DSPIC33CK64MC105T-I/PT - 100MHz 16-bit DSC 64KB Flash | Microchip
Teilenummer: DSPIC33CK64MC105T-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.86 | $4,86 |
| 10 | $4.41 | $44,10 |
| 25 | $4.26 | $106,50 |
| 100 | $3.94 | $394,00 |
| 1.000 | $3.52 | $3.520,00 |
DSPIC33CK64MC105T-I/PT Übersicht
A Digital Signal Controller combines the computational capability of a Digital Signal Processor (DSP) with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy of embedded systems, the dsPIC33CK family sits in the 16-bit DSC class, bridging 8-bit MCUs and 32-bit application processors. The dsPIC33CK core uses a modified Harvard architecture with an enhanced instruction set that includes dedicated DSP support, making it a strong fit for closed-loop control and advanced sensing.
Key features include a 12-bit, 3.5 Msps ADC with up to 15 channels, three integrated operational amplifiers, one analog comparator, a 12-bit DAC, and 4x2 high-speed PWMs with 2 ns resolution per the Microchip product page. These analog and timing peripherals allow single-chip implementation of current sensing, signal conditioning, and power-conversion control loops.
Technical depth: the 64 KB program flash includes ECC and fault-injection testing features supporting functional safety (FuSa) development, as noted by DigiKey. The device operates from a 3.0 V to 3.6 V supply over -40C to +125C (up to 100 MIPS) or -40C to +150C (up to 70 MIPS). DMA channels offload the CPU from peripheral data movement, sustaining deterministic real-time behavior.
Typical applications include sensorless and sensored motor control (PMSM, BLDC, FOC), digital power supplies and PFC stages, and touch or advanced sensing systems.
Design consideration: run the core at 100 MIPS only within the -40C to +125C industrial range; derate to 70 MIPS for extended +150C conditions, and budget flash ECC overhead during memory mapping.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33CK64MC105T-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CK64MC105T-I/PT (gleiche Bauform und Footprint) – abweichend in Core, Operating Temperature, PWM, Package, ADC Resolution.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CK64MC105T-E/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK64MC105-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CK64MC105T-I/PTVAO
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CK32MC105-E/PT
✅ Drop-In✓ Auf Lager
$1.55 / Stück
Datenblatt ansehen →DSPIC33CK32MC105T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.51 / Stück
Datenblatt ansehen →DSPIC33CK64MC105T-I/PT Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (100 MIPS) |
| Architecture | Modified Harvard, 16-bit with DSP enhanced instruction set |
| Program Flash | 64 KB with ECC and fault injection testing |
| Data SRAM | 8 KB with MBIST |
| ADC | 12-bit, 3.5 Msps, up to 15 channels |
| Operational Amplifiers | 3 |
| Analog Comparators | 1 |
| DAC | 12-bit |
| PWM | 4x2 high-speed PWMs, 2 ns resolution |
| Operating Voltage | 3.0 V to 3.6 V |
| Betriebstemperatur | -40C to +125C (DC to 100 MIPS); -40C to +150C (DC to 70 MIPS) |
| Gehäuse | 48-TQFP (7x7 mm), 0.5 mm pitch |
| Montageart | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Functional Safety | FuSa-capable (per DigiKey categorization) |
DSPIC33CK64MC105T-I/PT 48-tqfp (7x7 mm), 0.5 mm pitch Pinbelegungsleitfaden
Pinbelegung für DSPIC33CK64MC105T-I/PT (48-tqfp (7x7 mm), 0.5 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33CK64MC105T-I/PT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33CK64MC105T-I/PT ist geeignet für 6 Anwendungs: Brushless and PMSM Motor Control, Digital Power Supplies and PFC, Advanced Sensing and Touch Systems, Industrial Automation and Robotics, E-Mobility and Automotive Subsystems, Embedded Control and IoT Edge Nodes.
Brushless and PMSM Motor Control
The DSPIC33CK64MC105T-I/PT fits motor control because its 100 MHz dsPIC33CK core executes field-oriented control (FOC) loops with substantial computational headroom, while the 4x2 high-speed PWMs provide 2 ns edge resolution for precise dead-time insertion in three-phase inverters. The 12-bit, 3.5 Msps ADC with 15 channels samples phase currents and bus voltage fast enough for single-shunt and three-shunt current sensing schemes, and the 3 integrated op amps condition shunt signals without external amplifiers, reducing BOM cost. In a typical PMSM drive, the PWM module drives a 6-gate MOSFET bridge, the op amps feed the ADC, and the comparator plus DAC support cycle-by-cycle overcurrent protection in hardware. The deterministic DSP instruction set keeps the current loop period in the tens of microseconds range typical of servo and e-mobility drives.
Empfohlen
Digital Power Supplies and PFC
Digital AC-DC and DC-DC power conversion benefits directly from this DSC: the 2 ns PWM resolution enables duty-cycle and phase-shift precision beyond most MCUs, critical for peak-current-mode and phase-shifted full-bridge topologies. The 3.5 Msps 12-bit ADC samples output voltage and inductor current within one switching cycle even at hundreds of kHz switching frequency, supporting voltage-mode, current-mode, and predictive control laws. The hardware comparator with 12-bit DAC reference provides cycle-by-cycle overcurrent limiting without CPU latency, and ECC-protected flash safeguards control firmware integrity in long-lived power systems. The 3 op amps can implement average-current sensing or differential bus-voltage scaling on-chip. Typical designs include PFC stages, LLC resonant converter supervision, and telecom rectifier control where the -40C to +125C industrial rating covers harsh power-section environments.
Empfohlen
Advanced Sensing and Touch Systems
Microchip explicitly targets advanced sensing and touch applications with the dsPIC33CK64MC10X family. The 15-channel, 12-bit, 3.5 Msps ADC supports simultaneous multi-sensor sampling, while the 3 on-chip op amps provide programmable-gain front-end conditioning for bridge sensors, thermistors, and current shunts - a single-chip analog signal chain. The 12-bit DAC supplies bias or threshold references, and the comparator adds fast threshold detection for limit switches or event capture. DMA channels stream ADC results to SRAM without CPU intervention, preserving real-time control bandwidth. The 100 MHz core handles sensor fusion, filtering (IIR/FIR via DSP instructions), and touch-sensing algorithms concurrently. The 8 KB SRAM with MBIST and 64 KB ECC flash support functional-safety oriented sensing designs used in industrial monitoring and appliance control.
Empfohlen
Industrial Automation and Robotics
In factory automation, this DSC serves as a servo drive controller, actuator controller, or smart sensor node. The 100 MIPS core runs trajectory generation and FOC in the same device, while 2 ns PWM resolution delivers smooth low-speed torque in robotic joints. The industrial -40C to +125C temperature range tolerates control-cabinet environments, and the ECC flash with fault-injection testing supports functional safety assessments required in machinery. Serial ports handle industrial communication stacks, and DMA offloads data movement for deterministic loop timing. The 48-TQFP (7x7 mm) footprint integrates a complete drive or node controller in about 49 mm2, enabling compact distributed control architectures. The Curiosity Nano evaluation kit and Explorer 16/32 + MA330052 PIM accelerate prototyping for automation OEMs before committing to custom hardware.
Empfohlen
E-Mobility and Automotive Subsystems
For automotive and light e-mobility designs (e-bikes, pumps, blowers, actuators), select the AEC-Q100 qualified DSPIC33CK64MC105-E/PT sibling on the same 48-TQFP footprint. The architecture provides what 12 V and 48 V subsystem controllers need: fast 3.5 Msps ADC for current monitoring, 2 ns PWM for motor inverters, and hardware comparator protection. ECC program flash with fault-injection testing supports safety analyses per automotive development flows, and the 8 KB SRAM with MBIST adds memory self-test capability. Verified operating conditions cover -40C to +125C at 100 MIPS, with derating to 70 MIPS up to +150C for under-hood-adjacent mounting. Engineers should qualify the -E grade part within their AEC-Q100 compliance plan, since the standard -I part is not automotive qualified.
Empfohlen
Embedded Control and IoT Edge Nodes
As a general embedded controller, the DSPIC33CK64MC105T-I/PT offers DSP-class throughput in a 3.0-3.6 V single-supply, surface-mount package suited to battery-backed and line-powered edge nodes. The 100 MHz core processes digital filtering, FFT-based condition monitoring, and protocol handling concurrently; DSP-enhanced instructions (MAC, DSP addressing) accelerate algorithms that would burden a conventional MCU at equal clock rate. The rich analog suite (ADC, op amps, DAC, comparator) removes external signal-chain components from sensor nodes, and 64 KB ECC flash accommodates bootloader plus application plus OTA staging. Development is streamlined by the Curiosity Nano kit with MPLAB X IDE and code-configurator tooling. The Tape & Reel packaging (T suffix) supports automated SMT assembly for volume production of industrial IoT endpoints and smart appliances.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CK64MC105T-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CK64MC105T-E/PT | DSPIC33CK64MC105T-I/PTVAO | DSPIC33CK32MC105-E/PT | DSPIC33CK32MC105T-I/PT |
|---|---|---|---|---|---|
| Package | 48-TQFP (7x7 mm) | 48-TQFP (7x7 mm) - same | 48-TFQFP (7x7 mm) - same | 48-TQFP (7x7 mm) - same | 48-TQFP (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Program Flash | 64 KB with ECC | 64 KB with ECC | 64 KB with ECC | 32 KB with ECC | 32 KB with ECC |
| Data SRAM | 8 KB (MBIST) | 8 KB | 8 KB | 8 KB | 8 KB |
| ADC | 12-bit, 3.5 Msps, 15 ch | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps |
| Temperature Grade | -40C to +125C (100 MIPS) | Extended / automotive grade | -40C to +125C industrial | Extended / automotive grade | -40C to +125C industrial |
| Analog Peripherals | 3 op amps, 1 comparator, 12-bit DAC | 3 op amps, 1 comp, 12-bit DAC | 3 op amps, 1 comp, 12-bit DAC | 3 op amps, 1 comp, 12-bit DAC | 3 op amps, 1 comp, 12-bit DAC |
| AEC-Q100 Qualified | No | Yes | No | Yes | No |
Wichtigste Unterscheidungsmerkmale
- Largest flash option in the pin-compatible 48-TQFP MC105 subfamily (vs. DSPIC33CK32MC105-E/PT)
- Standard industrial grade with broad distributor availability (vs. DSPIC33CK64MC105T-I/PTVAO)
- 100 MIPS full-speed industrial rating (vs. DSPIC33CK64MC105T-E/PT)
Designhinweise
Design a clean 3.0-3.6 V rail; typical implementation is 3.3 V from an LDO or buck with at least 0.1 uF ceramic decoupling at each VDD/VSS pin pair plus 4.7-10 uF bulk capacitance near the device. Place decoupling within 2 mm of the pins to minimize ground bounce during simultaneous PWM switching of the high-speed PWM module. Estimated: with VDD = 3.3 V and typical core currents in the tens-of-mA range at 100 MIPS (confirm exact figure in the family data sheet current-consumption tables), plan regulator headroom of at least 2x the typical figure for transient and temperature margin.
Respect the speed-versus-temperature derating from the datasheet operating conditions: -40C to +125C supports DC to 100 MIPS, while -40C to +150C limits the core to DC to 70 MIPS. For a 48-TQFP 7x7 mm package on a standard 4-layer PCB, junction rise above ambient is dominated by copper area under the leads; use solid ground planes and thermal vias where high core utilization is continuous. Verify theta-JA in the family data sheet package chapter and estimate power as VDD x IDD (estimated; use datasheet IDD curves for the 100 MHz case).
For layout, dedicate short, matched traces from PWM outputs to gate drivers to minimize propagation skew (the 2 ns PWM resolution is only meaningful if PCB skew is comparable or smaller). Keep the analog front end - ADC input channels, op amp pins, and VREF - routed away from PWM and crystal traces, with a star or split ground strategy referencing the analog ground at a single point. Follow the programming pin requirements (MCLR, PGD/PGC) in the Flash Programming Specification DS70005388B and add an ICSP header with series resistors for in-circuit debugging.
Common pitfalls: (1) Do not exceed 100 MIPS above +125C ambient - the datasheet restricts operation to 70 MIPS in the -40C to +150C window. (2) Budget the 64 KB ECC flash carefully; code size plus bootloader must fit with margin, otherwise migrate to a larger family member rather than shipping near-full flash. (3) Enable flash ECC and MBIST features early in a functional-safety project - retrofitting safety features late forces revalidation. (4) The 'T' suffix means Tape & Reel; order the non-T tray variant for hand assembly or low-volume prototyping.
Compliance-Informationen
Standard Microchip industrial-grade product; RoHS/lead-free per standard catalog policy. Not AEC-Q100 qualified - use DSPIC33CK64MC105T-E/PT (AEC-Q100 qualified per Microchip USA) for automotive. REACH, halogen-free, and conflict-minerals statements not present in provided data; verify on the Microchip product page.
