DSPIC33EP512GP504T-I/TL - 16-bit 70 MIPS DSC, 512KB Flash | Microchip
Teilenummer: DSPIC33EP512GP504T-I/TL ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.38 | $4,38 |
| 10 | $4.16 | $41,60 |
| 100 | $3.95 | $395,00 |
| 500 | $3.75 | $1.875,00 |
| 1.000 | $3.56 | $3.560,00 |
DSPIC33EP512GP504T-I/TL Übersicht
A digital signal controller combines the computational architecture of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, a DSC sits above a general-purpose MCU for math-intensive control loops such as digital power conversion, motor control, and sensing, making the dsPIC33EP family a bridge between classic PIC microcontrollers and dedicated DSPs.
Key features include the 70 MIPS dsPIC33E core, hardware DSP engine with accumulators and fractional multiply support, CAN 2.0B connectivity, and up to four DMA channels that offload data movement from the CPU. According to the Microchip product page, the family offers superior ADC performance, CTMU (Charge Time Measurement Unit) for capacitive touch and time measurement, integrated op amps and comparators, and the Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing.
Technically, the device operates from a 3.0V to 3.6V supply with a maximum supply current around 55mA, uses CMOS process technology, and supports boundary scan (JTAG) debug. The 512KB self-programmable flash with ECC supports field firmware updates, while five 16-bit timers and flexible clocking (internal PLL from crystal or internal FRC) enable precise timing control in closed-loop systems.
Typical applications include digital power supplies (PFC, LLC), BLDC/PMSM motor control, industrial sensing and instrumentation, and CAN-based automotive or industrial nodes, where the combination of DSP math throughput and CAN connectivity directly reduces external component count.
A key design consideration: the I-temperature grade covers -40C to +85C; for -40C to +125C automotive environments choose the E-grade variant DSPIC33EP512GP504T-E/TL in the same footprint. Decouple VDD/VDDCORE per the power-up sequencing requirements in the reference manual to avoid brown-out reset issues.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with price data as of 2026-09-25.
Drop-in-Alternativen für DSPIC33EP512GP504T-I/TL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP512GP504T-I/TL (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Connectivity, RAM, Packaging.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP512GP504T-E/TL
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →DSPIC33EP512GP504-I/TL
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256MC504T-I/TL
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.32 / Stück
Datenblatt ansehen →DSPIC33EP256MC504-I/TL
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP32GP504T-I/TL
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.89 / Stück
Datenblatt ansehen →DSPIC33EP512GP504T-I/TL Grenzwerte & elektrische Eigenschaften
| Core | 16-bit dsPIC33E |
| Performance | 70 MIPS |
| Program Memory (Flash) | 512 KB (170K x 24) |
| RAM | 48 KB (24K x 16) |
| Operating Voltage | 3.0 V to 3.6 V |
| Maximum Supply Current | 55 mA |
| Gehäuse | 44-VTLA (6x6 mm), exposed pad |
| Pin-Anzahl | 44 |
| Connectivity | CAN 2.0B, I2C, SPI, UART/USART, IrDA, LINbus |
| DMA Channels | 4 |
| Timers | 5 x 16-bit |
| Analog Peripherals | ADC, Comparators, Op Amps, CTMU |
| Special Peripherals | Peripheral Trigger Generator (PTG), DSP engine |
| Betriebstemperatur | -40C to +85C (I grade) |
| Montageart | Surface Mount |
| Debug | JTAG boundary scan, ICSP/ICD |
| RoHS-Status | Lead free / RoHS Compliant |
DSPIC33EP512GP504T-I/TL 44-vtla (6x6 mm), exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP512GP504T-I/TL (44-vtla (6x6 mm), exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP512GP504T-I/TL.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP512GP504T-I/TL ist geeignet für 6 Anwendungs: Digital Power Supplies, BLDC / PMSM Motor Control, Industrial Sensing and Instrumentation, CAN Bus Industrial and Automotive Nodes, Portable and Battery-Powered Instruments, IoT Edge Nodes and Smart Sensors.
Digital Power Supplies
The DSPIC33EP512GP504T-I/TL is well suited to digitally controlled AC/DC and DC/DC power stages such as PFC, LLC, and buck converters because its 70 MIPS dsPIC33E core and hardware DSP engine execute the fast control-loop mathematics (PI/PID compensation, fractional MAC) that analog controllers normally handle. The high-resolution PWM outputs, comparators, and op amps reduce external analog component count, while the 4-channel DMA streams ADC results without CPU intervention, keeping loop latency predictable. Placed as the supervisory and modulating controller with the CTMU available for telemetry, the device replaces fixed-function control ICs and enables firmware-updatable power conversion. The trade-off versus a dedicated power controller is firmware complexity: the designer must guarantee worst-case ISR timing at 70 MIPS and budget flash headroom within the 512KB program memory for state machines, protection, and communication.
Empfohlen
BLDC / PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33EP512GP504T-I/TL combines the elements a field-oriented-control (FOC) loop needs: 70 MIPS execution for current-loop math, a hardware DSP engine with single-cycle MAC, fast ADC triggered by PWM, and complementary PWM outputs for the three-phase bridge. The integrated op amps and comparators support inline current sensing and over-current protection without external amplifiers, cutting BOM cost in compact drives. The CAN 2.0B module connects the drive to a higher-level automation bus, and the PTG can sequence ADC/PWM operations autonomously for deterministic sampling. Designers should locate current-sense shunts close to the op-amp inputs and keep the exposed pad solidly grounded to handle switching noise. Firmware fits comfortably in the 512KB flash, leaving room for multiple commutation profiles and field-updatable parameter tables.
Empfohlen
Industrial Sensing and Instrumentation
In industrial measurement nodes, the DSPIC33EP512GP504T-I/TL leverages its CTMU for precise charge-time and capacitive measurement, its ADC with DMA for multi-channel acquisition, and on-chip op amps for sensor signal conditioning - all within one 3.0V to 3.6V device drawing a maximum of about 55mA. The 512KB flash stores calibration tables, logging buffers, and protocol firmware, while IrDA, LIN, SPI, I2C, and UART options interface with local sensors and displays. For factory-floor robustness, the -I grade covers -40C to +85C, and the 6x6 mm 44-VTLA footprint fits dense sensor boards. Estimated: sampling four channels at 100 ksps through DMA leaves the 70 MIPS core largely free for filtering and linearization. The main consideration is analog layout discipline: separate analog ground returns and reference decoupling are required to exploit the ADC's effective resolution.
Empfohlen
CAN Bus Industrial and Automotive Nodes
The integrated CAN 2.0B module makes the DSPIC33EP512GP504T-I/TL a strong fit for gateway, actuator, and sensor nodes on CAN networks in factory automation and vehicle subsystems. The DMA channel servicing the CAN module keeps message handling off the CPU, while the 70 MIPS core executes application logic, protocol processing, and any local control loops concurrently. Firmware stacks fit easily in the 512KB flash with room for diagnostics and OTA-style updates via self-programmable flash. For in-vehicle temperature environments beyond -40C to +85C, the pin-identical AEC-Q100 qualified DSPIC33EP512GP504T-E/TL drops into the same PCB without redesign. Designers should add an external CAN transceiver and follow the manufacturer reference manual guidelines for bus fault modes; the microcontroller itself contains the controller but not the physical layer.
Empfohlen
Portable and Battery-Powered Instruments
Handheld instruments benefit from the DSPIC33EP512GP504T-I/TL's single 3.0V to 3.6V supply, low peripheral count (op amps, comparators, CTMU on-chip), and 6x6 mm 44-VTLA footprint, which together shrink board area in compact enclosures. The device supports sleep, idle, and doze power modes that cut average current between measurement bursts, and the 4-channel DMA lets acquisition run while the core sleeps, extending battery life. The 512KB flash accommodates rich UI firmware, data logging, and USB-serial or IrDA links; 48KB RAM holds sample buffers for post-processing with the DSP engine. Estimated: duty-cycled operation at a few milliamps average current is achievable when the core sleeps between 1 kHz-class measurement bursts. Layout-wise, keep the crystal short-looped to the oscillator pins and respect VDDCORE decoupling for reliable wake-up timing.
Empfohlen
IoT Edge Nodes and Smart Sensors
As an IoT edge controller, the DSPIC33EP512GP504T-I/TL provides enough 70 MIPS DSP throughput for local analytics such as FFT-based vibration analysis, while UART/SPI/I2C interfaces connect to wireless modules and the PTG automates periodic sensor polling without CPU intervention. The CTMU supports capacitive touch interfaces for local user interaction, and the 512KB self-programmable flash enables secure field firmware updates - essential for deployed IoT hardware. The 48KB RAM buffers sensor streams and network packets, and the DMA offloads transfers so the core spends its cycles on processing and protocol work. In a typical topology the DSC reads analog sensors through its own op amps and ADC, computes features locally, and forwards summaries over UART to a radio module, reducing cloud bandwidth. The -40C to +85C industrial grade covers unconditioned outdoor enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP512GP504T-I/TL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP512GP504T-E/TL | DSPIC33EP512GP504-I/TL | DSPIC33EP256MC504T-I/TL | DSPIC33EP32GP504T-I/TL |
|---|---|---|---|---|---|
| Package | 44-VTLA (6x6 mm), exposed pad | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 512 KB (170K x 24) | 512 KB | 512 KB | 256 KB (-50%) | 32 KB (-94%) |
| Temperature Range | -40C to +85C (I grade) | -40C to +125C (E grade, AEC-Q100) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| CAN | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tube/Tray (no T suffix) | Tape & Reel (T) | Tape & Reel (T) |
Wichtigste Unterscheidungsmerkmale
- Full 512KB flash in the smallest 44-pin footprint (vs. DSPIC33EP256MC504T-I/TL)
- Automotive E-grade option is a true drop-in (vs. DSPIC33EP512GP504T-E/TL)
- General-purpose peripheral breadth vs motor-control variant (vs. DSPIC33EP256MC504T-I/TL)
Designhinweise
The device requires a 3.0V to 3.6V supply with dedicated VDDCORE decoupling, and Microchip's family reference manual defines a specific power-up sequence between VDD and VDDCORE rails. Use a single 3.3V LDO with the recommended capacitor network (typically 10uF bulk plus 0.1uF ceramic at each VDD pin) placed within 2 mm of the pins. Estimated: at the 55mA maximum supply current and 3.3V, worst-case power is about 0.18W, well within the 6x6 mm QFN's capability, so the exposed pad is mainly a ground and thermal anchor. Do not omit the VDDCORE capacitor - brown-out resets during startup are the most common field failure cause.
For the 44-VTLA exposed-pad QFN, solder the center pad to a ground array of 4-6 via stitches into the internal ground plane; this is not optional for thermal and EMC performance even though dissipation is low. Route CAN, PWM, and analog traces away from the crystal loop, and keep the crystal load capacitors within 3 mm of the OSC pins. Place the CAN transceiver between the MCU and connector with a stub as short as possible. Separate the analog ground return for the ADC reference path from high-current PWM returns to preserve ADC effective-number-of-bits performance in motor-control and power-conversion layouts.
Three recurring mistakes with this family: (1) assuming the -I/TL grade works in automotive cabins - it tops out at +85C; use the AEC-Q100 E-grade variant instead. (2) Confusing package suffixes: TL is the 44-pin 6x6 VTLA, PT is the 44-pin TQFP, MV is the 48-pin QFN - they are not footprint-compatible. (3) Flashing production units with development configuration bits; self-programmable flash with code protection must be configured before deployment since the 512KB flash supports in-field updates. Verify RAM allocation because DSP accumulators and DMA buffers in the 48KB RAM require careful linker-script placement to avoid overflow errors.
Compliance-Informationen
Lead free / RoHS compliant per distributor data (YIC-Electronics). The -I/TL grade is not AEC-Q100 qualified; use DSPIC33EP512GP504T-E/TL for the AEC-Q100 qualified variant per Microchip USA.
