DSPIC33EP64GP506T-I/MR - 16-bit 70 MIPS DSC 64KB | Microchip
Teilenummer: DSPIC33EP64GP506T-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.85 | $5,85 |
| 10 | $5.32 | $53,20 |
| 100 | $4.78 | $478,00 |
| 500 | $4.36 | $2.180,00 |
| 1.000 | $3.95 | $3.950,00 |
DSPIC33EP64GP506T-I/MR Übersicht
A digital signal controller combines the computational architecture of a microcontroller with DSP-grade multiply-accumulate hardware on a single die. Within the power management and embedded control hierarchy, the dsPIC33EP family sits above basic PIC16/PIC18 MCUs and alongside PIC24 16-bit microcontrollers, adding a DSP engine, high-speed ADC, and motor-control peripherals. This makes DSCs the standard choice for digitally controlled power conversion, sensor processing, and precision motion systems.
Key differentiating features of this part include the integrated CAN 2.0B module for automotive and industrial fieldbus networks, three on-chip operational amplifiers that offload external analog front-end components, four analog comparators, the Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement, and the Peripheral Trigger Generator (PTG) for hardware-orchestrated peripheral sequencing that reduces CPU overhead.
Architecturally, the dsPIC33E core executes an enhanced 16-bit instruction set with DSP multiply-accumulate, modulo and bit-reversed addressing, and two 40-bit accumulators, sustaining full 70 MIPS operation across the 3.0V to 3.6V supply range. High-speed PWM peripherals support complementary outputs with dead-time control, enabling single-chip digital power supplies and brushless DC motor drives.
Typical applications include automotive body and powertrain auxiliary modules using the CAN interface, digitally controlled switch-mode power supplies and PFC stages, three-phase BLDC and PMSM motor controllers, and industrial sensor-fusion nodes that exploit the CTMU and on-chip op amps.
When designing with this device, exploit the PTG to automate ADC sampling and PWM update loops in hardware, and budget the 8 KB RAM carefully because DSP buffering and communication stacks compete for the same space.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP64GP506T-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP64GP506T-I/MR (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, RAM, Core, Special Peripherals.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP64GP506T-E/MR
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →DSPIC33EP64GP506-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GP506T-H/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP512MC506T-I/MR
✅ Drop-In✓ Auf Lager
$4.2 / Stück
Datenblatt ansehen →DSPIC33EP512MC506-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GP506T-I/MR Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33E, 16-bit |
| Core Performance | 70 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| RAM | 8 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (I grade) |
| Gehäuse | 64-VQFN (9x9 mm), MR |
| Montageart | Surface Mount |
| CAN | CAN 2.0B module |
| On-chip Op Amps | 3 |
| Comparators | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG | Yes (Peripheral Trigger Generator) |
| RoHS-Status | Compliant |
| Packaging | Tape and Reel (T suffix) |
DSPIC33EP64GP506T-I/MR 64-vqfn (9x9 mm), mr Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP64GP506T-I/MR (64-vqfn (9x9 mm), mr-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP64GP506T-I/MR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP64GP506T-I/MR ist geeignet für 6 Anwendungs: Automotive CAN Body Modules, Digitally Controlled Power Supplies, BLDC and PMSM Motor Control, Industrial Sensing and Capacitive Touch, Audio Signal Processing Nodes, Battery-Powered Portable Instruments.
Automotive CAN Body Modules
The integrated CAN 2.0B module makes the DSPIC33EP64GP506T-I/MR a natural fit for body control nodes, lighting controllers, and auxiliary actuators that communicate on vehicle networks. Running at 70 MIPS, the core services CAN traffic plus application logic without external transceiver-side glue logic beyond a CAN transceiver chip. The industrial -40C to +85C rating covers cabin and most under-dash locations; for engine-bay or under-hood zones above 85C, drop to the -H/MR variant rated to +150C per Microchip USA. The PTG offloads periodic sensor polling from the CPU, reducing jitter in time-critical actuator responses.
Empfohlen
Digitally Controlled Power Supplies
Digital SMPS and PFC stages benefit directly from the 70 MIPS dsPIC33E core, high-speed PWM with dead-time control, and the PTG, which can trigger ADC conversions and PWM updates entirely in hardware for low-jitter voltage-mode or current-mode loops. The three on-chip op amps buffer current-shunt and voltage-divider signals without external amplifier ICs, shrinking BOM cost in compact power supplies. The 3.0V to 3.6V supply range suits standard 3.3V digital rails. Because loop bandwidth depends on ADC-to-PWM latency, keep the control ISR short and use the CTMU or comparator modules for fast hardware overcurrent protection independent of software latency.
Empfohlen
BLDC and PMSM Motor Control
Three-phase brushless DC and permanent-magnet synchronous motor drives exploit the complementary PWM outputs with programmable dead time, four comparators for cycle-by-cycle overcurrent limiting, and the 70 MIPS core executing field-oriented control mathematics. The three on-chip op amps condition low-side shunt current signals, removing a discrete amplifier stage per phase. A firmware update from sensorless six-step to FOC requires no hardware change because the same 64-pin VQFN footprint also hosts the DSPIC33EP512MC506T-I/MR, which offers 512 KB Flash for more elaborate algorithms - a valuable in-field upgrade and second-source path on an identical PCB.
Empfohlen
Industrial Sensing and Capacitive Touch
The CTMU (Charge Time Measurement Unit) enables precise capacitive touch keys and time-of-flight style measurements, while the 16-bit ADC family performance handles bridge and resistive sensor acquisition. The four analog comparators provide hardware threshold alarms for out-of-range conditions, and the CAN interface links the node into factory fieldbus segments. With 64 KB of Flash, protocol stacks plus a modest feature set fit comfortably; designs needing logging or larger stacks can migrate to the pin-compatible 512 KB MC506 variant. The PTG sequences sensor sampling autonomously, keeping CPU wake-ups - and average current - low in duty-cycled monitoring nodes.
Empfohlen
Audio Signal Processing Nodes
The DSP engine with two 40-bit accumulators and multiply-accumulate instructions executes filtering and equalization efficiently at 70 MIPS, making the GP506 suitable for embedded audio processing such as tone control, active crossover, and acoustic echo tasks in industrial and consumer products. The on-chip op amps can serve as low-cost analog input conditioning for line-level signals, and the 8 KB RAM supports modest delay lines and filter state buffers. For higher channel counts, serial interfaces connect to external audio codecs. Note that RAM is the primary constraint - profile buffer sizes early because DSP buffering competes with communication stacks in the same 8 KB space.
Empfohlen
Battery-Powered Portable Instruments
Handheld and portable instruments leverage the dsPIC33EP power-management features, including doze and idle modes, to stretch battery life while retaining 70 MIPS burst capability for compute-heavy measurement cycles. The CTMU performs capacitive sensing for button-free user interfaces, and the 16-bit ADC digitizes sensor inputs without an external converter. The 3.0V to 3.6V range aligns directly with single-cell Li-ion regulation through a 3.3V LDO or buck. The 64-pin VQFN (9x9 mm) keeps board area compact; designs pin-constrained to smaller footprints can cross to the GP504/GP502 family siblings available in 44-pin packages, reusing most firmware.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP64GP506T-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP64GP506T-E/MR | DSPIC33EP64GP506-I/MR | DSPIC33EP64GP506T-H/MR | DSPIC33EP512MC506T-I/MR | DSPIC33EP512MC506-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS (16-bit dsPIC33E) | 70 MIPS | 70 MIPS | 60 MIPS class | 70 MIPS | 70 MIPS |
| Flash Memory | 64 KB (22K x 24) | 64 KB (22K x 24) | 64 KB (22K x 24) | 64 KB (22K x 24) | 512 KB (170K x 24) | 512 KB (170K x 24) |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +150C (H grade, AEC-Q100) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Primary Focus | General purpose + CAN | General purpose, extended temp | General purpose, industrial temp | Automotive high-temperature | Motor control, large Flash | Motor control, large Flash |
Wichtigste Unterscheidungsmerkmale
- Integrated analog front end (vs. DSPIC33EP512MC506T-I/MR)
- Lowest-cost 64-pin dsPIC33EP entry (vs. DSPIC33EP512MC506T-I/MR)
- Industrial temperature ceiling (vs. DSPIC33EP64GP506T-H/MR)
- Trade-off: smaller memory than MC variant (vs. DSPIC33EP512MC506T-I/MR)
Designhinweise
The dsPIC33EP64GP506 requires a regulated 3.0V to 3.6V supply. Decouple every VDD/VDDCORE pair with 0.1 uF ceramics placed within 2 mm of the pins, and add one bulk 10 uF capacitor near the VQFN. The on-chip regulator requires its dedicated VCAP capacitor exactly as specified in the datasheet connection diagrams - omitting or mis-sizing this capacitor is the single most common cause of erratic startup and brown-out resets on dsPIC33E boards.
The 64-VQFN (9x9 mm) MR package has a large exposed pad on the underside that serves as the primary VSS connection. The PCB land pattern must include a solderable thermal pad tied to a grounded via array (typically 5x5 vias on 1 mm pitch); relying on perimeter ground pins alone causes ground bounce during simultaneous PWM switching and degrades ADC accuracy. Follow the Microchip VQFN land-pattern application note for stencil aperture design to avoid voiding under the pad.
Keep the CAN TX/RX traces short and route them as a matched pair to the CAN transceiver (e.g., MCP2551 or MCP2562), with the transceiver's STBY pin controllable from a GPIO for bus-off power saving. Separately, route analog inputs for the op amps and CTMU away from PWM and crystal traces; use the PTG to trigger ADC samples between PWM edges to minimize switching-noise coupling into conversions.
Do not assume all four temperature grades behave identically at the thermal limit: the -I/MR is qualified to +85C ambient, and operating it above that rating voids reliability even if the silicon 'appears to work'. Estimate junction temperature as ambient plus dissipation times theta-JA from the datasheet before committing the industrial grade to sealed enclosures; select the -E/MR or -H/MR drop-in instead when margin is thin.
Compliance-Informationen
RoHS compliance consistent with standard Microchip production parts listed by DigiKey/Mouser; the -H/MR variant (not this part) is AEC-Q100 / TS 16949 per Microchip USA. Formal REACH and conflict-minerals declarations should be pulled from Microchip's environmental portal.
