DSPIC33EP64MC502-I/MM - 16-bit 70 MIPS DSC, 64KB Flash | Microchip
Teilenummer: DSPIC33EP64MC502-I/MM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33EP64MC502-I/MM Übersicht
A digital signal controller combines the control peripherals of a microcontroller with the mathematical throughput of a DSP engine on a single chip. Within the power-management hierarchy, the DSC sits above a standard MCU and below a full DSP-plus-MCU two-chip solution, making the dsPIC33E family a single-chip choice for embedded control loops that require multiply-accumulate throughput.
Key features include the dsPIC33E core with integrated DSP instruction set, high-speed MCPWM (motor control PWM) peripherals, a Quadrature Encoder Interface (QEI) for positional feedback, 4 DMA channels, 5 timers, and 3 external interrupt sources. According to Microchip product data, the device uses a multiple internal bus architecture and CMOS process technology with low-power operating modes.
The MC502 variant targets precision motor control: the high-speed PWM module with advanced analog integration enables field-oriented control of brushless DC (BLDC) and permanent magnet synchronous motors (PMSM) with fine PWM resolution. The 8K-word SRAM supports control-loop state variables, filters, and commutation tables without external memory.
Typical applications include BLDC and PMSM motor drives, digital power supplies (DC-DC, PFC, inverters), battery charging systems, and industrial automation sensor nodes. The industrial temperature grade (-40C to +85C) suits factory-floor environments.
Design consideration: the -I/MM package uses an exposed thermal pad that must be soldered to a grounded PCB pour for both thermal relief and signal integrity; also budget VDDCORE decoupling via the VCAP pin per the family datasheet DS70000657J.
This page synthesizes distributor pricing, drop-in same-family alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für DSPIC33EP64MC502-I/MM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP64MC502-I/MM (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, RoHS Status, Program Memory (Flash), Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP64MC502-E/MM
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →DSPIC33EP64MC502-H/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128MC502-I/MM
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP32MC502-I/MM
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64MC202-I/MM
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.29 / Stück
Datenblatt ansehen →DSPIC33EP128MC202-I/MM
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.9 / Stück
Datenblatt ansehen →DSPIC33EP64MC502-I/MM Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit dsPIC33E DSC core |
| Maximale Taktfrequenz | 60 MHz |
| Core Performance | 70 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| SRAM | 8 KB (8192 words) |
| DMA Channels | 4 |
| Timers | 5 |
| External Interrupts | 3 |
| PWM Module | MCPWM (motor control PWM, high-speed) |
| Encoder Interface | QEI (Quadrature Encoder Interface) |
| Betriebstemperatur | -40C to +85C (industrial, I-grade) |
| Gehäuse | 28-QFN-S, 6x6 mm |
| Montageart | Surface Mount |
| Process Technology | CMOS |
DSPIC33EP64MC502-I/MM Pin-Konfiguration
| Pin 1 | MCLR — Master clear reset input, active low |
| Pin 2 | AN0/CN2/RB0 — Analog input 0 / change notification / port B bit 0 |
| Pin 3 | AN1/CN3/RB1 — Analog input 1 / change notification / port B bit 1 |
| Pin 4 | AN2/CN4/RB2 — Analog input 2 / change notification / port B bit 2 |
| Pin 5 | AN3/CN5/RB3 — Analog input 3 / change notification / port B bit 3 |
| Pin 6 | VSS — Ground reference |
| Pin 7 | VDD — Positive supply |
| Pin 8 | OSC1/CLKI/RA2 — Crystal oscillator input / external clock input |
| Pin 9 | OSC2/CLKO/RC15 — Crystal oscillator output / clock output |
| Pin 10 | RP35/RF0 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 11 | RP20/RF1 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 12 | RP21/RF2 — Remappable peripheral pin, SDI1 candidate (per DS70000657J) |
| Pin 13 | RP22/RF3 — Remappable peripheral pin, SDO1 candidate (per DS70000657J) |
| Pin 14 | VCAP/VDDCORE — Core voltage capacitor connection - external capacitor required |
| Pin 15 | RP40/RF4 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 16 | RP41/RF5 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 17 | AN4/CN1/RB5 — Analog input 4 / change notification / port B bit 5 |
| Pin 18 | RP18/RF6 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 19 | RP19/RF7 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 20 | RP24/RF8 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 21 | RP68/RF13 — Remappable peripheral pin (per DS70000657J pin tables) |
| Pin 22 | AN9/RP69/RF13-class — Verify exact multiplexing against DS70000657J pin diagrams |
| Pin 23 | RP23/RB14-class — Verify exact multiplexing against DS70000657J pin diagrams |
| Pin 24 | PGD/RP-class — Programming data / remappable I/O - verify against DS70000657J |
| Pin 25 | PGC/RP-class — Programming clock / remappable I/O - verify against DS70000657J |
| Pin 26 | RP-class/RC-class — Verify exact multiplexing against DS70000657J pin diagrams |
| Pin 27 | AVSS — Analog ground (per family datasheet power pin arrangement) |
| Pin 28 | AVDD — Analog supply (per family datasheet power pin arrangement) |
Typische Anwendungen
DSPIC33EP64MC502-I/MM ist geeignet für 6 Anwendungs: BLDC Motor Control, Digital Power Supplies, Battery Charging Systems, Industrial Automation and Sensing, Embedded Signal Processing Nodes, PMSM Servo Drives.
BLDC Motor Control
The DSPIC33EP64MC502-I/MM is purpose-built for brushless DC motor drives: its MCPWM high-speed PWM module generates complementary PWM pairs with fine edge resolution for field-oriented control, while the QEI reads quadrature encoder signals directly for rotor position. Running at 70 MIPS, the 16-bit core executes Clarke/Park transforms and PI current loops within a single PWM period, and the 4 DMA channels offload ADC results without CPU overhead. In a typical 24 V drive, the DSC interfaces with a 3-phase gate driver over its remappable RPx pins; the 8 KB SRAM holds state observers and commutation tables. Compared with a generic MCU, the DSP engine's MAC throughput shortens loop execution and enables quieter, more energy-efficient motors.
Empfohlen
Digital Power Supplies
Switching power converters - DC-DC, PFC stages, and inverters - need deterministic, high-frequency control loops that this DSC delivers with its 70 MIPS core and high-speed PWM. The MCPWM module provides phase-shifted or complementary outputs with fine resolution, which is essential for phase-shifted full-bridge and LLC topologies where effective resolution above 10 bits is required at 100+ kHz switching frequencies. ADC sampling can be synchronized to PWM events via DMA for accurate average-current-mode control. The industrial -40C to +85C rating covers telecom and industrial PSU environments. Design trade-off: budget code space for the compensator math within the 64 KB Flash, or move up to the pin-compatible DSPIC33EP128MC502-I/MM if feature-rich firmware is planned.
Empfohlen
Battery Charging Systems
Smart battery chargers require CC/CV charge profiling, temperature monitoring, and protection sequencing - all natural fits for the DSPIC33EP64MC502-I/MM. Its analog front-end inputs (AN0-AN3 on RB0-RB3) monitor battery voltage, current sense amplifiers, and NTC thermistors, while the MCPWM drives the buck charging stage. The 70 MIPS core implements state machines for Li-ion CC/CV taper, trickle pre-charge, and fault handling with PID loops for stable current regulation. Three external interrupts support pack protection events (over-current, over-temperature) with fast response, and 4 DMA channels keep ADC streaming out of the critical loop. The 28-QFN 6x6 mm footprint suits compact charger PCBs in power tools and e-mobility packs.
Empfohlen
Industrial Automation and Sensing
Factory automation nodes benefit from this DSC's combination of control peripherals and signal-processing throughput. The 4 DMA channels, 5 timers, and 3 external interrupts support deterministic sequencing of actuators and sensors, while the DSP engine performs digital filtering and FFT-based condition monitoring (e.g., vibration analysis on motor bearings) locally, reducing host traffic. Remappable RPx pins let one firmware image drive different I/O maps for product variants, cutting SKU proliferation. The 64 KB Flash accommodates communication stacks and diagnostics, and the -40C to +85C industrial grade is standard for panel and machine-mounted electronics. QEI inputs also make it a direct axis-position interface for incremental encoders in positioning systems.
Empfohlen
Embedded Signal Processing Nodes
Applications that sit between a plain MCU and a full DSP - such as active filtering, tone detection, and sensor fusion - fit the dsPIC33EP64MC502-I/MM's single-chip DSP-plus-control architecture. The DSP instruction set provides single-cycle MAC and dual operand fetch, so biquad IIR and FIR filters run in a small fraction of the interrupt budget compared with software-emulated math on a standard 8-bit MCU. The 8 KB SRAM buffers several milliseconds of sampled data at typical control rates, and DMA moves ADC samples without CPU stalls. One-chip integration of PWM, QEI, and communication interfaces eliminates the two-chip MCU-plus-DSP bill of materials, reducing cost and board area in compact instrumentation.
Empfohlen
PMSM Servo Drives
Permanent magnet synchronous motor servo drives demand fast current loops, precise rotor-angle tracking, and flexible PWM - exactly the peripheral set of this part. The QEI decodes incremental encoder feedback (A/B/Z channels) with 4x decoding, the MCPWM generates center-aligned space-vector PWM with dead-time insertion, and the 70 MIPS core closes current loops at PWM frequency for smooth low-speed torque. Field weakening and MTPA algorithms fit within the 64 KB Flash alongside a communication stack. Compared with sensorless-only solutions, the encoder-based QEI path provides absolute-referenced angle startup and high dynamic stiffness, making the MC502 well suited to robotics joints, CNC axes, and pick-and-place machinery where holding torque accuracy matters.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP64MC502-I/MM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP64MC502-E/MM | DSPIC33EP64MC502-H/MM | DSPIC33EP128MC502-I/MM | DSPIC33EP64MC202-I/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Performance | 16-bit, 60 MHz, 70 MIPS | 16-bit, 60 MHz, 70 MIPS | 16-bit, 60 MHz, 70 MIPS | 16-bit, 60 MHz, 70 MIPS | 16-bit, 60 MHz, 70 MIPS |
| Flash Memory | 64 KB (22K x 24) | 64 KB (22K x 24) | 64 KB (22K x 24) | 128 KB (44K x 24) | 64 KB (22K x 24) |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| MC50x Advanced Analog / Enhanced PWM | Yes (MCPWM + advanced analog) | Yes | Yes | Yes | No (MC20x feature set) |
| Temperature Grade | -40C to +85C (I) | Extended grade (E) | -40C to +85C class (H) | -40C to +85C (I) | -40C to +85C (I) |
| DMA Channels / Timers | 4 DMA / 5 timers | 4 DMA / 5 timers | 4 DMA / 5 timers | 4 DMA / 5 timers | 4 DMA / 5 timers |
Wichtigste Unterscheidungsmerkmale
- Twice the Flash headroom on same footprint (vs. DSPIC33EP128MC502-I/MM)
- MC50x advanced analog and enhanced motor-control PWM (vs. DSPIC33EP64MC202-I/MM)
- Surface-mount QFN vs through-hole DIP availability (vs. DSPIC33EP64MC502-I/SP)
Designhinweise
The 28-QFN-S exposed pad under the DSPIC33EP64MC502-I/MM must be soldered to a grounded copper pour - it is a primary ground/thermal path, not an optional tab. Use an array of thermal vias (typically 3x3) connecting the pad to internal ground planes. For the VCAP/VDDCORE pin, place the specified bulk ceramic capacitor as close to pin 14 as possible with a short, wide trace; insufficient core decoupling is a leading cause of erratic reset behavior on dsPIC33EP parts. Follow the layout guidelines in family datasheet DS70000657J.
Verify the exact operating voltage range in DS70000657J before finalizing the rail design; dsPIC33EP-class parts are typically powered from a single 3.0-3.6 V supply with the core rail regulated internally via VCAP. Keep the analog supply (AVDD/AVSS) fed through an RC or ferrite filter from the digital VDD rail to preserve ADC accuracy in motor-control current loops. Sequence MCLR with a pull-up resistor (4.7k-10k typical) and an RC delay or supervisor to guarantee clean power-on reset across slow-rising supplies.
Exploit Peripheral Pin Select (PPS): route PWM outputs to pins adjacent to the gate driver connector and encoder QEI inputs away from PWM switching edges to reduce crosstalk. Keep the crystal loop (OSC1/OSC2, pins 8-9) compact with guard ground, or drive CLKI from an external oscillator to avoid crystal start-up issues at 60 MHz system frequencies. In motor drives, separate the ADC analog inputs (RB0-RB3) routing from PWM/gate-drive traces and add RC anti-alias filters sized to the PWM sampling scheme.
Flash programming requires the correct PGD/PGC pairing and MCLR at programming voltage per the device programming specification - do not repurpose the dedicated ICSP pins 24-25 as strong pull-downs in application hardware, or in-circuit programming will fail. When substituting family variants (e.g., 32 KB for 64 KB Flash), confirm the compiler memory model and linker script match the target device; the same QFN footprint does not guarantee identical configuration-bit defaults across MC20x and MC50x feature sets.
Compliance-Informationen
Compliance status was not stated in the provided distributor/manufacturer data; verify RoHS/REACH/lead-free status on the Microchip product page or DigiKey compliance documents before export-controlled production. The -I/MM suffix denotes the industrial temperature grade (-40C to +85C).
