DSPIC33EP64GS804-I/ML - 16-bit DSC 64KB 70MIPS | Microchip
Teilenummer: DSPIC33EP64GS804-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.96 | $496,00 |
| 500 | $4.45 | $2.225,00 |
| 1.000 | $3.98 | $3.980,00 |
DSPIC33EP64GS804-I/ML Übersicht
A digital signal controller combines the compute throughput of a digital signal processor (DSP) with the peripheral integration and control orientation of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33EP GS family sits at the heart of switched-mode power supplies, power factor correction stages, and motor drive systems, where a single controller closes fast control loops and manages communication. The dsPIC33EP64GS804 belongs to Microchip's 16-bit dsPIC33EP architecture, a member of the broader microcontroller and DSC semiconductor category.
Key differentiating features include the interconnected high-speed PWM module designed for digital power conversion, an analog front end combining high-speed ADC inputs, programmable gain amplifiers (PGA) and comparators, plus a CAN bus interface. The device runs at up to 70 MIPS from its 16-bit DSP core with DSP instruction support, and 4 DMA channels offload data movement from the CPU. Dual-partition Flash support enables live firmware updates, an important capability in power products deployed in the field.
Architecturally, the dsPIC33EP64GS804 uses a CMOS 16-bit core with a modified Harvard bus structure and multiple internal bus architectures, executing C and optimized assembly efficiently. Seven timers, four serial I/O ports, and four external interrupts round out the peripheral set, letting one controller handle control loops, housekeeping, and host communication simultaneously.
Typical applications include AC-DC and DC-DC power supplies, solar micro-inverters and power factor correction, digital lighting (HID/LED) ballasts, and battery chargers, where the interconnected PWM and fast analog comparators directly improve loop bandwidth and protection response time. The CAN interface makes it equally suited to automotive and industrial power modules.
Design considerations: the GS-series PWM and ADC modules are highly configurable; budget engineering time for peripheral configuration and verify 3.3 V supply decoupling and exposed-pad grounding for best analog performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-25.
Drop-in-Alternativen für DSPIC33EP64GS804-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP64GS804-I/ML (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Program Memory (Flash), Operating Temperature, RAM.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP128GS804-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.6 / Stück
Datenblatt ansehen →DSPIC33EP32GS804-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GP504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.44 / Stück
Datenblatt ansehen →DSPIC33EP128GP504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →DSPIC33EP64MC504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.25 / Stück
Datenblatt ansehen →DSPIC33EP64GS804-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit dsPIC33EP DSC |
| Program Memory (Flash) | 64 KB |
| RAM | 8 KB |
| Maximum CPU Speed | 70 MIPS |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 44-QFN (8x8 mm) with Exposed Pad |
| Montagestil | Surface Mount |
| Terminal Pitch | 0.65 mm |
| DMA Channels | 4 |
| Timers | 7 |
| Serial I/O Ports | 4 |
| External Interrupts | 4 |
| CAN Interface | Yes |
| Analog Peripherals | High-speed ADC, PGA, Comparators |
| PWM | Interconnected High-Speed PWM |
| Flash Partitioning | Dual Partition Flash |
| Process Technology | CMOS |
DSPIC33EP64GS804-I/ML 44-qfn (8x8 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP64GS804-I/ML (44-qfn (8x8 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP64GS804-I/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP64GS804-I/ML ist geeignet für 6 Anwendungs: Digital Switch-Mode Power Supplies (AC-DC / DC-DC), Power Factor Correction (PFC), Solar Micro-Inverters and Renewable Energy Converters, Digital Lighting Ballasts (HID / LED Drivers), Battery Chargers and Battery Management, Automotive and Industrial Power Modules with CAN.
Digital Switch-Mode Power Supplies (AC-DC / DC-DC)
The DSPIC33EP64GS804-I/ML is purpose-built for digitally controlled SMPS: its interconnected high-speed PWM, high-speed ADC, PGA, and comparators allow cycle-by-cycle current-mode control with minimal CPU intervention, closing voltage and current loops at switching frequencies far beyond generic MCU capability. In a typical AC-DC front end, the controller regulates the output with a fast inner current loop and a slower outer voltage loop while the analog comparators provide hardware overcurrent protection independent of software latency. The 70 MIPS DSP core leaves ample headroom for nonlinear control laws and housekeeping. The dual-partition Flash enables field firmware updates in deployed power hardware. XAIPART recommends pairing this DSC with appropriate gate drivers and EMI filtering at the power stage boundary.
Empfohlen
Power Factor Correction (PFC)
In boost or bridgeless PFC stages, the DSPIC33EP64GS804-I/ML uses its high-speed PWM to drive the PFC switch while the high-speed ADC samples inductor current and bus voltage synchronized to the PWM carrier, minimizing sampling delay and improving total harmonic distortion. The integrated PGA scales low-level current-sense signals on-chip, reducing external analog components, and the fast comparators implement instantaneous overcurrent shutdown for input surge events. Running at up to 70 MIPS, the DSP core executes average-current-mode control plus THD-optimization algorithms with margin. The 3.3 V logic level interfaces cleanly with isolated feedback via digital isolators. This application exploits precisely the peripheral interconnect that distinguishes the GS family from general-purpose dsPIC33EP parts.
Empfohlen
Solar Micro-Inverters and Renewable Energy Converters
Micro-inverters require simultaneous MPPT control, grid-synchronized current injection, and protection - workloads the DSPIC33EP64GS804-I/ML handles with its 70 MIPS DSP core and dedicated power peripherals. The interconnected high-speed PWM generates the phase-shifted or interleaved drive signals for the boost and inverter stages, while the high-speed ADC with PGA samples grid voltage and current for anti-islanding and grid-code compliance. The comparators provide hardware-level fault isolation faster than any interrupt-driven software path. Dual-partition Flash supports firmware field updates after installation on rooftops where physical access is difficult. The CAN interface links multiple inverters or a monitoring gateway. Designers should verify grid-interconnection algorithm certification for their target market.
Empfohlen
Digital Lighting Ballasts (HID / LED Drivers)
High-intensity-discharge and high-power LED luminaires demand precisely shaped lamp current and robust fault handling. The DSPIC33EP64GS804-I/ML drives resonant half-bridge or buck stages with its high-speed PWM, using the high-speed ADC and PGA to sample lamp voltage and current for closed-loop power regulation. The on-chip comparators implement lamp-out, short-circuit, and open-circuit protection in hardware, critical for safety-compliant lighting products. The 70 MIPS core performs lamp ignition sequencing, dimming curves, and communication simultaneously. The CAN interface integrates the driver into DALI-over-CAN or building-automation networks. Using one 44-QFN controller instead of a discrete analog ballast reduces BOM count and enables tunable color/dimming features demanded by modern luminaires.
Empfohlen
Battery Chargers and Battery Management
Multi-chemistry battery chargers benefit from the DSPIC33EP64GS804-I/ML's combination of fast control and system connectivity. The high-speed PWM implements constant-current/constant-voltage conversion stages, while the high-speed ADC with PGA samples pack current, cell voltages, and temperature with synchronized sampling to avoid control-loop artifacts. Hardware comparators enforce cell overvoltage and overcurrent limits independently of firmware state, supporting functional-safety design goals. The 70 MIPS DSP core runs charging state machines, coulomb counting, and thermal derating algorithms concurrently. The integrated CAN interface is the standard link in automotive and industrial battery systems, letting this single controller serve as both converter controller and BMS communication node. Pair with isolated CAN transceivers for high-voltage packs.
Empfohlen
Automotive and Industrial Power Modules with CAN
The DSPIC33EP64GS804-I/ML includes a CAN interface, positioning it for on-board chargers, DC-DC modules, and auxiliary power units in vehicles and industrial equipment where CAN is the de facto network. The GS-series high-speed PWM and fast analog comparators handle the switching power stage and hardware protection, while the 70 MIPS 16-bit DSP core services the CAN stack, diagnostics (UDS-style firmware schemes are supported by the dual-partition Flash for flash-over-CAN updates), and control loops concurrently. Four serial I/O ports and four external interrupts allow interfacing with sensors and supervisors. Designers selecting this part for automotive programs should confirm the exact temperature grade and any AEC-Q qualification requirements for their tier, as variant suffixes differ.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP64GS804-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP128GS804-I/ML | DSPIC33EP32GS804-I/ML | DSPIC33EP64GP504-I/ML | DSPIC33EP128GP504-I/ML | DSPIC33EP64MC504-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) with EP | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 128 KB | 32 KB | 64 KB | 128 KB | 64 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Peripheral Family | GS (digital power: high-speed PWM, ADC+PGA, comparators) | GS (digital power) | GS (digital power) | GP (general purpose) | GP (general purpose) | MC (motor control) |
| CAN Interface | Yes | Yes | Yes | Yes | Yes | Yes |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Wichtigste Unterscheidungsmerkmale
- Digital-power peripheral interconnect (vs. DSPIC33EP64GP504-I/ML)
- Twice the program memory in the same footprint (vs. DSPIC33EP32GS804-I/ML)
- Dual Partition Flash for live field updates (vs. DSPIC33EP64GP504-I/ML)
- Trade-off: no verified cross-brand drop-in exists (vs. TI C2000 series (e.g. TMS320F28027))
Designhinweise
The exposed pad (EP) on the 44-QFN (8x8 mm) package is the primary ground and thermal path. Solder it to a solid ground plane with an array of thermal vias; do not treat it as optional. Place 100 nF ceramic decoupling capacitors within 2-3 mm of each VDD pin pair, plus bulk 4.7-10 uF near the supply entry. Because the GS-series contains high-speed ADC and PGA blocks, keep the analog ground region quiet and separate switching-node traces from ADC input routing to preserve conversion accuracy.
The device operates from a 3.3 V supply (distributor data: '16-bit dsPIC 64KB Flash 3.3V'). When powering from a 5 V system, use an LDO or buck rated for at least the controller's peak operating current; account for simultaneous PWM switching, ADC conversions, and CAN transmission. Sequence the 3.3 V rail monotonically and use the on-chip brown-out/POR features; verify configuration-bit settings for oscillator fail-safe clock switching so a crystal failure does not stall a running power converter.
The GS-series interconnected PWM, ADC, PGA, and comparator modules are far more configurable than generic MCU timers - budget real engineering time for peripheral configuration, and start from Microchip's digital-power reference designs (e.g. the EPC9143 48 V-to-12 V brick design referenced on the product page) rather than from scratch. Also note the dual-partition Flash behavior: in partitioned mode program memory is split into two bootable regions (starting at 0x000000 for the single-block unpartitioned case per Northern Software docs) - verify which mode your linker script assumes before changing memory maps.
When routing PWM outputs to gate drivers, keep traces short and reference them to a clean ground; the high-speed PWM edge rates can couple into adjacent ADC inputs. For CAN, route the CANH/CANL pair as a matched differential pair with a common-mode choke at the connector and terminate at both bus ends with 120 ohm. Use the four DMA channels to move ADC results to RAM so the CPU does not poll, which reduces both jitter and EMI from burst bus activity.
Compliance-Informationen
The retrieved data does not include explicit RoHS/REACH/lead-free statements for this exact ordering code. Consult Microchip's product page and environmental datasheet for official declarations. AEC-Q100 status not stated in the provided data.