EFM32TG108F8-D-QFN24 - 32MHz Cortex-M3 MCU | Silicon Labs
Teilenummer: EFM32TG108F8-D-QFN24 ✓ AktivEFM32TG108F8-D-QFN24 Übersicht
A microcontroller is a programmable semiconductor that integrates a processor core, memory, I/O ports, timers, and communication peripherals on one device. The EFM32TG108 belongs to the Tiny Gecko family, a subcategory of 32-bit ARM Cortex-M3 microcontrollers within the broader embedded processor and semiconductor hierarchy. Its low-power platform is intended to reduce energy consumption when the system must operate for long periods with limited available power.
The EFM32TG108F8-D-QFN24 combines a 32 MHz ARM Cortex-M3 core with 8 kB of Flash and 2 kB of RAM. Verified manufacturer and distributor information identifies 17 digital I/O pins and two 16-bit timers. Its 24-QFN package measures 5x5 mm, making it suitable for compact PCB layouts where a reduced footprint is important. The device also supports hardware debugging through a two-pin serial-wire debug interface and includes a one-wire Serial Wire Viewer connection.
Silicon Labs positions the Tiny Gecko family around energy efficiency without giving up a 32-bit processor or a broad set of integrated peripherals. The part can operate from a 1.98 V to 3.8 V supply, which allows placement in low-voltage embedded systems. Its microcontroller architecture supports conventional low-power modes, short wake-up times, and energy-saving operation for applications that spend substantial time idle.
Typical uses for the EFM32TG108F8-D-QFN24 include battery-powered sensors, compact industrial monitoring nodes, wearable accessories, low-power connected devices, energy-harvesting equipment, and embedded control modules. The 32 MHz Cortex-M3 core is suitable for responsive control logic, while the low-power platform is valuable where average power consumption matters more than sustained processing throughput.
Designers should confirm the complete peripheral mapping, exposed-pad connection, and decoupling requirements against the manufacturer datasheet before layout release. The QFN thermal pad must be connected according to the recommended land pattern and thermal strategy, while debug access and programming-test points should be considered early in the PCB design.
This page consolidates manufacturer specifications, distributor availability information, same-family drop-in candidates, package-level comparison data, and practical design guidance. It adds engineering context beyond a basic parameter list so engineers can assess memory fit, power architecture, pin compatibility, and sourcing trade-offs before selecting a microcontroller.
Drop-in-Alternativen für EFM32TG108F8-D-QFN24 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EFM32TG108F8-D-QFN24 (gleiche Bauform und Footprint) – abweichend in Package, Core, Digital I/O Pins, Timers, Flash Memory.
EFM32TG108F32-D-QFN24
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EFM32TG110F8-QFN24
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →EFM32ZG108F8-QFN24
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →EFM32HG108F32-C-QFN24
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EFM32TG108F8-QFN24
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →EFM32TG108F8-D-QFN24 Grenzwerte & elektrische Eigenschaften
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Maximum CPU Frequency | 32 MHz |
| Flash Memory | 8 kB (8K x 8) |
| RAM | 2 kB |
| Digital I/O Pins | 17 pins |
| Timers | 2 x 16-bit timers |
| Supply Voltage Range | 1.98 V to 3.8 V |
| Gehäuse | 24-QFN, 5x5 mm |
| Montageart | Surface mount |
| Core | ARM Cortex-M3, 32-bit |
| Series | EFM32 Tiny Gecko |
| Debug Interface | 2-pin serial-wire debug |
| Serial Wire Viewer | 1-wire interface |
| Betriebstemperatur | -40 C to +85 C |
| Package Finish | Nickel-palladium-gold preplated leadframe |
| RoHS-Status | Compliant |
| Bromine Content | Free of bromine (Br) |
| Antimony Content | Free of antimony (Sb) |
EFM32TG108F8-D-QFN24 nickel-palladium-gold preplated leadframe Pinbelegungsleitfaden
Pinbelegung für EFM32TG108F8-D-QFN24 (nickel-palladium-gold preplated leadframe-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EFM32TG108F8-D-QFN24.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EFM32TG108F8-D-QFN24 ist geeignet für 6 Anwendungs: Battery-Powered Sensor Nodes, Industrial Condition Monitoring, Low-Power Wearable Accessories, Energy-Harvesting Equipment, Compact Data-Acquisition Modules, Low-Power Connected Controls.
Battery-Powered Sensor Nodes
The EFM32TG108F8-D-QFN24 is well suited to compact battery-powered sensor nodes because it combines a 32 MHz ARM Cortex-M3 core with low-power operating modes and fast wake-up behavior. Its 17 digital I/O pins can support sensor enables, digital status signals, and control outputs, while the two 16-bit timers provide timing functions for sampling or periodic measurements. The 1.98 V to 3.8 V operating range supports low-voltage designs. Designers should keep firmware within the available 8 kB Flash and 2 kB RAM or select EFM32TG108F32-D-QFN24 when code growth requires 32 kB Flash and 4 kB RAM.
Empfohlen
Industrial Condition Monitoring
The EFM32TG108F8-D-QFN24 can serve as the local controller in an industrial condition-monitoring module that combines digital sensors, status indicators, and periodic data processing. Its 32 MHz Cortex-M3 core provides responsive control and filtering, while 17 digital I/O pins reduce the need for external GPIO expansion in compact designs. The -40 C to +85 C operating-temperature specification supports equipment across industrial environments. The 8 kB Flash and 2 kB RAM may be sufficient for lightweight monitoring logic, but protocols, event logs, and firmware updates must be included in the memory budget.
Empfohlen
Low-Power Wearable Accessories
The EFM32TG108F8-D-QFN24 is appropriate for low-power wearable accessories where limited board area and battery endurance are primary constraints. Its 24-QFN package occupies a 5x5 mm footprint, and the low-power Tiny Gecko platform supports energy-saving operation and rapid wake-up behavior. The two 16-bit timers can support touch timing, gesture intervals, or periodic activity tracking, while 17 GPIO pins provide configurable control and sensing connections. Firmware size must remain within 8 kB Flash and 2 kB RAM, making the EFM32TG108F32-D-QFN24 useful when application code or wireless-control logic exceeds the base allocation.
Empfohlen
Energy-Harvesting Equipment
The EFM32TG108F8-D-QFN24 fits energy-harvesting equipment where available power is intermittent and the controller must spend substantial time in a low-energy state. Silicon Labs describes the Tiny Gecko family around low-power techniques and fast wake-up times, allowing the Cortex-M3 core to remain responsive without continuous high-power operation. The target's 1.98 V to 3.8 V supply range and compact 24-QFN package are useful in harvested-energy systems. System-level energy calculations must include the MCU, sensors, regulator losses, and wake-up frequency; the 8 kB Flash and 2 kB RAM constrain firmware complexity.
Empfohlen
Compact Data-Acquisition Modules
The EFM32TG108F8-D-QFN24 can act as the control and timing element in a compact data-acquisition module. Its 32 MHz ARM Cortex-M3 core handles sampling coordination and short processing tasks, while the two 16-bit timers support accurate trigger intervals and measurement windows. Seventeen digital I/O pins can expose triggers, ready signals, and control lines without requiring a larger package. The device's 1.98 V to 3.8 V operating range allows integration with compatible low-voltage analog circuitry. Engineering validation should include analog grounding, reference stability, acquisition timing, and whether 8 kB Flash is adequate for the sampling and buffering software.
Empfohlen
Low-Power Connected Controls
The EFM32TG108F8-D-QFN24 can be used in compact connected-control products that alternate between low-power standby and short periods of processing. Its 32 MHz Cortex-M3 core is sufficient for local control, status handling, and protocol state management, while fast wake-up behavior supports responsive user or remote commands. The 17 digital I/O pins allow connection to relays, indicators, and local controls. Since the target includes 8 kB Flash and 2 kB RAM, a connected stack may exceed the available memory; the EFM32TG108F32-D-QFN24 provides 32 kB Flash and 4 kB RAM while retaining the same verified package and core class.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EFM32TG108F8-D-QFN24 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EFM32TG108F32-D-QFN24 | EFM32TG110F8-QFN24 | EFM32ZG108F8-QFN24 | EFM32HG108F32-C-QFN24 | EFM32TG108F8-QFN24 |
|---|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 24-QFN (5x5) | 24-QFN (5x5) - same | 24-QFN (5x5) - same | 24-QFN (5x5) - same | 24-QFN (5x5) - same | 24-QFN (5x5) - same |
| Flash Memory | 8 kB | 32 kB | 8 kB | 8 kB | 32 kB | 8 kB |
Wichtigste Unterscheidungsmerkmale
- Smaller Flash allocation for tightly constrained control firmware (vs. EFM32TG108F32-D-QFN24)
- Lower RAM requirement for compact embedded designs (vs. EFM32TG108F32-D-QFN24)
- Matches the standard 17-GPIO configuration of the verified F32 family option (vs. EFM32TG108F32-D-QFN24)
Designhinweise
Use the manufacturer QFN24 land pattern and connect the exposed thermal pad according to the EFM32TG108 datasheet. Place the required input and output decoupling capacitors as close as practical to their designated pins, with short, symmetrical return paths. The device operates from 1.98 V to 3.8 V, so rail routing and ground-plane continuity should be designed to limit disturbance to sensitive measurements. Confirm exposed-pad solderability and the final assembly process before PCB release.
The 8 kB Flash and 2 kB RAM allocation must be treated as a hard design constraint rather than a starting estimate. Include the bootloader, interrupt handlers, protocol stack, diagnostics, and update margin in the memory budget. If the estimate approaches either limit, use EFM32TG108F32-D-QFN24, which provides 32 kB Flash and 4 kB RAM in the same 24-QFN class. Verify current consumption in every relevant operating mode because sleep savings can be offset by wake-up peripherals and external circuitry.
Provide unobstructed access to the two-pin serial-wire debug interface and account for the one-wire Serial Wire Viewer connection during layout and test planning. Keep debug traces short, properly referenced, and away from noisy switching nodes where practical. Test pads should remain accessible after assembly. Although the QFN body is only 5x5 mm, the exposed pad, lead pitches, and manufacturing tolerances make careful paste and stencil design more reliable than a purely visual footprint check.
Do not select a candidate solely because it has the same QFN24 outline. The EFM32TG108F32, EFM32TG110, EFM32ZG108, and EFM32HG108 variants can differ in memory, peripherals, voltage limits, temperature grade, and GPIO behavior. Before substitution, compare the complete pin table, alternate-function mapping, clock tree, power pins, debug interface, exposed pad, and device revision. The supplied data confirms shared package families but does not provide every peripheral-level comparison.
Compliance-Informationen
The manufacturer EFM32TG108 datasheet states that EFM32 packages are RoHS compliant and free of bromine and antimony. The QFN24 package uses a nickel-palladium-gold preplated leadframe. No verified REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 statement was supplied for this exact orderable part.
