DSPIC33EP32GS202-I/MX - 16-bit 70 MIPS Digital Power DSC | Microchip
Teilenummer: DSPIC33EP32GS202-I/MX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.59 | $4,59 |
| 10 | $4.18 | $41,80 |
| 25 | $3.68 | $92,00 |
| 100 | $3.31 | $331,00 |
| 1.000 | $2.95 | $2.950,00 |
DSPIC33EP32GS202-I/MX Übersicht
A digital signal controller combines the computational throughput of a DSP with the peripheral set and control architecture of a microcontroller. Within the power-management hierarchy, the DSC sits at the top of embedded control ICs, bridging general-purpose MCUs and dedicated power-management ICs. The dsPIC33EP GS family is purpose-built for closed-loop switch-mode power supply (SMPS) control, where deterministic interrupt latency and fast analog sampling are essential.
Key differentiating features of the GS202 family include a high-speed 12-bit ADC with multiple sample-and-hold circuits capable of conversions timed to the PWM cycle, dedicated DAC outputs for comparator references, and high-resolution PWM peripherals with fine edge positioning. These resources enable peak-current-mode and voltage-mode control loops to execute entirely in hardware-assisted firmware. The device carries Functional Safety (FuSa) support per Microchip's product page classification.
Architecturally, the dsPIC33EP core is an enhanced 16-bit pipeline CPU with DSP instruction extensions (MAC, dual operand fetch), executing from Flash at up to 70 MIPS at 3.3V. Interrupt context switching is deterministic, which matters for control loops where a late PWM update can translate directly into output ripple or, worse, a transient overshoot.
Typical applications include AC-DC and DC-DC SMPS control, interleaved power factor correction (PFC), LED drivers, battery chargers, and digital lighting or solar micro-inverter stages. Microchip's Interleaved PFC reference design, producing up to 350W from a universal AC input, demonstrates the family in a production-class topology.
Design consideration: budget the analog feed carefully. Route high-di/dt PWM returns away from ADC inputs and use the device's onboard DAC-comparator path for cycle-by-cycle current limiting rather than relying solely on software interrupts.
This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and lifecycle data not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP32GS202-I/MX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP32GS202-I/MX (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Core, Application Focus, Core Processor.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP32GS502-I/MX
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP16GS202-I/MX
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS202-I/MX
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP32GS202-E/MX
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →DSPIC33EP32GS202-I/MX Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33EP 16-bit DSC core |
| Core Architecture | 16-bit with DSP instruction extensions |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 32KB (32K x 8) Flash |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 28-UQFN (6x6 mm) Exposed Pad |
| Betriebstemperatur | -40C to +85C (I grade) |
| Montageart | Surface Mount |
| Application Focus | Digital Power SMPS, High Speed ADC, DAC |
| Functional Safety Support | FuSa classified (per Microchip product page) |
| Programming Interface | ICSP via PGECx/PGEDx pairs (MPLAB SNAP compatible) |
| Debug Support | In-circuit debugging (ICD) supported |
| Number of PGEC/PGED Pairs | More than one pair (any pair usable as matched set) |
| Product Status | In Production |
| Data Converter | High Speed ADC and DAC (per datasheet title) |
| Packaging (Tube) | Tube |
DSPIC33EP32GS202-I/MX 28-uqfn (6x6 mm) exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP32GS202-I/MX (28-uqfn (6x6 mm) exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP32GS202-I/MX.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP32GS202-I/MX ist geeignet für 6 Anwendungs: AC-DC Switch-Mode Power Supply Control, Interleaved Power Factor Correction (PFC), DC-DC Converter Digital Control, LED Driver and Digital Lighting, Battery Chargers and Power Management, Solar Micro-Inverter and Renewable Conversion.
AC-DC Switch-Mode Power Supply Control
The DSPIC33EP32GS202-I/MX is purpose-built for AC-DC SMPS control, pairing its 70 MIPS 16-bit core with a high-speed ADC that can be sampled in synchronization with the PWM period. The high-resolution PWM with fine edge positioning enables precise duty-cycle updates every switching cycle, while the onboard DAC and comparators provide hardware cycle-by-cycle current limiting independent of firmware latency. Placed as the sole controller on a flyback or forward converter board, it replaces analog controllers and adds programmability for soft-start, burst mode, and protection thresholds. The trade-off is firmware development effort versus the fixed behavior of an analog PWM IC.
Empfohlen
Interleaved Power Factor Correction (PFC)
Microchip's Interleaved PFC reference design for the GS202 family demonstrates this device controlling a two-phase PFC stage that converts universal AC input into a single high-voltage DC output up to 350W. The 70 MIPS core executes the average-current-mode loop while the high-speed ADC samples inductor current and bus voltage in a cycle-aligned fashion, and the DAC-comparator path enforces peak current limits in hardware. Interleaving reduces input ripple current and spreads thermal load across two switches. The 28-UQFN 6x6 mm footprint keeps the controller compact on dense power boards, though careful grounding of the analog front end is essential for clean ADC readings.
Empfohlen
DC-DC Converter Digital Control
For synchronous buck, boost, or buck-boost converters, the DSPIC33EP32GS202-I/MX offers the deterministic control-loop timing that digital DC-DC demands: 70 MIPS execution, high-speed ADC triggered by the PWM module, and high-resolution PWM edges that compensate for limit-cycle oscillation at high switching frequencies. Firmware-implemented voltage-mode or peak-current-mode loops can be updated with PID compensators running well within one switching period. The device's 3.3V supply and -40C to +85C rating suit telecom and industrial power bricks. Compared with fixed-function controllers, this DSC adds configurability but requires validation of loop stability across line and load conditions in firmware.
Empfohlen
LED Driver and Digital Lighting
The GS202's high-resolution PWM makes it an effective digital LED driver controller: dimming resolution is set by fine PWM edge placement rather than coarse integer duty cycles, enabling flicker-free deep dimming of high-brightness strings. The high-speed ADC monitors output current and fault conditions cycle-by-cycle, with the DAC-comparator hardware providing sub-microsecond overcurrent shutdown. At 70 MIPS, the core can simultaneously run communication tasks such as DALI or DMX parsing alongside the power loop. The 28-pin UQFN 6x6 mm package suits compact luminaire electronics. Verify PWM frequency versus dimming-ratio trade-offs, since very low dimming levels demand higher PWM frequencies for flicker-free operation.
Empfohlen
Battery Chargers and Power Management
Battery charging algorithms - CC/CV, taper, and temperature-qualified charging - map naturally onto this DSC: the high-speed ADC samples battery current and voltage synchronized to the power stage, the 70 MIPS core executes charge-state state machines with PID current loops, and the DAC-comparator hardware enforces safe current limits in silicon for fault conditions that cannot wait for firmware. The -40C to +85C industrial rating supports automotive-adjacent and outdoor charger enclosures, while the 3.3V rail simplifies interfacing with external supervision circuits. Microchip's GS-family application literature covers buck and SEPIC charger topologies; budget 32KB of Flash for Li-ion multi-chemistry firmware plus any gauge or communication stack.
Empfohlen
Solar Micro-Inverter and Renewable Conversion
Renewable power conversion stages - micro-inverters, solar optimizers, and MPPT front ends - benefit from this device's combination of 70 MIPS DSP math throughput for MPPT algorithms, high-speed ADC sampling of panel voltage/current, and high-resolution PWM driving the power stage. The DSP MAC instructions accelerate the perturb-and-observe or incremental-conductance math each switching cycle, while the DAC-comparator hardware provides grid-side or DC-link fault protection with deterministic response. The compact 28-UQFN 6x6 mm package suits module-integrated converters attached to each panel. Long-term outdoor deployment should consider the -E temperature-grade variant of this family for extended thermal margins.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP32GS202-I/MX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP32GS502-I/MX | DSPIC33EP16GS202-I/MX | DSPIC33EP64GS202-I/MX | DSPIC33EP32GS202-E/MX |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (6x6 mm) EP | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 32KB (32K x 8) | 64KB | 16KB | 64KB | 32KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (E grade) |
| Application Focus | Digital Power SMPS, High Speed ADC, DAC | Digital Power SMPS - same peripheral set | Digital Power SMPS - same peripheral set | Digital Power SMPS - same peripheral set | Digital Power SMPS - same peripheral set |
Wichtigste Unterscheidungsmerkmale
- Twice the Flash of the entry sibling at identical pinout (vs. DSPIC33EP16GS202-I/MX)
- Extended-temperature option in the same footprint (vs. DSPIC33EP32GS202-E/MX)
- Digital-power-optimized analog subsystem (vs. Generic 16-bit MCU alternatives in UQFN-28)
Designhinweise
For the 28-UQFN 6x6 mm exposed-pad package, connect the center exposed pad to a solid ground pour with an array of thermal vias (typically 3x3 or 4x4). All VDD and VSS pins must be connected during both operation and programming, per NorthernSoftware's ICSP support summary for this device. Place 100 nF ceramic decoupling capacitors at each VDD pin within 2-3 mm of the pin. The UQFN land pattern requires exact stencil design - use 50-70% aperture on the center pad to avoid excessive solder paste and device floating.
In digital power layouts, keep the high-speed ADC input traces away from PWM output traces and switching nodes. The GS202's ADC can be triggered synchronously from the PWM module, so sample at a point in the switching cycle where current is stable (typically at PWM midpoint) to avoid switching-noise-induced sampling errors. Route PGECx/PGEDx programming pairs as short matched traces to a 5- or 6-pin ICSP header; per the family programming specification, a matched PGEC/PGED pair must be used - ICSPCLK and ICSPDAT cannot come from different pairs.
Three recurring pitfalls with this part: (1) selecting the wrong PGEC/PGED pair in the programmer settings - any pair works but ICSPCLK and ICSPDAT must belong to the same pair; (2) omitting the -E vs -I temperature suffix distinction - the I grade stops at +85C, which is insufficient for sealed outdoor power enclosures where junction temperatures reach 100C+; (3) assuming flash code portability between 16GS202 and 32GS202 builds - compiled images exceeding 16KB will not link for the smaller sibling, so verify map-file size before qualifying a downward substitution.
Compliance-Informationen
Verified web data does not include explicit RoHS/REACH certificates for this exact MPN. Microchip standard production parts are typically lead-free/RoHS, but formal status should be confirmed via the material declaration on Microchip's product page. FuSa (functional safety) classification is stated on the Microchip product page. Not an automotive AEC-Q100-qualified part number as listed.
