DSPIC33EP256GP504-E/MV - 16-Bit 60MIPS DSC, 256KB Flash | Microchip
Teilenummer: DSPIC33EP256GP504-E/MV ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.9 | $5,90 |
| 10 | $5.31 | $53,10 |
| 100 | $4.72 | $472,00 |
| 500 | $4.35 | $2.175,00 |
| 1.000 | $3.98 | $3.980,00 |
DSPIC33EP256GP504-E/MV Übersicht
A digital signal controller combines the computational power of a DSP engine with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, providing single-cycle MAC, barrel shifter, and hardware divide for real-time control loops in motor drives, digital power supplies, and embedded sensing systems.
Key features include the dsPIC33E core running at 60 MIPS, an enhanced high-speed PWM module suited to digital power and motor control, integrated op amps, comparators, and advanced analog peripherals, plus a CAN 2.0B controller and the Peripheral Trigger Generator (PTG) for autonomous peripheral-to-peripheral triggering. Four DMA channels offload the CPU for high-throughput data handling, and boundary-scan (JTAG) capability supports production test.
Architecturally, the dsPIC33EP series uses a modified Harvard bus architecture with multiple internal buses, CMOS process technology, and a 16-bit datapath with DSP instructions that achieve excellent code density. The operating clock is 60 MHz, and the Automotive, AEC-Q100-qualified family positioning of this device supports harsh-environment designs.
Typical applications include brushless DC and PMSM motor control, digital power supplies and LED drivers, automotive body and comfort modules on the CAN bus, and industrial sensing nodes using the on-chip op amps for signal conditioning.
For design, budget Flash and RAM headroom for bootloader and CAN stacks, and verify that the -E extended temperature option matches your thermal profile; junction temperature margins in the compact UQFN-48 require attention to copper pour area.
This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für DSPIC33EP256GP504-E/MV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP256GP504-E/MV (gleiche Bauform und Footprint) – abweichend in CAN, Core, Operating Temperature, Max CPU Speed, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP256GP504-I/MV
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128GP504
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GP504
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256MC504
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128MC504
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64MC504
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256GP504-E/MV Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33EP 16-bit DSC |
| Max CPU Speed | 60 MIPS (60 MHz) |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| DMA Channels | 4 |
| CAN | CAN 2.0B controller |
| Gehäuse | 48-UQFN (6x6 mm), exposed pad (MV) |
| Betriebstemperatur | -40C to +125C (E extended) |
| Qualification | Automotive, AEC-Q100 |
| Analog Peripherals | Op Amps, Comparators, CTMU, Advanced Analog |
| High-Speed PWM | Yes (Hi-Speed PWM) |
| Peripheral Trigger Generator | PTG |
| Technology | CMOS |
| Bus Architecture | Modified Harvard, multiple internal buses |
| DSP Features | Barrel shifter, single-cycle MAC, hardware divide |
| Debug / Test | Boundary scan (JTAG), In-Circuit Debug |
| Montageart | Surface Mount |
DSPIC33EP256GP504-E/MV 48-uqfn (6x6 mm), exposed pad (mv) Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP256GP504-E/MV (48-uqfn (6x6 mm), exposed pad (mv)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP256GP504-E/MV.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP256GP504-E/MV ist geeignet für 6 Anwendungs: Brushless DC / PMSM Motor Control, Digital Power Supplies and LED Drivers, Automotive Body and CAN Network Modules, Industrial Sensing and Signal Conditioning, Portable Audio and Signal Processing, Test, Measurement, and Instrumentation Control.
Brushless DC / PMSM Motor Control
The DSPIC33EP256GP504-E/MV fits motor-control nodes that also need sensing and communication: its high-speed PWM module generates multi-phase drive waveforms at up to 60 MIPS of control-loop headroom, while the on-chip op amps and comparators condition current-shunt and back-EMF feedback without external analog front ends. In a typical FOC or trapezoidal BLDC drive, the PTG and 4 DMA channels move ADC samples into memory autonomously, keeping interrupt latency low for fast current loops. The AEC-Q100 qualification and -40C to +125C extended range of the -E suffix make it viable for automotive pumps, fans, and actuators, and the integrated CAN 2.0B controller connects the drive to vehicle or industrial buses. Trade-off: the GP PWM set is less motor-specialized than the MC-family variants, so verify dead-time and complementary PWM features against your topology.
Empfohlen
Digital Power Supplies and LED Drivers
For digital power (LLC, buck/boost, PFC stages) and intelligent LED drivers, the dsPIC33EP256GP504's high-speed PWM offers the resolution and speed needed for switching frequencies in the hundreds of kHz range while the 60 MIPS core executes voltage-mode or current-mode control laws with single-cycle MAC math. The advanced analog block, including comparators for fast over-current protection, allows cycle-by-cycle limiting without CPU intervention. On-chip op amps buffer current-sense signals, and the PTG offloads repetitive trigger sequences. The extended -40C to +125C temperature range suits LED-driver enclosures with high ambient temperatures, and the 48-UQFN 6x6 mm package with exposed pad provides low-inductance grounds for switch-node noise. Cost trade-off: a dedicated digital-power DSC (MC family) may offer richer PWM features if your topology needs advanced dead-time control.
Empfohlen
Automotive Body and CAN Network Modules
The DSPIC33EP256GP504-E/MV is positioned for automotive body electronics: it belongs to an Automotive, AEC-Q100 qualified series and carries the -E extended temperature grade of -40C to +125C, matching under-hood-adjacent and passenger-compartment requirements. The integrated CAN 2.0B controller links window lifts, seat modules, HVAC flaps, and lighting nodes to the vehicle bus without an external CAN transceiver PHY beyond a simple transceiver IC. The PTG and DMA support responsive I/O scanning, and the 256 KB Flash accommodates bootloader plus UDS/KWP diagnostics stacks with margin. On-chip op amps can read ratiometric position sensors. Design consideration: automotive designs should plan for the VCAP core-regulator capacitor requirements and CAN transceiver selection early, and confirm Microchip's PPAP support for your OEM program.
Empfohlen
Industrial Sensing and Signal Conditioning
Industrial sensor nodes benefit from the dsPIC33EP256GP504's analog integration: on-chip op amps amplify bridge or shunt signals, comparators provide threshold detection, and the CTMU supports charge-time measurement for capacitive sensing or ultrasonic time-of-flight. The 12-bit ADC pipeline, fed via DMA and triggered by the PTG, supports deterministic multi-channel sampling for vibration, pressure, and current monitoring. The 60 MIPS DSP core applies digital filters (IIR/FIR) directly on-chip, reducing host load in IIoT gateways. The 48-UQFN package conserves board space in compact transmitters, while boundary scan (JTAG) eases production test. The industrial temperature coverage from -40C upward suits factory floors; for ambient above +85C, specify the -E extended suffix as in this MPN. Trade-off: very high-precision metrology may still require an external 24-bit delta-sigma ADC.
Empfohlen
Portable Audio and Signal Processing
The dsPIC33EP256GP504 serves cost-sensitive audio and DSP tasks such as active noise cancellation, effects, and communication audio: its single-cycle MAC, hardware divide, and barrel shifter execute filtering algorithms efficiently at 60 MIPS, while 256 KB Flash and 32 KB RAM hold codec drivers, equalization tables, and echo canceller state. On-chip op amps can drive headphone buffer stages or condition microphone inputs, and the DCI (Data Converter Interface) serial port common to the family connects to standard audio codecs. The 4 DMA channels sustain continuous sample streaming without CPU stalls. The compact 6x6 mm UQFN-48 suits wearables and portable devices, though the -E automotive grade here mainly contributes temperature robustness rather than audio-specific features; verify SNR requirements since dedicated audio DSPs may offer lower noise floors.
Empfohlen
Test, Measurement, and Instrumentation Control
Bench instruments, data loggers, and smart sensor probes use the DSPIC33EP256GP504-E/MV as a real-time acquisition controller: the PTG sequences ADC conversions and PWM stimulus autonomously, DMA streams results to the 32 KB RAM, and the DSP engine performs on-the-fly FFT or RMS computation at 60 MIPS. The CTMU supports precise time-interval and capacitance measurements, and boundary scan (JTAG) simplifies board-level test integration. CAN and UART connectivity allow the node to report to a host PC or network. The extended -40C to +125C rating enables instrumentation deployed in thermal chambers or outdoor enclosures. Design consideration: use the exposed pad of the UQFN-48 as a low-noise ground reference and isolate the analog ground plane from switching sections to preserve ADC accuracy.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP256GP504-E/MV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP256GP504-I/MV | DSPIC33EP128GP504 | DSPIC33EP256MC504 | DSPIC33EP64MC504 |
|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) MV | 48-UQFN (6x6 mm) MV - same | 48-UQFN (6x6 mm) MV - same | 48-UQFN (6x6 mm) MV - same | 48-UQFN (6x6 mm) MV - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256 KB | 256 KB | 128 KB | 256 KB | 64 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Peripheral Focus | General purpose: GP analog, PTG, CAN | General purpose (identical) | General purpose | Motor control PWM/analog | Motor control PWM/analog |
Wichtigste Unterscheidungsmerkmale
- Extended +125C automotive-grade temperature rating (vs. DSPIC33EP256GP504-I/MV)
- Full 256 KB Flash for diagnostics stacks (vs. DSPIC33EP128GP504)
- General purpose analog mix with PTG (vs. DSPIC33EP256MC504)
Designhinweise
The dsPIC33EP family uses an internal core regulator that requires an external low-ESR capacitor on the VCAP pin (typically a ceramic capacitor on the order of 10 uF, per the family datasheet DS70000657J). Place the VCAP capacitor as close to the pin as possible with a solid ground return; insufficient or high-ESR VCAP decoupling is one of the most common causes of erratic resets and brownout behavior on dsPIC33E designs. Verify the exact recommended capacitance value against the current revision of the datasheet before release.
The 48-UQFN (MV) 6x6 mm package with exposed pad is compact, and the -E/MV grade guarantees operation to +125C ambient. Estimated: budget junction-to-ambient resistance per the datasheet theta-JA for the UQFN-48 on a standard 4-layer board; at typical DSC currents (tens of mA at 3.3 V, i.e., roughly 0.1 W internally) temperature rise is small, but if you drive significant load currents through I/Os or port pins, sum I/O dissipation with core power. Solder the exposed pad to a grounded copper pour to stabilize both thermal and ground reference.
Before substituting any same-footprint family member (e.g., DSPIC33EP128GP504 or DSPIC33EP256MC504), re-verify the device ID, memory map, and peripheral register differences; the MC variants swap the GP analog/PWM feature set for motor-control peripherals, so firmware that touches those registers will not be source-compatible. Also configure Peripheral Pin Select (PPS) mappings deliberately at startup and lock them if security matters, and check configuration-word settings (oscillator, watchdog, code protection) since incorrect config words are a frequent bring-up failure.
For CAN and high-speed PWM operation, keep the CAN transceiver (e.g., MCP2562) close to the MCU's CAN TX/RX pins with short series termination, and route switch-node traces of motor/power stages away from the analog op-amp inputs. Use a dedicated analog ground region under the ADC/op-amp pins tied at one point to digital ground. The PTG-triggered ADC sampling benefits from a quiet reference: decouple VDD and AVDD independently with 100 nF ceramics placed within 2 mm of the pins.
Compliance-Informationen
Distributor listings (Hotenda, Octopart) indicate the dsPIC33EP256GP504 family is positioned as Automotive, AEC-Q100. RoHS/REACH/lead-free status not stated in the provided data - set to unknown and verify on Microchip's product page.
