per Microchip standard product classification on DigiKey listing; other compliance details should be confirmed on the Microchip product page.
