DSPIC33FJ64GP706A-I/MR - 16-bit DSC 40MIPS 64KB | Microchip
Teilenummer: DSPIC33FJ64GP706A-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $13.6 | $13,60 |
| 10 | $12.6 | $126,00 |
| 100 | $11.8 | $1.180,00 |
| 500 | $10.9 | $5.450,00 |
| 1.000 | $10.1 | $10.100,00 |
DSPIC33FJ64GP706A-I/MR Übersicht
A digital signal controller combines the computational core of a digital signal processor with the peripherals and interrupt architecture of a microcontroller. Within the power-management hierarchy of embedded devices, a DSC sits between a general-purpose MCU and a dedicated DSP: it executes tight control loops and filtering algorithms (FIR, IIR, PID) in fixed-point arithmetic while simultaneously managing communications, timing and analog peripherals on a single chip.
Key features of the DSPIC33FJ64GP706A include a modified Harvard, 16-bit dsPIC33F core with a barrel shifter for efficient data manipulation, boundary-scan (JTAG) support for board-level test, and industrial temperature operation of -40C to +85C as indicated by the -I suffix. The A revision of the GP706 family offers seamless migration options within the dsPIC33F platform and to related PIC24 devices.
The 40 MIPS core operates from an internally or externally clocked system; the family supports phase-locked-loop clock multiplication from a primary oscillator, allowing deterministic interrupt latency for closed-loop control. The general-purpose (GP) peripheral set includes UART, SPI and I2C serial engines, motor-control/PWM-capable output-compare modules and a high-speed 12-bit ADC pipeline suited to power conversion and sensor fusion.
Typical applications include digital power supplies, motor control drives, solar inverters, and industrial sensing nodes where deterministic 16-bit fixed-point math at 40 MIPS meets cost-sensitive BOM targets. The 53 available I/O lines provide ample connectivity for gate drivers, relays and communication transceivers.
Design consideration: the VQFN exposed pad must be soldered to a grounded copper pour for thermal dissipation and signal integrity; plan the 3.3V regulator with at least 100 mA of headroom for core and I/O current during flash writes.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, following the ECDM data authenticity policy with values verified against Microchip and distributor listings as of 2026-09-27.
Drop-in-Alternativen für DSPIC33FJ64GP706A-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33FJ64GP706A-I/MR (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Core, RoHS Status, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33FJ128GP706A-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ256GP706A-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ64GP706-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ64GP706AT-I/MR
✅ Drop-In✓ Auf Lager
$5 / Stück
Datenblatt ansehen →DSPIC33FJ32GP706A-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ64GP706A-I/MR Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33F 16-bit |
| Max MIPS | 40 MIPS |
| Max Clock Frequency | 40 MHz |
| Program Memory (FLASH) | 64 KB (64K x 8) |
| RAM | 16 KB (16K x 8) |
| Supply Voltage Range | 3 V to 3.6 V |
| I/O Lines | 53 |
| Gehäuse | 64-VQFN (9x9 mm) |
| Terminal Pitch | 0.5 mm |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (industrial, -I suffix) |
| Technology | CMOS |
| Barrel Shifter | Yes |
| Boundary Scan (JTAG) | Supported |
| Series | dsPIC 33F, GP (General Purpose) |
| Datenbusbreite | 16 bit |
DSPIC33FJ64GP706A-I/MR 64-vqfn (9x9 mm) Pinbelegungsleitfaden
Pinbelegung für DSPIC33FJ64GP706A-I/MR (64-vqfn (9x9 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33FJ64GP706A-I/MR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33FJ64GP706A-I/MR ist geeignet für 6 Anwendungs: Digital Power Supplies, Motor Control Drives, Solar Inverters and Energy Conversion, Industrial Sensing and Data Acquisition Nodes, Audio Signal Processing, Medical and Portable Instrumentation.
Digital Power Supplies
The DSPIC33FJ64GP706A-I/MR fits switch-mode power supply control because its 40 MIPS dsPIC33F core executes PID and predictive control loops with deterministic interrupt latency, while the GP-family ADC pipeline samples voltage and current feedback synchronously with the PWM period. In a typical topology, the DSC closes the voltage loop on a forward or LLC converter, updating duty cycle every switching cycle from internal FLASH-resident firmware, so compensation law changes require no hardware redesign. The 16KB RAM holds state variables and look-up tables for nonlinear gain scheduling. Because control runs in fixed-point with the hardware barrel shifter, loop overhead stays low even with housekeeping tasks on the same chip, replacing an analog compensator plus a supervisory MCU with a single 3.3V device in a 9x9 mm VQFN.
Empfohlen
Motor Control Drives
For BLDC and PMSM drives, the DSPIC33FJ64GP706A-I/MR provides field-oriented control at 40 MIPS: Clark and Park transforms, PI current loops and SVPWM generation all execute in 16-bit fixed-point with cycle-level determinism. The 53 I/O lines drive a three-phase inverter gate-driver interface while simultaneously handling encoder or Hall sensor feedback, UART-based supervisory communication and fault shutdown. The A-revision silicon corrects family errata relevant to PWM peripheral timing, improving edge accuracy versus the original non-A stepping. The 64-VQFN 9x9 mm package suits compact drive boards in appliances, pumps and industrial actuators where the -40C to +85C industrial rating and 3V-3.6V single supply simplify the power tree. Firmware headroom in 64KB FLASH accommodates sensorless observer algorithms alongside the control loop.
Empfohlen
Solar Inverters and Energy Conversion
Grid-tied microinverter and DC-DC optimizer stages benefit from the DSPIC33FJ64GP706A-I/MR's combination of 40 MIPS control throughput and mixed MCU/DSP peripheral set. One device can run maximum-power-point-tracking algorithms, synchronize output current to the grid via zero-crossing detection, and manage protection states, replacing separate MPPT and supervision controllers. The 16KB (16K x 8) RAM stores historical power samples used by perturb-and-observe or incremental-conductance MPPT routines, while hardware multiply-accumulate accelerates the transform math for current shaping. The industrial -40C to +85C rating covers rooftop and outdoor enclosure temperatures, and boundary-scan support eases production test of the densely packed 0.5 mm pitch 64-VQFN assembly. Firmware in 64KB FLASH leaves room for grid-code update tables.
Empfohlen
Industrial Sensing and Data Acquisition Nodes
Factory sensing nodes use the DSPIC33FJ64GP706A-I/MR to acquire, filter and pre-process analog signals before transmission. The GP-family ADC converts sensor inputs while the 40 MIPS core applies FIR/IIR filters using the DSP engine's multiply-accumulate and barrel shifter, reducing bandwidth demands on the network. UART, SPI and I2C ports connect the node to RS-485/CAN transceivers and external memory, and the 53 I/O lines drive status outputs, relays and local HMI. The 3V to 3.6V operation matches standard 3.3V industrial rails, and the -I temperature rating suits unconditioned factory floors. Boundary-scan support via the 64-VQFN package enables in-circuit test of the finished assembly, shortening production bring-up and reducing bed-of-nails fixture cost for high-mix industrial products.
Empfohlen
Audio Signal Processing
The DSPIC33F general-purpose family serves cost-sensitive audio products such as active speakers, effects units and intercom systems: the 40 MIPS fixed-point core executes biquad filters, compressors and echo cancellation at sample rates up to tens of kilohertz with comfortable margin. The multiply-accumulate DSP engine and barrel shifter keep per-sample processing deterministic, and 64KB FLASH stores coefficient tables plus the full application stack. Audio data flows through SPI in slave mode to a codec, while the 3V-3.6V single supply lets the design share one rail with the analog front end. The 64-VQFN 9x9 mm footprint fits compact consumer enclosures, and the -40C to +85C range covers automotive-adjacent and outdoor audio products. Development uses free MPLAB X and XC16 with the dsPIC DSP library for filter design.
Empfohlen
Medical and Portable Instrumentation
Battery-powered and benchtop medical instruments - portable vital-sign monitors, infusion interfaces and diagnostic sensor pods - use the DSPIC33FJ64GP706A-I/MR where a single 3.3V controller must handle signal conditioning math and user interface. The 40 MIPS core performs baseline wander removal and spike detection on physiologic signals with fixed-point filters, and the 16KB RAM buffers waveform segments for display or transmission. Low peripheral integration overhead means fewer external ICs, supporting compact, isolated front-end boards; the 64-VQFN 9x9 mm package with 0.5 mm pitch suits dense multi-layer layouts. Industrial -40C to +85C operation covers autoclave-adjacent storage and shipping extremes. Boundary-scan support accelerates manufacturing test, which is valuable in regulated production environments requiring documented process verification for every assembled unit.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33FJ64GP706A-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33FJ128GP706A-I/MR | DSPIC33FJ256GP706A-I/MR | DSPIC33FJ64GP706-I/MR | DSPIC33FJ32GP706A-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS |
| FLASH Program Memory | 64 KB | 128 KB | 256 KB | 64 KB | 32 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Silicon Stepping | A revision | A revision | A revision | Original (non-A) | A revision |
Wichtigste Unterscheidungsmerkmale
- Lowest-cost entry to the 64-pin GP706A family (vs. DSPIC33FJ128GP706A-I/MR)
- A-revision silicon with corrected errata (vs. DSPIC33FJ64GP706-I/MR)
- Balanced memory configuration (vs. DSPIC33FJ32GP706A-I/MR)
- Full DSP engine on an MCU peripheral set (vs. DSPIC33FJ256GP706A-I/MR)
Designhinweise
The 64-VQFN 9x9 mm package has a 0.5 mm terminal pitch and a central exposed thermal pad. Connect the exposed pad to a solid ground pour with an array of thermal vias (approximately 4x4, 0.3 mm drill) to improve heat spreading and reduce ground bounce across the 53 I/O lines. Fan out high-current port pins first, then route the crystal and oscillator traces short and shielded with adjacent ground. For rework, the A-revision errata document from Microchip should be checked before final layout lock.
Supply the device from a clean 3.3V rail within the 3V-3.6V window. Estimated: at 40 MIPS with all peripherals active, core plus I/O current typically reaches tens of mA per Microchip family guidance, so size the regulator with at least 100-150 mA headroom plus flash-write surge margin. Place 0.1 uF ceramic decoupling at each VDD/VSS pair, plus 4.7-10 uF bulk near the part. Do not share the analog supply filter with noisy PWM-driven loads; use an RC or ferrite isolation for the analog rail.
Do not confuse the /MR (VQFN) and /PT (TQFP) suffixes: they are the same die but different footprints, so a PCB designed for VQFN cannot accept the TQFP part. Also confirm you are buying the A-revision (706A) - the non-A 706 has documented family errata that may affect PWM and ADC behavior in digital-control applications. Finally, program PGC/PGD pins must remain accessible on test points; burying them under a connector makes ICSP debug with PICkit/ICD/REAL ICE impossible after assembly.
At 40 MHz operation, keep clock and PWM output traces under roughly 10 cm or add series termination (22-33 ohm) to control ringing into long gate-driver harnesses. Use boundary-scan during production test to verify connectivity of the 0.5 mm pitch BGA-style pads that cannot be probed directly. Route UART, SPI and I2C away from PWM return paths to prevent coupling of switching noise into serial links used for supervisory communication.
Compliance-Informationen
Compliance data was not present in the verified web data for this MPN. Confirm RoHS/REACH status on the official Microchip product page or the MicrochipUSA listing before procurement.
