DSPIC33EP64GS502-E/2N - 16-bit 60 MIPS DSC, 64KB Flash | Microchip
Teilenummer: DSPIC33EP64GS502-E/2N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.95 | $4,95 |
| 10 | $4.45 | $44,50 |
| 100 | $3.9 | $390,00 |
| 500 | $3.45 | $1.725,00 |
| 1.000 | $3.1 | $3.100,00 |
DSPIC33EP64GS502-E/2N Übersicht
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control-oriented architecture of a microcontroller. Within the power management hierarchy, a DSC replaces analog PWM controllers with firmware-defined switching control, enabling adaptive algorithms such as nonlinear control, predictive control, and phase management in switched-mode power supplies.
Key features of the dsPIC33EP64GS502 include the dsPIC 33EP core with DSP instruction extensions, an interconnected high-speed PWM module designed for synchronous rectification and phase-shifted topologies, a high-speed 12-bit ADC with programmable gain amplifier (PGA), and integrated analog comparators and DACs for fast current-limit protection loops. The device also carries Functional Safety (FuSa) support per Microchip's product classification.
The GS-series interconnect fabric routes ADC sample-ready events directly to PWM updates with deterministic latency, minimizing control-loop delay, which is the critical parameter in peak-current-mode and multi-phase converter designs operating at hundreds of kilohertz.
Typical applications include AC-DC power supplies and interleaved power factor correction (Microchip publishes an Interleaved PFC reference design rated up to 350 W for this family), DC-DC converters, digital lighting ballasts, solar micro-inverters, and automotive power modules where the AEC-Q100 qualification and E-grade temperature rating are required.
Design consideration: budget the control-loop timing so that ADC conversion completes within the PWM period deadband; the interconnect allows near-zero-latency duty-cycle updates but firmware must not exceed the sampling budget.
This page synthesizes distributor availability data, same-package alternatives, and digital-power design notes not found in a single manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP64GS502-E/2N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP64GS502-E/2N (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, DAC, Packaging.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP128GS502-E/2N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP32GS502-E/2N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.5 / Stück
Datenblatt ansehen →DSPIC33EP64GS502-I/2N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS502-E/2N Grenzwerte & elektrische Eigenschaften
| Core | dsPIC 33EP, 16-bit |
| Max CPU Speed | 60 MIPS |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 28-UQFN (6x6 mm) with exposed pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +125C (E grade) |
| Qualification | AEC-Q100 (Automotive) |
| Functional Safety | FuSa supported (per Microchip classification) |
| High-Speed PWM | Yes, interconnected (digital power optimized) |
| ADC | High-speed 12-bit with PGA |
| Comparators | Integrated analog comparators |
| DAC | Integrated DAC |
| Product Series | dsPIC33EPXXGS50X (Digital Power/SMPS) |
| Packing | Tube (per distributor listing) |
DSPIC33EP64GS502-E/2N 28-uqfn (6x6 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP64GS502-E/2N (28-uqfn (6x6 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP64GS502-E/2N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP64GS502-E/2N ist geeignet für 6 Anwendungs: AC-DC Switch-Mode Power Supplies, Interleaved Power Factor Correction, DC-DC Converters and Point-of-Load, Automotive Power Conversion Modules, Solar Micro-Inverters and Lighting Ballasts, Digital Battery Chargers.
AC-DC Switch-Mode Power Supplies
The DSPIC33EP64GS502-E/2N fits AC-DC SMPS designs because its interconnected high-speed PWM module and high-speed ADC with PGA close current-mode loops with deterministic, near-zero latency, supporting switching frequencies in the hundreds of kilohertz. In a typical flyback or forward converter the ADC samples the primary current each cycle, comparators provide hardware cycle-by-cycle current limit, and firmware implements the voltage-loop compensator digitally - allowing adaptive compensation and brown-out shaping impossible with fixed analog controllers. Trade-off: firmware development effort exceeds an analog PWM IC, but BOM consolidation and field-updatable control behavior offset it in volume.
Empfohlen
Interleaved Power Factor Correction
Microchip publishes an Interleaved PFC reference design for this family producing up to 350 W from a universal AC input, making the DSPIC33EP64GS502-E/2N a natural controller for two-phase boost PFC stages. The GS-series PWM interconnect phase-shifts the two boost legs precisely while independent ADC channels sample each inductor current; the PGA amplifies shunt signals for accurate average-current-mode control. Integrated DACs set comparator thresholds for fast overcurrent protection without CPU intervention. The 60 MIPS core averages input current shaping and per-phase balancing simultaneously, and the 64KB flash holds the PFC state machine with margin for PMBus telemetry.
Empfohlen
DC-DC Converters and Point-of-Load
In synchronous buck or boost DC-DC converters, the DSPIC33EP64GS502-E/2N replaces analog PWM controllers with a digitally controlled loop: the high-speed ADC with PGA samples output voltage and inductor current, and the interconnected PWM adjusts duty cycle with deterministic delay, enabling higher bandwidth than analog loops of equal complexity. Integrated comparators implement hardware current limit for fault resilience during load transients. The 3.3 V supply and 28-pin UQFN 6x6 package suit compact POL bricks. Design consideration: allocate firmware cycles so sampling plus compensation complete inside the switching period deadband.
Empfohlen
Automotive Power Conversion Modules
The DSPIC33EP64GS502-E/2N carries AEC-Q100 qualification and an E temperature grade of -40C to +125C, satisfying the environmental requirements of automotive 12 V and 48 V power conversion modules such as LED headlamp drivers, DC-DC aux converters, and small inverter auxiliaries. Hotenda's listing explicitly identifies the part as 'Automotive, AEC-Q100.' The digital control architecture supports adaptive algorithms - for example, LED thermal foldback computed from sensed current and temperature - while comparators enforce hardware fault limits. FuSa support per Microchip's classification assists safety-relevant documentation packages required by automotive development flows.
Empfohlen
Solar Micro-Inverters and Lighting Ballasts
Digital lighting ballasts and small solar micro-inverter stages benefit from the GS-series combination of high-resolution PWM control, fast ADC sensing, and on-chip comparators. In a micro-inverter MPPT front end, the DSPIC33EP64GS502-E/2N executes the MPPT algorithm at 60 MIPS while PWM drives the power stage and the ADC-with-PGA resolves small shunt voltages for current sensing - reducing external signal-conditioning components. In ballasts, the same peripherals implement lamp-current regulation and fault shutdown via comparator interrupts. The 64KB flash accommodates grid-interconnect housekeeping code, and the 6x6 mm UQFN saves board area in sealed enclosures.
Empfohlen
Digital Battery Chargers
Smart battery chargers require precisely profiled CC/CV charging curves, temperature-based derating, and fault logging - all firmware tasks where the DSPIC33EP64GS502-E/2N excels. The high-speed ADC samples charge current and pack voltage each PWM cycle; the DACs and comparators implement hardware OVP/OCP cutoffs independent of software; and the 60 MIPS core runs charge-state state machines plus communication protocols simultaneously. Flash-resident charge profiles allow one hardware BOM to serve multiple battery chemistries, and the AEC-Q100 E-grade option qualifies the charger for vehicle accessory applications operating from -40C to +125C ambient conditions.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP64GS502-E/2N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP128GS502-E/2N | DSPIC33EP32GS502-E/2N | DSPIC33EP64GS502-I/2N |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) EP | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 64 KB | 128 KB | 32 KB | 64 KB |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| Qualification | AEC-Q100 Automotive | AEC-Q100 Automotive | AEC-Q100 Automotive | Industrial (non-automotive) |
| High-Speed PWM / ADC-PGA | Yes | Yes (same GS-series interconnect) | Yes (same GS-series interconnect) | Yes (same GS-series interconnect) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Wichtigste Unterscheidungsmerkmale
- Balanced 64KB flash for multi-loop digital power firmware (vs. DSPIC33EP32GS502-E/2N)
- Automotive E-grade temperature rating (vs. DSPIC33EP64GS502-I/2N)
- Cost-optimized upgrade path (vs. DSPIC33EP128GS502-E/2N)
Designhinweise
The /2N package is a 6x6 mm UQFN with a large exposed pad on the bottom side that must be soldered to a grounded copper pour - it is both the primary ground return and the main thermal path. Design the land pattern per Microchip's UQFN application note with an array of thermal vias (typically 4x4) connecting the pad to internal ground planes. Do not treat the exposed pad as no-connect; boards that omit the pad connection exhibit elevated junction temperatures and degraded analog performance in the ADC and PGA.
In digital power layouts, keep the high-speed ADC input traces away from PWM switching nodes; the GS-series interconnect will faithfully convert whatever noise the ADC samples. Use Kelvin connections for current-shunt sense lines into the PGA inputs and add RC anti-alias filtering sized to the ADC sampling scheme in the family datasheet. Decouple every VDD pin with 0.1 uF ceramics placed within 2 mm of the pin, plus bulk capacitance near the 3.3 V rail entry to the board.
Do not assume all 28-pin dsPIC33EP GS502 order codes share one footprint: /2N is the UQFN 6x6, while /MM and /ML are QFN-S and /SS, /SO, /SP are other packages with different land patterns. When qualifying alternates, verify the suffix precisely. Also confirm flash headroom before substituting the 32KB variant - reserve at least 20% margin for OTA or diagnostic code growth, otherwise the cost saving becomes a respin later in the program.
Compliance-Informationen
AEC-Q100 automotive qualification and -40C to +125C E-grade confirmed via distributor listings (Hotenda, FindIC). RoHS/REACH/lead-free status not stated in provided web data - verify on Microchip product page.
